Patents by Inventor Kiran Vanam

Kiran Vanam has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Imager wafer level module and method of fabrication and use
    Publication number: 20090206431
    Abstract: Imager wafer level modules, methods of assembly for imager wafer level modules, and systems containing imager wafer level modules. An imager die and an optic lens stack are combined to form a module assembly. The module assembly is combined with a molded plastic, laminated plastic, or metallic interposer to form an imager wafer level module capable of assembly using industry standard equipment sets for all processing, and capable of being used with various imaging systems.
    Type: Application
    Filed: February 20, 2008
    Publication date: August 20, 2009
    Inventors: Todd O. Bolken, Kiran Vanam