Patents by Inventor Kimio Koda

Kimio Koda has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11629891
    Abstract: The present disclosure relates to a heat pump system comprising an outdoor unit disposed in an outdoor space, a plurality of thermal load units supplied with cool air and hot air, and an intermediate unit disposed between the outdoor unit and the plurality of thermal load units, wherein the intermediate unit is connected to the outdoor unit through refrigerant pipes and connected to the plurality of thermal load units through thermal medium pipes.
    Type: Grant
    Filed: February 2, 2018
    Date of Patent: April 18, 2023
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Masaki Saito, Takeshi Takahara, Kimio Koda, Kazushige Tajima
  • Patent number: 10634394
    Abstract: A heat exchange apparatus includes a first heat exchanger configured to transfer heat between a refrigerant and another medium, a plurality of second heat exchangers configured to transfer heat between the refrigerant and the liquid, a compressor configured to pressurize the refrigerant and a plurality of expansion devices for each of the plurality of second heat exchangers and configured to expand the refrigerant pressurized by the compressor, wherein the refrigerant flows through the plurality of second heat exchangers in parallel, and the liquid flows through the plurality of second heat exchangers in series.
    Type: Grant
    Filed: September 7, 2016
    Date of Patent: April 28, 2020
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Nobukazu Shimodahira, Kimio Koda, Hongzhi Sun, Kazushige Tajima, Takahiro Akizuki
  • Publication number: 20190346189
    Abstract: The present disclosure relates to a heat pump system comprising an outdoor unit disposed in an outdoor space, a plurality of thermal load units supplied with cool air and hot air, and an intermediate unit disposed between the outdoor unit and the plurality of thermal load units, wherein the intermediate unit is connected to the outdoor unit through refrigerant pipes and connected to the plurality of thermal load units through thermal medium pipes.
    Type: Application
    Filed: February 2, 2018
    Publication date: November 14, 2019
    Inventors: Masaki SAITO, Takeshi TAKAHARA, Kimio KODA, Kazushige TAJIMA
  • Publication number: 20170176057
    Abstract: A heat exchange apparatus includes a first heat exchanger configured to transfer heat between a refrigerant and another medium, a plurality of second heat exchangers configured to transfer heat between the refrigerant and the liquid, a compressor configured to pressurize the refrigerant and a plurality of expansion devices for each of the plurality of second heat exchangers and configured to expand the refrigerant pressurized by the compressor, wherein the refrigerant flows through the plurality of second heat exchangers in parallel, and the liquid flows through the plurality of second heat exchangers in series.
    Type: Application
    Filed: September 7, 2016
    Publication date: June 22, 2017
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Nobukazu Shimodahira, Kimio Koda, Hongzhi Sun, Kazushige Tajima, Takahiro Akizuki