Patents by Inventor Kinya SAKODA

Kinya SAKODA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor chip with bonding wire and method for making the same
    Patent number: 8847410
    Abstract: A semiconductor device includes a semiconductor chip, a die pad including an obverse surface on which the semiconductor chip is bonded, a lead spaced apart from the die pad, a bonding wire electrically connecting the semiconductor chip and the lead to each other, and a resin package that seals the semiconductor chip and the bonding wire. The bonding wire includes a first bond portion press-bonded to the semiconductor chip by ball bonding, a second bond portion press bonded to the lead by stitch bonding, a landing portion extending from the second bond portion toward the die pad and formed in contact with an obverse surface of the lead, and a loop extending obliquely upward from the landing portion toward the semiconductor chip.
    Type: Grant
    Filed: August 21, 2012
    Date of Patent: September 30, 2014
    Assignee: Rohm Co., Ltd.
    Inventors: Kosuke Miyoshi, Kinya Sakoda, Toshikuni Shinohara
  • SEMICONDUCTOR DEVICE AND METHOD FOR MAKING THE SAME
    Publication number: 20130049231
    Abstract: A semiconductor device includes a semiconductor chip, a die pad including an obverse surface on which the semiconductor chip is bonded, a lead spaced apart from the die pad, a bonding wire electrically connecting the semiconductor chip and the lead to each other, and a resin package that seals the semiconductor chip and the bonding wire. The bonding wire includes a first bond portion press-bonded to the semiconductor chip by ball bonding, a second bond portion press bonded to the lead by stitch bonding, a landing portion extending from the second bond portion toward the die pad and formed in contact with an obverse surface of the lead, and a loop extending obliquely upward from the landing portion toward the semiconductor chip.
    Type: Application
    Filed: August 21, 2012
    Publication date: February 28, 2013
    Applicant: ROHM CO., LTD.
    Inventors: Kosuke MIYOSHI, Kinya SAKODA, Toshikuni SHINOHARA