Patents by Inventor Kimiwaka Ooizumi

Kimiwaka Ooizumi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method and apparatus for applying a wafer to a mount plate
    Patent number: 5602058
    Abstract: A method and apparatus are provided for applying a wafer to a mount plate. A wafer having a lower surface coated with an adhesive layer is held by a vacuum chuck through suction. A vacuum-tight sealing enclosure is placed over the wafer and a mount plate to define a sealed space. The sealed space is then evacuated at a degree of vacuum higher than the degree of vacuum of the vacuum chuck to effect release of the wafer from the vacuum chuck and dropping of the wafer onto the mount plate. The wafer is applied to the mount plate without the occlusion of air bubbles between the wafer and the mount plate.
    Type: Grant
    Filed: December 20, 1994
    Date of Patent: February 11, 1997
    Assignee: Enya Systems Limited
    Inventors: Kimiwaka Ooizumi, Kouichi Tanaka