Abstract: A electrically heated soldering iron for applying heat to a wide variety of miniaturized integrated circuit solder pin row arrangements includes an elongated handle carrying at one end a heating block provided with a pair of tangs between which is seated an elongated soldering blade having a sharp, knife-like operative edge. One of the tangs is removably bolted to the heating block and has a sloped shoulder mating with a cooperating surface on block to permit the tang to move relative to the other tang to accommodate blades of slightly different dimensions while still allowing the removable tang to exert compressive force on the blade as the bolt is tightened. The operative edge of the blade is disposed in the same plane as the handle at an angle of about 135.degree. with the longitudinal handle axis.