Abstract: A power module substrate according to the present invention is a power module substrate in which a copper sheet made of copper or a copper alloy is laminated and bonded onto a surface of a ceramic substrate (11), an oxide layer (31) is formed on the surface of the ceramic substrate (11) between the copper sheet and the ceramic substrate (11), and the thickness of a Ag—Cu eutectic structure layer (32) is set to 15 ?m or less.

Abstract: A joined body manufacturing method includes: a laminating step for forming a laminated body in which either a copper circuit substrate (first member) or a ceramic substrate (second member) is coated beforehand with a temporary fixing material the main ingredient of which is a saturated fatty acid, the copper circuit substrate and the ceramic substrate are stacked and positioned by the temporary fixing material which has been melted, and by cooling the temporary fixing material the stacked copper substrate and ceramic substrate are temporarily fixed; and a joining step for forming a joined body in which the copper circuit substrate and the ceramic substrate are joined by heating with pressurizing the laminated body in the stacking direction.

Abstract: This power module substrate includes a copper plate that is formed of copper or a copper alloy and is laminated on a surface of a ceramic substrate 11; a nitride layer 31 that is formed on the surface of the ceramic substrate 11 between the copper plate and the ceramic substrate 11; and an Ag—Cu eutectic structure layer 32 having a thickness of 15 ?m or less that is formed between the nitride layer and the copper plate.

Abstract: A joined body manufacturing method includes: a laminating step for forming a laminated body in which either a copper circuit substrate (first member) or a ceramic substrate (second member) is coated beforehand with a temporary fixing material the main ingredient of which is a saturated fatty acid, the copper circuit substrate and the ceramic substrate are stacked and positioned by the temporary fixing material which has been melted, and by cooling the temporary fixing material the stacked copper substrate and ceramic substrate are temporarily fixed; and a joining step for forming a joined body in which the copper circuit substrate and the ceramic substrate are joined by heating with pressurizing the laminated body in the stacking direction.

Abstract: A method of manufacturing power-module substrates, after bonding copper-circuit plates 30 at intervals on a ceramic plate 21 having an area in which ceramic substrates can be formed abreast, by dividing the ceramic plate 21 between the copper-circuit plates 30, in which: bonding-material layers 71 of active-metal brazing material having same shapes as outer shapes of the copper-circuit plates 30 are formed on the ceramic plate 21; temporal-stick material 72 including polyethylene glycol as a major ingredient is spread on the copper-circuit plates 30, the bonding-material layers 71 and the copper-circuit plates 30 are temporarily fixed on the ceramic plate 21 in a state of laminating with positioning by the temporal-stick material 72; and a laminated assembly thereof is pressurized in a laminating direction and heated, so that the ceramic plate and the copper-circuit plates are bonded.

Abstract: This power module substrate includes a copper plate that is formed of copper or a copper alloy and is laminated on a surface of a ceramic substrate 11; a nitride layer 31 that is formed on the surface of the ceramic substrate 11 between the copper plate and the ceramic substrate 11; and an Ag—Cu eutectic structure layer 32 having a thickness of 15 ?m or less that is formed between the nitride layer and the copper plate.

Abstract: This power module substrate includes a copper plate that is formed of copper or a copper alloy and is laminated on a surface of a ceramic substrate 11; a nitride layer 31 that is formed on the surface of the ceramic substrate 11 between the copper plate and the ceramic substrate 11; and an Ag—Cu eutectic structure layer 32 having a thickness of 15 ?m or less that is formed between the nitride layer and the copper plate.

Abstract: There are provided a solder joint structure, a power module using the joint structure, a power module substrate with a heat sink and a method of manufacturing the same, as well as a solder base layer forming paste which is disposed and fired on a metal member to thereby react with an oxide film generated on the surface of the metal member and form the solder base layer on the metal member, capable of suppressing the occurrence of waviness and wrinkles on the surface of the metal member even at the time of loading the power cycle and heat cycle and improving the joint reliability with a joint member.

Abstract: A method of manufacturing power-module substrates, after bonding copper-circuit plates 30 at intervals on a ceramic plate 21 having an area in which ceramic substrates can be formed abreast, by dividing the ceramic plate 21 between the copper-circuit plates 30, in which: bonding-material layers 71 of active-metal brazing material having same shapes as outer shapes of the copper-circuit plates 30 are formed on the ceramic plate 21; temporal-stick material 72 including polyethylene glycol as a major ingredient is spread on the copper-circuit plates 30, the bonding-material layers 71 and the copper-circuit plates 30 are temporarily fixed on the ceramic plate 21 in a state of laminating with positioning by the temporal-stick material 72; and a laminated assembly thereof is pressurized in a laminating direction and heated, so that the ceramic plate and the copper-circuit plates are bonded.

Abstract: A power module substrate according to the present invention is a power module substrate in which a copper sheet made of copper or a copper alloy is laminated and bonded onto a surface of a ceramic substrate (11), an oxide layer (31) is formed on the surface of the ceramic substrate (11) between the copper sheet and the ceramic substrate (11), and the thickness of a Ag—Cu eutectic structure layer (32) is set to 15 ?m or less.

Abstract: This power module substrate includes a copper plate that is formed of copper or a copper alloy and is laminated on a surface of a ceramic substrate 11; a nitride layer 31 that is formed on the surface of the ceramic substrate 11 between the copper plate and the ceramic substrate 11; and an Ag—Cu eutectic structure layer 32 having a thickness of 15 ?m or less that is formed between the nitride layer and the copper plate.

Abstract: There are provided a solder joint structure, a power module using the joint structure, a power module substrate with a heat sink and a method of manufacturing the same, as well as a solder base layer forming paste which is disposed and fired on a metal member to thereby react with an oxide film generated on the surface of the metal member and form the solder base layer on the metal member, capable of suppressing the occurrence of waviness and wrinkles on the surface of the metal member even at the time of loading the power cycle and heat cycle and improving the joint reliability with a joint member.

Abstract: In a power module substrate, a circuit layer is formed on one surface of an insulating layer, a metal layer is formed on the other surface of the insulating layer, and a body to be bonded can be bonded to the other surface of the metal layer using a flux. A flux component intrusion-preventing layer containing an oxide and a resin is formed at a circumferential edge section of a bonding interface between the insulating layer and the metal layer.