Abstract: An information processing apparatus (2000) detects an abnormal region (30) from a moving image frame (14). The abnormal region (30) is a region that is estimated to represent an abnormal part inside a body of a subject. The information processing apparatus (2000) generates and outputs output information based on the number of detected abnormal regions (30).

Abstract: A negative photoresist stripping liquid composition is provided which comprises from 30 to 75% by weight of dimethyl sulfoxide, from 20 to 65% by weight of 1,3-dimethyl-2-imidazolidinone, from 0.1 to 5% by weight of a tetraalkylammonium hydroxide and from 0.5 to 15% by weight of water. The composition has a superior stripping performance especially against photoresists that are alkali-developable and can form films of at least 20 .mu.m in thickness, and has no problem of freezing even when stored outdoors in the winter. The composition is useful for the stripping of negative photoresists for bump formation and for fabricating circuit substrates.

Abstract: A radiation sensitive resin composition comprising:(A) an alkali-soluble copolymer comprising:(a) 10 to 50% by weight of a first unit consisting of a radical polymerizable compound having a carboxylic group,(b) 20 to 60% by weight of a second unit consisting of a radical polymerizable compound having a cycloalkyl group, the unit containing no carboxyl group, and(c) 5 to 40% by weight of a third unit consisting of a radical polymerizable compound other than the radical polymerizable compounds in (a) and (b) above;(B) a polymerizable compound having at least one ethylenically unsaturated double bond; and(C) a radiation sensitive radical initiator. Also is disclosed a material for forming bumps containing the radiation sensitive resin composition. The radiation sensitive resin composition has sufficient developability with an alkali developer and sufficient resolution when the composition is in the form of a 20 .mu.m or more thick film.

Abstract: A positive photoresist composition including (A) 100 parts by weight of an alkali-soluble novolak resin, and based thereon; (B) 5 to 50 parts by weight of an alkali-soluble acrylic resin containing, as s, 10 to 80% by weight of a unit of a radical-polymerizable compound having an alcoholic hydroxyl group and 3 to 50% by weight of at least one of a unit of a radical-polymerizable compound having a carboxyl group and a unit of a radical-polymerizable compound having a phenolic hydroxyl group; (C) 5 to 100 parts by weight of a quinonediazide group-containing compound; and (D) a solvent, is provided. This composition has a good adhesion to substrates at the time of development and a good plating solution resistance and moreover can be well wetted with plating solutions, can be well developed with alkali developing solutions and can be well stripped from substrates at the resist unexposed areas, and is suited for the formation of thick films suitable as bump forming materials.

Abstract: An epoxy group-containing thermosetting resin composition comprising (A) a copolymer obtained From (a) at least one member selected from an unsaturated carboxylic acid and an unsaturated carboxylic acid anhydride, (b) an epoxy group-containing unsaturated compound, (c) a monoolefin unsaturated compound, and optionally (d) a conjugated diolefin unsaturated compound, and (B) an organic solvent for dissolving the above copolymer. There is also provided another epoxy-group containing thermosetting resin composition which contains the above component (A), (C) a polymerizable compound having at least one ethylenically unsaturated double bond, and (D) a photopolymerization initiator. These epoxy-group containing thermosetting resin compositions are excellent in storage stability.

Abstract: An epoxy group-containing thermosetting resin composition comprising (A) a copolymer obtained from (a) at least one member selected from an unsaturated carboxylic acid and an unsaturated carboxylic acid anhydride, (b) an epoxy group-containing unsaturated compound, (c) a monoolefin unsaturated compound, and optionally (d) a conjugated diolefin unsaturated compound, and (B) an organic solvent for dissolving the above copolymer. There is also provided another epoxy-group containing thermosetting resin composition which contains the above component (A), (C) a polymerizable compound having at least one ethylenically unsaturated double bond, and (D) a photopolymerization initiator. These epoxy-group containing thermosetting resin compositions are excellent in storage stability.

Abstract: A radiation-sensitive resin composition comprising:(a) an epoxy group-containing alkali-soluble resin, or a combination of an alkali-soluble resin which may have an epoxy group and an epoxy compound,(b) 1,2-naphthoquinonediazide sulfonic acid ester, and(c) a solvent.The above radiation-sensitive resin composition is useful as a material for forming a lens.