Abstract: A package includes a substrate having a conductive layer, and the conductive layer comprises an exposed portion. A die stack is disposed over the substrate and electrically connected to the conductive layer. A high thermal conductivity material is disposed over the substrate and contacting the exposed portion of the conductive layer. The package further includes a contour ring over and contacting the high thermal conductivity material.

Abstract: Disclosed is a backlight unit. The disclosed backlight unit comprises: a light guide plate; and a light source module configured to emit light to a light incident surface formed on at least one side of the light guide plate, wherein the light source module comprises: a printed circuit board; and a connector connected to multiple light sources arranged on the printed circuit board and to the printed circuit board, so as to transfer electric power thereto, and the connector may comprise a gap-retaining member arranged between the printed circuit board and the light guide plate, so that the light sources and the light incident surface are spaced apart from each other by a predetermined optical distance.