Abstract: A tracked device may be used in an extended reality system in coordination with a tracking device. The tracked device may be ordinarily difficult to track, for example due to changing appearances or relatively small surface areas of unchanging features, as may be the case with an electronic device with a relatively large display surrounded by a thin physical outer boundary. In these cases, the tracked device may periodically present an image to the tracking device that the tracking device stores as an indication to permit tracking of a known, unchanging feature despite the image not being presented continuously on the display of the tracked device. The image may include a static image, designated tracking data overlaid on an image frame otherwise scheduled for presentation, or extracted image features from the image frame otherwise scheduled for presentation. Additional power saving methods and known marker generation methods are also described.

Abstract: Flexible cables may include multiple power, ground, and signal traces, and include EM interference suppression devices within the cable itself. Signal traces may be shielded by ground traces. The body of a cable may be divided into lateral portions through which different types of traces extend. One lateral side of a cable body may include a stack of power traces, while another lateral side of the cable body may include ground and signal traces. EBG patterns may be incorporated into ground traces. Capacitors may be positioned within the cable along its length, mounted between power and ground traces, for decoupling.

Abstract: Flexible cables may include multiple power, ground, and signal traces, and include EM interference suppression devices within the cable itself. Signal traces may be shielded by ground traces. The body of a cable may be divided into lateral portions through which different types of traces extend. One lateral side of a cable body may include a stack of power traces, while another lateral side of the cable body may include ground and signal traces. EBG patterns may be incorporated into ground traces. Capacitors may be positioned within the cable along its length, mounted between power and ground traces, for decoupling.

Abstract: A tracked device may be used in an extended reality system in coordination with a tracking device. The tracked device may be ordinarily difficult to track, for example due to changing appearances or relatively small surface areas of unchanging features, as may be the case with an electronic device with a relatively large display surrounded by a thin physical outer boundary. In these cases, the tracked device may periodically present an image to the tracking device that the tracking device stores as an indication to permit tracking of a known, unchanging feature despite the image not being presented continuously on the display of the tracked device. The image may include a static image, designated tracking data overlaid on an image frame otherwise scheduled for presentation, or extracted image features from the image frame otherwise scheduled for presentation. Additional power saving methods and known marker generation methods are also described.

Abstract: Flexible cables may include multiple power, ground, and signal traces, and include EM interference suppression devices within the cable itself. Signal traces may be shielded by ground traces. The body of a cable may be divided into lateral portions through which different types of traces extend. One lateral side of a cable body may include a stack of power traces, while another lateral side of the cable body may include ground and signal traces. EBG patterns may be incorporated into ground traces. Capacitors may be positioned within the cable along its length, mounted between power and ground traces, for decoupling.

Abstract: Wafer level passive array packages and modules are described. In an embodiment, a module includes a circuit board, and a package mounted on the circuit board in which the package includes a plurality of passive components bonded to a bottom side of the die and a plurality of landing pads of the circuit board.

Abstract: Wafer level passive array packages, modules, and methods of fabrication are described. In an embodiment, a module includes a circuit board, and a package mounted on the circuit board in which the package includes a plurality of passive components bonded to a bottom side of the die and a plurality of landing pads of the circuit board.