Patents by Inventor Kimin Hong

Kimin Hong has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Electroplating bath composition and method of using
    Patent number: 6893550
    Abstract: The present invention relates to a copper electroplating bath composition and method of using it for microelectronic device fabrication. In particular, the present invention relates to copper electroplating in the fabrication of interconnect structures in semiconductor devices. By use of the inventive copper electroplating bath composition, the incidence of voids in the interconnect structures is reduced.
    Type: Grant
    Filed: October 3, 2001
    Date of Patent: May 17, 2005
    Assignee: Intel Corporation
    Inventors: Valery Dubin, Kimin Hong, Nate Baxter
  • Electroplating bath composition and method of using
    Publication number: 20050014014
    Abstract: The present invention relates to a copper electroplating bath composition and method of using it for microelectronic device fabrication. In particular, the present invention relates to copper electroplating in the fabrication of interconnect structures in semiconductor devices. By use of the inventive copper electroplating bath composition, the incidence of voids in the interconnect structures is reduced.
    Type: Application
    Filed: August 12, 2004
    Publication date: January 20, 2005
    Inventors: Valery Dubin, Kimin Hong, Nate Baxter
  • Electroplating bath composition
    Patent number: 6491806
    Abstract: The present invention relates to a copper electroplating bath composition and method of using it for microelectronic device fabrication. In particular, the present invention relates to copper electroplating in the fabrication of interconnect structures in semiconductor devices. By use of the inventive copper electroplating bath composition, the incidence of voids in the interconnect structures is reduced.
    Type: Grant
    Filed: April 27, 2000
    Date of Patent: December 10, 2002
    Assignee: Intel Corporation
    Inventors: Valery Dubin, Kimin Hong, Nate Baxter
  • Electroplating bath composition and method of using
    Publication number: 20020036145
    Abstract: The present invention relates to a copper electroplating bath composition and method of using it for microelectronic device fabrication. In particular, the present invention relates to copper electroplating in the fabrication of interconnect structures in semiconductor devices. By use of the inventive copper electroplating bath composition, the incidence of voids in the interconnect structures is reduced.
    Type: Application
    Filed: October 3, 2001
    Publication date: March 28, 2002
    Inventors: Valery Dubin, Kimin Hong, Nate Baxter