Patents by Inventor Kimihide Kitamura

Kimihide Kitamura has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Wired circuit board and producing method thereof
    Patent number: 8853551
    Abstract: A wired circuit board includes an insulating layer, and a first conductive pattern and a second conductive pattern formed on the insulating layer. The first conductive pattern includes a first outer terminal on which a metal plating layer is provided, a first inner terminal to be solder connected, and a first wire which connects the first outer terminal and the first inner terminal. The second conductive pattern includes a second outer terminal to be solder connected, a second inner terminal to be solder connected, and a second wire which connects the second outer terminal and the second inner terminal. The first inner terminal and the second inner terminal are arranged in opposed relation with each other so as to be solder connected to the common electric component and preflux processing is performed thereon, and a metal plating layer is provided on the second wire.
    Type: Grant
    Filed: May 12, 2011
    Date of Patent: October 7, 2014
    Assignee: Nitto Denko Corporation
    Inventors: Katsutoshi Kamei, Yuu Sugimoto, Kimihide Kitamura
  • Wired circuit board and producing method thereof
    Publication number: 20110284274
    Abstract: A wired circuit board includes an insulating layer, and a first conductive pattern and a second conductive pattern formed on the insulating layer. The first conductive pattern includes a first outer terminal on which a metal plating layer is provided, a first inner terminal to be solder connected, and a first wire which connects the first outer terminal and the first inner terminal. The second conductive pattern includes a second outer terminal to be solder connected, a second inner terminal to be solder connected, and a second wire which connects the second outer terminal and the second inner terminal. The first inner terminal and the second inner terminal are arranged in opposed relation with each other so as to be solder connected to the common electric component and preflux processing is performed thereon, and a metal plating layer is provided on the second wire.
    Type: Application
    Filed: May 12, 2011
    Publication date: November 24, 2011
    Applicant: Nitto Denko Corporation
    Inventors: Katsutoshi Kamei, Yuu Sugimoto, Kimihide Kitamura