Patents by Inventor Kip P. Stevenson

Kip P. Stevenson has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9823273
    Abstract: Probe tip formation is described for die sort and test. In one example, the tips of wires of a test probe head are prepared for use as test probes. The wires are attached to a test probe head substrate. The end opposite the substrate has a tip. The tips of the wires are polished when attached to the test probe head to form a sharpened point.
    Type: Grant
    Filed: June 29, 2013
    Date of Patent: November 21, 2017
    Assignee: Intel Corporation
    Inventors: Keith J. Martin, Kip P. Stevenson, Kamil S. Salloum, Todd P. Albertson
  • Patent number: 9207258
    Abstract: An electrical probe of an aspect includes a high yield strength wire core. The high yield strength wire core includes predominantly one or more materials selected from tungsten, tungsten-copper alloy, tungsten-nickel alloy, beryllium-copper alloy, molybdenum, stainless steel, and combinations thereof. The high mechanical strength wire core has a yield strength of at least 1 gigapascal (GPa) at temperature of 250° C. The electrical probe also includes a low electrical resistivity layer concentrically around the high yield strength wire core. The concentric layer includes predominantly one or more materials selected from silver, gold, copper, and combinations thereof. The low electrical resistivity layer has an electrical resistivity of no more than 2×10?8 Ohm-meters. The electrical probe has an outer cross-sectional dimension of the electrical probe that is no more than 50 micrometers. Between 60 to 85% of the outer cross-sectional dimension is provided by the high mechanical strength wire core.
    Type: Grant
    Filed: September 28, 2012
    Date of Patent: December 8, 2015
    Assignee: Intel Corporation
    Inventors: David Shia, Todd P. Albertson, Kip P. Stevenson
  • Publication number: 20150002181
    Abstract: Probe tip formation is described for die sort and test. In one example, the tips of wires of a test probe head are prepared for use as test probes. The wires are attached to a test probe head substrate. The end opposite the substrate has a tip. The tips of the wires are polished when attached to the test probe head to form a sharpened point.
    Type: Application
    Filed: June 29, 2013
    Publication date: January 1, 2015
    Inventors: Keith J. Martin, Kip P. Stevenson, Kamil S. Salloum, Todd P. Albertson
  • Publication number: 20140224990
    Abstract: One embodiment relates to an apparatus comprising a light source adapted to transmit light through a liquid, and a detector adapted to detect an intensity of the light after it passes through the liquid. The apparatus may also include a device to process data relating to the intensity of the infrared light and compare the processed data to predetermined control data. The apparatus may also include a controller adapted to transmit a signal to a liquid dispenser if the processed data differs from the control data by a predetermined amount. The light may be selected from the group consisting of ultraviolet, visible, infrared, and microwave light. Other embodiments are described and claimed.
    Type: Application
    Filed: April 27, 2012
    Publication date: August 14, 2014
    Inventors: Kip P. Stevenson, Pooya Tadayon, Warren S. Crippen
  • Publication number: 20140091821
    Abstract: An electrical probe of an aspect includes a high yield strength wire core. The high yield strength wire core includes predominantly one or more materials selected from tungsten, tungsten-copper alloy, tungsten-nickel alloy, beryllium-copper alloy, molybdenum, stainless steel, and combinations thereof. The high mechanical strength wire core has a yield strength of at least 1 gigapascal (GPa) at temperature of 250° C. The electrical probe also includes a low electrical resistivity layer concentrically around the high yield strength wire core. The concentric layer includes predominantly one or more materials selected from silver, gold, copper, and combinations thereof. The low electrical resistivity layer has an electrical resistivity of no more than 2×10?8 Ohm-meters. The electrical probe has an outer cross-sectional dimension of the electrical probe that is no more than 50 micrometers. Between 60 to 85% of the outer cross-sectional dimension is provided by the high mechanical strength wire core.
    Type: Application
    Filed: September 28, 2012
    Publication date: April 3, 2014
    Inventors: David Shia, Todd P. Albertson, Kip P. Stevenson