Patents by Inventor Kimio Muramatsu

Kimio Muramatsu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6628817
    Abstract: The present invention provides data analysis stations respectively for a probing tester and an automatic particle inspection machine. And, in the data analysis station, the coordinates on which the disposition of the chips are described on a product basis are equal to those on which the locations of the defects are described. Further, the station provides a function of determining which of the chips each defect belongs to. These data analysis stations are connected through a communication line. The present invention is capable of analyzing the data on a chip basis, resulting in being able to grasp the relation between how the defects are caused on each chip and the product character of the chip.
    Type: Grant
    Filed: January 3, 2001
    Date of Patent: September 30, 2003
    Assignee: Hitachi, Ltd.
    Inventors: Seiji Ishikawa, Masao Sakata, Jun Nakazato, Sadao Shimoyashiro, Hiroto Nagatomo, Yuzo Taniguchi, Osamu Satou, Tsutomu Okabe, Yuzaburo Sakamoto, Kimio Muramatsu, Kazuhiko Matsuoka, Taizo Hashimoto, Yuichi Ohyama, Yutaka Ebara, Isao Miyazaki, Shuichi Hanashima
  • Patent number: 6529619
    Abstract: The present invention provides data analysis stations respectively for a probing tester and an automatic particle inspection machine. And in the data analysis station, the coordinates on which the disposition of the chips are described on a product basis are equal to those on which the locations of the defects are described. Further, the station provides a function of determining which of the chips each defect belongs to. These data analysis stations are connected through a communication line. The present invention is capable of analyzing the data on a chip basis, resulting in being able to grasp the relation between how the defects are caused on each chip and the product character of the chip.
    Type: Grant
    Filed: June 29, 2001
    Date of Patent: March 4, 2003
    Assignee: Hitachi, Ltd.
    Inventors: Seiji Ishikawa, Masao Sakata, Jun Nakazato, Sadao Shimoyashiro, Hiroto Nagatomo, Yuzo Taniguchi, Osamu Satou, Tsutomu Okabe, Yuzaburo Sakamoto, Kimio Muramatsu, Kazuhiko Matsuoka, Taizo Hashimoto, Yuichi Ohyama, Yutaka Ebara, Isao Miyazaki, Shuichi Hanashima
  • Publication number: 20020034326
    Abstract: The present invention provides data analysis stations respectively for a probing tester and an automatic particle inspection machine. And, in the data analysis station, the coordinates on which the disposition of the chips are described on a product basis are equal to those on which the locations of the defects are described. Further, the station provides a function of determining which of the chips each defect belongs to. These data analysis stations are connected through a communication line. The present invention is capable of analyzing the data on a chip basis, resulting in being able to grasp the relation between how the defects are caused on each chip and the product character of the chip.
    Type: Application
    Filed: October 30, 2001
    Publication date: March 21, 2002
    Inventors: Seiji Ishikawa, Masao Sakata, Jun Nakazato, Sadao Shimoyashiro, Hiroto Nagatomo, Yuzo Taniguchi, Osamu Satou, Tsutomu Okabe, Yuzaburo Sakamoto, Kimio Muramatsu, Kazuhiko Matsuoka, Taizo Hashimoto, Yuichi Ohyama, Yutaka Ebara, Isao Miyazaki, Shuichi Hanashima
  • Patent number: 6339653
    Abstract: The present invention provides data analysis stations respectively for a probing tester and an automatic particle inspection machine. And, in the data analysis station, the coordinates on which the disposition of the chips are described on a product basis are equal to those on which the locations of the defects are described. Further, the station provides a function of determining which of the chips each defect belongs to. These data analysis stations are connected through a communication line. The present invention is capable of analyzing the data on a chip basis, resulting in being able to grasp the relation between how the defects are caused on each chip and the product character of the chip.
    Type: Grant
    Filed: March 10, 2000
    Date of Patent: January 15, 2002
    Assignee: Hitachi, Ltd.
    Inventors: Seiji Ishikawa, Masao Sakata, Jun Nakazato, Sadao Shimoyashiro, Hiroto Nagatomo, Yuzo Taniguchi, Osamu Satou, Tsutomu Okabe, Yuzaburo Sakamoto, Kimio Muramatsu, Kazuhiko Matsuoka, Taizo Hashimoto, Yuichi Ohyama, Yutaka Ebara, Isao Miyazaki, Shuichi Hanashima
  • Patent number: 6330352
    Abstract: The present invention provides data analysis stations respectively for a probing tester and an automatic particle inspection machine. And, in the data analysis station, the coordinates on which the disposition of the chips are described on a product basis are equal to those on which the locations of the defects are described. Further, the station provides a function of determining which of the chips each defect belongs to. These data analysis stations are connected through a communication line. The present invention is capable of analyzing the data on a chip basis, resulting in being able to grasp the relation between how the defects are caused on each chip and the product character of the chip.
    Type: Grant
    Filed: March 15, 2000
    Date of Patent: December 11, 2001
    Assignee: Hitachi, Ltd.
    Inventors: Seiji Ishikawa, Masao Sakata, Jun Nakazato, Sadao Shimoyashiro, Hiroto Nagatomo, Yuzo Taniguchi, Osamu Satou, Tsutomu Okabe, Yuzaburo Sakamoto, Kimio Muramatsu, Kazuhiko Matsuoka, Taizo Hashimoto, Yuichi Ohyama, Yutaka Ebara, Isao Miyazaki, Shuichi Hanashima
  • Publication number: 20010038708
    Abstract: The present invention provides data analysis stations respectively for a probing tester and an automatic particle inspection machine. And, in the data analysis station, the coordinates on which the disposition of the chips are described on a product basis are equal to those on which the locations of the defects are described. Further, the station provides a function of determining which of the chips each defect belongs to. These data analysis stations are connected through a communication line. The present invention is capable of analyzing the data on a chip basis, resulting in being able to grasp the relation between how the defects are caused on each chip and the product character of the chip.
    Type: Application
    Filed: June 29, 2001
    Publication date: November 8, 2001
    Inventors: Seiji Ishikawa, Masao Sakata, Jun Nakazato, Sadao Shimoyashiro, Hiroto Nagatomo, Yuzo Taniguchi, Osamu Satou, Tsutomu Okabe, Yuzaburo Sakamoto, Kimio Muramatsu, Kazuhiko Matsuoka, Taizo Hashimoto, Yuichi Ohyama, Yutaka Ebara, Isao Miyazaki, Shuichi Hanashima
  • Publication number: 20010001015
    Abstract: The present invention provides data analysis stations respectively for a probing tester and an automatic particle inspection machine. And, in the data analysis station, the coordinates on which the disposition of the chips are described on a product basis are equal to those on which the locations of the defects are described. Further, the station provides a function of determining which of the chips each defect belongs to. These data analysis stations are connected through a communication line. The present invention is capable of analyzing the data on a chip basis, resulting in being able to grasp the relation between how the defects are caused on each chip and the product character of the chip.
    Type: Application
    Filed: January 3, 2001
    Publication date: May 10, 2001
    Inventors: Seiji Ishikawa, Masao Sakata, Jun Nakazato, Sadao Shimoyashiro, Hiroto Nagatomo, Yuzo Taniguchi, Osamu Satou, Tsutomu Okabe, Yuzaburo Sakamoto, Kimio Muramatsu, Kazuhiko Matsuoka, Taizo Hashimoto, Yuichi Ohyama, Yutaka Ebara, Isao Miyazaki, Shuichi Hanashima
  • Patent number: 6185322
    Abstract: The present invention provides data analysis stations respectively for a probing tester and an automatic particle inspection machine. And, in the data analysis station, the coordinates on which the disposition of the chips are described on a product basis are equal to those on which the locations of the defects are described. Further, the station provides a function of determining which of the chips each defect belongs to. These data analysis stations are connected through a communication line. The present invention is capable of analyzing the data on a chip basis, resulting in being able to grasp the relation between how the defects are caused on each chip and the product character of the chip.
    Type: Grant
    Filed: October 27, 1997
    Date of Patent: February 6, 2001
    Assignee: Hitachi, Ltd.
    Inventors: Seiji Ishikawa, Masao Sakata, Jun Nakazato, Sadao Shimoyashiro, Hiroto Nagatomo, Yuzo Taniguchi, Osamu Satou, Tsutomu Okabe, Yuzaburo Sakamoto, Kimio Muramatsu, Kazuhiko Matsuoka, Taizo Hashimoto, Yuichi Ohyama, Yutaka Ebara, Isao Miyazaki, Shuichi Hanashima
  • Patent number: 5971430
    Abstract: A pad for a steering wheel includes a membrane switch forming member and a cover member. The switch forming member includes a switch body and a support plate. The switch body has a plurality of conductive thin metal sheets and an insulating space interposed between the metal sheets. The support plate is made of rigid synthetic resin for supporting the switch body on its upper face and is formed in its outer peripheral edge with a plurality of mounting holes extending vertically. The cover member covers the air bag of an air bag device and is formed with a rupture portion adapted to be ruptured when the air bag is inflated, and mounting ribs projecting from the back face thereof and engaged with the mounting holes of the support plate. At least one of the outer peripheral edge of the support plate and the back face of the cover member is formed with gap regulating projections for setting a predetermined gap between the upper face of the support plate back face of the cover member.
    Type: Grant
    Filed: March 26, 1998
    Date of Patent: October 26, 1999
    Assignee: Toyoda Gosei Co., Ltd.
    Inventors: Minoru Niwa, Kimio Muramatsu, Makoto Kanai, Michio Inoue, Junichi Mizutani, Takanori Kantoh, Tadashi Yamamoto
  • Patent number: 5841893
    Abstract: The present invention provides data analysis stations respectively for a probing tester and an automatic particle inspection machine. And, in the data analysis station, the coordinates on which the disposition of the chips are described on a product basis are equal to those on which the locations of the defects are described. Further, the station provides a function of determining which of the chips each defect belongs to. These data analysis stations are connected through a communication line. The present invention is capable of analyzing the data on a chip basis, resulting in being able to grasp the relation between how the defects are caused on each chip and the product character of the chip.
    Type: Grant
    Filed: June 30, 1992
    Date of Patent: November 24, 1998
    Assignee: Hitachi, Ltd.
    Inventors: Seiji Ishikawa, Masao Sakata, Jun Nakazato, Sadao Shimoyashiro, Hiroto Nagatomo, Yuzo Taniguchi, Osamu Satou, Tsutomu Okabe, Yuzaburo Sakamoto, Kimio Muramatsu, Kazuhiko Matsuoka, Taizo Hashimoto, Yuichi Ohyama, Yutaka Ebara, Isao Miyazaki, Shuichi Hanashima
  • Patent number: 5775728
    Abstract: A pad for a steering wheel includes a membrane switch forming member and a cover member. The switch forming member includes a switch body and a support plate. The switch body has a plurality of conductive thin metal sheets and an insulating space interposed between the metal sheets. The support plate is made of rigid synthetic resin for supporting the switch body on its upper face and is formed in its outer peripheral edge with a plurality of mounting holes extending vertically. The cover member covers the air bag of an air bag device and is formed with a rupture portion adapted to be ruptured when the air bag is inflated, and mounting ribs projecting from the back face thereof and engaged with the mounting holes of the support plate. At least one of the outer peripheral edge of the support plate and the back face of the cover member is formed with gap regulating projections for setting a predetermined gap between the upper face of the support plate back face of the cover member.
    Type: Grant
    Filed: August 21, 1996
    Date of Patent: July 7, 1998
    Assignee: Toyoda Gosei Co., Ltd.
    Inventors: Minoru Niwa, Kimio Muramatsu, Makoto Kanai, Michio Inoue, Junichi Mizutani, Takanori Kantoh, Tadashi Yamamoto
  • Patent number: 5577766
    Abstract: A pad for a steering wheel includes a membrane switch forming member and a cover member. The switch forming member includes a switch body and a support plate. The switch body has a plurality of conductive thin metal sheets and an insulating space interposed between the metal sheets. The support plate is made of rigid synthetic resin for supporting the switch body on its upper face and is formed in its outer peripheral edge with a plurality of mounting holes extending vertically. The cover member covers the air bag of an air bag device and is formed with a rapture portion adapted to be ruptured when the air bag is inflated, and mounting ribs projecting from the back face thereof and engaged with the mounting holes of the support plate. At least one of the outer peripheral edge of the support plate and the back face of the cover member is formed with gap regulating projections for setting a predetermined gap between the upper face of the support plate back face of the cover member.
    Type: Grant
    Filed: March 23, 1994
    Date of Patent: November 26, 1996
    Assignee: Toyoda Gosei Co., Ltd.
    Inventors: Minoru Niwa, Kimio Muramatsu, Makoto Kanai, Michio Inoue, Junichi Mizutani, Takanori Kanich, Tadashi Yamamoto
  • Patent number: 5203586
    Abstract: A pad for an air bag device including an upper wall portion which has an openable portion which, upon expansion of the air bag, is separated from a side wall portion of the pad, leaving a hinge portion, and is angularly movable about that pivot axis so as to be openable. The openable portion is constituted by a net insert of a net-like configuration and a covering layer of a soft material covering the net insert. The net insert has a slit which is formed in one edge portion thereof remote from the hinge portion and extends toward the hinge portion. With this construction, even if part of the pad is curved, the net insert can be set in a corresponding injection mold without generating wrinkles in the net insert, and the molding can be performed in such a manner that the openable portion has a good appearance.
    Type: Grant
    Filed: August 5, 1991
    Date of Patent: April 20, 1993
    Assignee: Toyoda Gosei Co., Ltd.
    Inventors: Minoru Niwa, Shinichi Goto, Kimio Muramatsu
  • Patent number: 5062771
    Abstract: This invention concerns a production method and a processing apparatus for semiconductor devices, as well as an evacuating apparatus used for the processing apparatus. According to this invention, since the evacuation system of pressure-reduction processing apparatus for conducting various wafer processings during production steps of semiconductor devices is constituted only with oil-free vacuum pump, deleterious oil contaminations or carbonation products of oils produced from oils upon heating are not present in the pressure-reducing processing chamber as compared with conventional pressure-reducing processing apparatus using a vacuum oil pump as an evacuation pump and the production method of semiconductor devices using such apparatus.
    Type: Grant
    Filed: March 20, 1989
    Date of Patent: November 5, 1991
    Assignees: Hitachi, Ltd., Hitachi Tokyo Electronics Co. Ltd.
    Inventors: Akihiko Satou, Tadao Kusaka, Shigeo Tomiyama, Kouzi Aoki, Ichiro Gyobu, Kimio Muramatsu, Hiroaki Sakamoto, Shinjiroo Ueda, Masahiro Mase, Takashi Nagaoka
  • Patent number: 4904155
    Abstract: A vacuum pump with a heating portion for preventing adhesion of reaction products on a discharge side thereof.
    Type: Grant
    Filed: July 12, 1988
    Date of Patent: February 27, 1990
    Assignee: Hitachi, Ltd.
    Inventors: Takashi Nagaoka, Ichiro Gyobu, Kimio Muramatsu, Keiji Ueyama, Masahiro Mase, Yoshihisa Awada, Akira Nishiuchi
  • Patent number: 4893521
    Abstract: A steering wheel having an operating portion, a hub portion, a spoke portion, an impact energy absorbing member located on the hub portion for absorbing impact energy, and a pad including a hard insert and a soft cover member integrally covering the insert for covering at least an impact energy absorbing member and a spoke portion. The insert has a plurality of divided parts or a portion or portions of thin wall section to improve an impact energy absorbing effect of the impact energy absorbing member independently of the rigidity of the pad, without the deterioration of the pad.
    Type: Grant
    Filed: November 14, 1988
    Date of Patent: January 16, 1990
    Assignee: Toyoda Gosei Co., Ltd.
    Inventors: Syuichi Ishida, Shinichi Goto, Kimio Muramatsu
  • Patent number: 4835114
    Abstract: This invention concerns a production method and a processing apparatus for semiconductor devices, as well as an evacuating apparatus used for the processing apparatus. According to this invention, since the evacuation system of pressure-reduction processing apparatus for conducting various wafer processings during production steps of semi-conductor devices is constituted only with oil-free vacuum pump, deleterious oil contaminations or carbonation products of oils produced from oils upon heating are not present in the pressure-reducing processing chamber as compared with conventional pressure-reducing processing apparatus using a vacuum oil pump as an evacuation pump and the production method of semiconductor devices using such apparatus.
    Type: Grant
    Filed: February 19, 1987
    Date of Patent: May 30, 1989
    Assignees: Hitachi, Ltd., Hitachi Tokyo Electronics Co., Ltd.
    Inventors: Akihiko Satou, Tadao Kusaka, Shigeo Tomiyama, Kouzi Aoki, Ichiro Gyobu, Kimio Muramatsu, Hiroaki Sakamoto, Shinjiroo Ueda, Masahiro Mase, Takashi Nagaoka