Abstract: A magnetic particle trapper for use in a sputtering system includes a roller cover plate having a plurality of openings arranged and dimensioned to accommodate a plurality of rollers associated with a mechanical transport mechanism of the sputtering system, and a plurality of magnets to trap magnetic particles, the plurality of magnets being attached to the roller cover plate in locations proximate to the plurality of openings.

Abstract: A magnetic particle trapper for use in a sputtering system includes a roller cover plate having a plurality of openings arranged and dimensioned to accommodate a plurality of rollers associated with a mechanical transport mechanism of the sputtering system, and a plurality of magnets to trap magnetic particles, the plurality of magnets being attached to the roller cover plate in locations proximate to the plurality of openings.

Abstract: A flexible circuit comprises a flexible substrate having first and second opposing surfaces. The flexible substrate can include multiple layers. A plurality of electrical traces can be mounted on either or both surfaces of the flexible substrate. A plurality of electrical components can also be mounted on either or both surfaces of the flexible substrate. A plurality of tooling cutouts is recessed in the sides of the flexible circuit. The tooling cutouts can have various shapes, such as, but not limited to, semi-circular, multiple straight edges, a single or multiple curved edges, etc. The cutouts are used to position and hold the flexible circuit in at least one other device.

Abstract: A lens mount assembly for securing a lens in a predetermined position within an optical device is disclosed. The lens mount assembly is configured so as to retain the lens in a press fit arrangement, thereby eliminating the need for adhesives or other mechanical means in order to secure the lens. In one embodiment the lens mount assembly includes a glass lens having an outer surface with a predetermined amount of surface roughness. A retention tube defines a cylindrical volume and is composed of a compliant material that resiliently deforms when the lens is pressed into the cylindrical volume. The compliant material recompresses a small amount around the lens to secure it within the retention tube. A base is attached to or integrally formed with the retention tube and includes a corrugated surface for securing the lens mount assembly within the optical device.

Abstract: Exemplary methods for making a solder joint between two articles are disclosed. The method includes the steps of positioning a first article and a second article to be soldered together. At least one of the first article and the second article has at least one button attached to it. The button has a desired height above a surface of the article to which it is attached. The second article has a quantity of solder located in a position where the solder joint is to be formed. A heat source is applied until the quantity of solder liquefies. The heat source is removed until the solder solidifies with a uniform thickness approximately equal to the height of the button.

Abstract: A lens mount assembly for securing a lens in a predetermined position within an optical device is disclosed. The lens mount assembly is configured so as to retain the lens in a press fit arrangement, thereby eliminating the need for adhesives or other mechanical means in order to secure the lens. In one embodiment the lens mount assembly includes a glass lens having an outer surface with a predetermined amount of surface roughness. A retention tube defines a cylindrical volume and is composed of a compliant material that resiliently deforms when the lens is pressed into the cylindrical volume. The compliant material recompresses a small amount around the lens to secure it within the retention tube. A base is attached to or integrally formed with the retention tube and includes a corrugated surface for securing the lens mount assembly within the optical device.

Abstract: Exemplary methods for making a solder joint between two articles are disclosed. The method includes the steps of positioning a first article and a second article to be soldered together. At least one of the first article and the second article has at least one button attached to it. The button has a desired height above a surface of the article to which it is attached. The second article has a quantity of solder located in a position where the solder joint is to be formed. A heat source is applied until the quantity of solder liquefies. The heat source is removed until the solder solidifies with a uniform thickness approximately equal to the height of the button.

Abstract: A flexible circuit comprises a flexible substrate having first and second opposing surfaces. The flexible substrate can include multiple layers. A plurality of electrical traces can be mounted on either or both surfaces of the flexible substrate. A plurality of electrical components can also be mounted on either or both surfaces of the flexible substrate. A plurality of tooling cutouts is recessed in the sides of the flexible circuit. The tooling cutouts can have various shapes, such as, but not limited to, semi-circular, multiple straight edges, a single or multiple curved edges, etc. The cutouts are used to position and hold the flexible circuit in at least one other device.