Patents by Inventor Kiran Kumar Vanam

Kiran Kumar Vanam has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20090243051
    Abstract: Microelectronic device assemblies having integrated conductive shields are disclosed herein. The microelectronic device assemblies include a semiconductor substrate having a bond site and a solder ball electrically connected to the bond site, a dielectric sidewall at least partially encapsulating the semiconductor substrate, and a conductive shield in direct contact with the sidewall and in electrical communication with the solder ball and the bond site.
    Type: Application
    Filed: March 28, 2008
    Publication date: October 1, 2009
    Applicant: MICRON TECHNOLOGY, INC.
    Inventors: Kiran Kumar Vanam, Alan G. Wood, James M. Derderian, Derek J. Gochnour, Owen R. Fay, Luke G. England
  • Publication number: 20090243012
    Abstract: A microelectronic device assembly with an integrated conductive shield is disclosed herein. The microelectronic device assembly includes a semiconductor substrate, an integrated circuit carried by the semiconductor substrate, a dielectric encapsulant encasing at least a portion of the semiconductor substrate. The microelectronic device assembly also includes a conductive shield in direct contact with at least a portion of the dielectric encapsulant and an interconnect extending through the semiconductor substrate and in direct contact with the conductive shield.
    Type: Application
    Filed: March 28, 2008
    Publication date: October 1, 2009
    Applicant: MICRON TECHNOLOGY, INC.
    Inventors: Kiran Kumar Vanam, Derek J. Gochnour, Alan G. Wood, James M. Derderian, Luke G. England, Owen R. Fay