Patents by Inventor Kimmo Jokelainen

Kimmo Jokelainen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240060634
    Abstract: According to an example aspect of the present invention, there is provided a heat sink (100) with an elongated inner core (110) and an elongated outer profile (120). The profile (120) forms a cross-sectional periphery and is provided around and at a distance from the core (110) such that an intermediate volume (160) is formed between the core (110) and the profile (120). The heat sink (100) also has abridge (130) connecting the profile (120) to the core (110). The profile (120) has at least one opening (140) exposing the intermediate volume (160) to the ambient. The at least one opening (140) extends in a direction which is non-parallel to the dimension of elongation of the inner core (110).
    Type: Application
    Filed: November 30, 2021
    Publication date: February 22, 2024
    Inventors: Vesa Pentikäinen, Kimmo Jokelainen
  • Publication number: 20220319949
    Abstract: A novel heat transfer system is herein proposed involving a coupler which, when attached to a heat sink, defines at least a part of a vapor chamber inside the heat transfer system. The coupler attaches component heat source to the header to a thermally transferring connection with the heat sink.
    Type: Application
    Filed: May 6, 2020
    Publication date: October 6, 2022
    Inventors: Vesa Pentikäinen, Kimmo Jokelainen
  • Patent number: 11388815
    Abstract: A flexible electronic foil (1,1?,1?) comprising a flexible substrate (2) and at least one electrically conducive portion (3) arranged to the substrate (2). The foil (1,1?,1?) comprises mechanical fastening means (6,6?,7) for mechanical fastening of the electronic foil (1,1?,1?), the mechanical fastening means being part of the substrate (2) of the electronic foil (1,1?,1?).
    Type: Grant
    Filed: August 31, 2018
    Date of Patent: July 12, 2022
    Assignee: TEKNOLOGIAN TUTKIMUSKESKUS VTT OY
    Inventors: Vesa Pentikäinen, Kimmo Jokelainen
  • Publication number: 20220133200
    Abstract: In some embodiments, a system includes a first assembly, a second assembly, and a connecting member. The first assembly includes a first electrode and a first adhesive portion. The first assembly is configured to be coupled to a surface of a patient via the first adhesive portion. The second assembly includes a second electrode and a second adhesive portion. The second assembly is configured to be coupled to the surface of the patient via the second adhesive portion. The connecting member has a first end coupled to the first assembly and a second end coupled to the second assembly. The connecting member is configured to transition between a first configuration and a second configuration and may be configured to be coupled to the surface of the patient via a third adhesive portion in both the first configuration and the second configuration.
    Type: Application
    Filed: January 24, 2020
    Publication date: May 5, 2022
    Applicant: Otsuka Pharmaceutical Co., Ltd.
    Inventors: Tomi MATTILA, Kimmo JOKELAINEN, Samuli YRJÄNÄ, Colm MC CAFFREY, Mohammadhossein BEHFAR, Jukka KYYNÄRÄINEN, Arto RANTALA
  • Publication number: 20220117534
    Abstract: In some embodiments, a system includes a patch assembly and a frame. The patch assembly includes an adhesive portion. The patch assembly is configured to be coupled to a surface of a user via the adhesive portion. The patch assembly has a first patch configuration and a second patch configuration. The frame defines an opening. The patch assembly is configured to be disposed within the opening. The frame has a first frame configuration in which the frame is coupled to the patch assembly via a group of connectors such that the frame prevents the patch assembly from transitioning between the first patch configuration and the second patch configuration. The frame has a second frame configuration in which the group of connectors are broken and the frame is separated from the patch assembly.
    Type: Application
    Filed: March 6, 2020
    Publication date: April 21, 2022
    Applicant: Otsuka Pharmaceutical Co., Ltd.
    Inventors: Tomi MATTILA, Mohammadhossein BEHFAR, Colm MC CAFFREY, Kimmo JOKELAINEN, Samuli YRJÄNÄ, Antti TAURIAINEN, Markku VALKAMA
  • Publication number: 20220117533
    Abstract: In some embodiments, a system includes a patch assembly, a frame, and a conductive component. The patch assembly is configured to be coupled to a patient via an adhesive portion. The patch assembly includes an electronics subassembly. The frame has a first frame configuration in which the frame is coupled to the patch assembly via a plurality of connectors and a second frame configuration in which the plurality of connectors are broken and the frame is separated from the patch assembly. The conductive component forms a continuous loop when the frame is in the first frame configuration. A portion of the conductive component is broken when the frame is in the second frame configuration such that the conductive component is discontinuous between the first end and the second end. The portion of the conductive component is at least partially disposed on a connector from the plurality of connectors when the frame is in the first frame configuration.
    Type: Application
    Filed: March 6, 2020
    Publication date: April 21, 2022
    Applicant: Otsuka Pharmaceutical Co., Ltd.
    Inventors: Tomi MATTILA, Colm MC CAFFREY, Tapio PERNU, Mohammadhossein BEHFAR, Samuli YRJÄNÄ, Kimmo JOKELAINEN, Antti TAURIAINEN, Markku VALKAMA
  • Publication number: 20200260567
    Abstract: A flexible electronic foil (1, 1?, 1?) comprising a flexible substrate (2) and at least one electrically conducive portion (3) arranged to the substrate (2). The foil (1, 1?, 1?) comprises mechanical fastening means (6, 6?, 7) for mechanical fastening of the electronic foil (1, 1?, 1?), the mechanical fastening means being part of the substrate (2) of the electronic foil (1, 1?, 1?).
    Type: Application
    Filed: August 31, 2018
    Publication date: August 13, 2020
    Inventors: Vesa PENTIKÄINEN, Kimmo JOKELAINEN
  • Patent number: 9175842
    Abstract: The invention relates to a heat sink assembly and a method for producing the same. The invention can be applied, for example, in solid state lighting in order to improve the efficiency of heat dissipation. The object of the invention is achieved with a solution where effective thermal connection is provided from opto-electrical component in which thermally active inserts are embedded in an injection moulding to plastic heat sink. Solution of the invention can also provide also electrical connections for opto-electrical components.
    Type: Grant
    Filed: March 8, 2012
    Date of Patent: November 3, 2015
    Assignee: Light Therm Oy
    Inventors: Kimmo Jokelainen, Ville Moilanen, Howard Rupprecht
  • Publication number: 20130335970
    Abstract: The invention relates to a heat sink assembly and a method for producing the same. The invention can be applied, for example, in solid state lighting in order to improve the efficiency of heat dissipation. The object of the invention is achieved with a solution where effective thermal connection is provided from opto-electrical component in which thermally active inserts are embedded in an injection moulding to plastic heat sink. Solution of the invention can also provide also electrical connections for opto-electrical components.
    Type: Application
    Filed: March 8, 2012
    Publication date: December 19, 2013
    Inventors: Kimmo Jokelainen, Ville Moilanen, Howard Rupprecht
  • Publication number: 20110044002
    Abstract: In the method according to the invention, the discrete electric component to be cooled is connected to the cooling element without a circuit board or substrate. In the method, a layer of insulating material is thermally sprayed on one surface of the cooling element. The connection points and conductors required by the discrete electric component are formed on top of this insulating layer. The discrete electric component is glued onto the insulating layer. Subsequently, the electrical connections for the discrete component are made. After the discrete component has been electrically connected, it can still be protected using a layer of thermally sprayed insulating material.
    Type: Application
    Filed: January 19, 2009
    Publication date: February 24, 2011
    Applicant: Valtion Teknillinen Tutkimuskeskus
    Inventors: Kimmo Jokelainen, Aila Petajajarvi