Patents by Inventor Kirk Flatow

Kirk Flatow has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Stacked devices for multichip modules
    Patent number: 5804004
    Abstract: A method for fabricating a multichip module includes attaching a first integrated circuit to a silicon circuit board. Bonding pads on the first integrated circuit are wire-bonded to a first set of contacts on the circuit board. A second integrated circuit is adhesively attached onto the top of the first integrated circuit. The second integrated circuit includes a recessed bottom surface to provide an overhang over the first integrated circuit which exposes the bonding pads on the top surface of the first integrated circuit. Then bonding pads on the second integrated circuit are wire-bonded to a second set of contacts on the circuit board.
    Type: Grant
    Filed: May 24, 1996
    Date of Patent: September 8, 1998
    Assignee: nChip, Inc.
    Inventors: David B. Tuckerman, Nicholas E. Brathwaite, Paul Marella, Kirk Flatow