Abstract: An apparatus for coupling light from a light source into an optical waveguide having an entrance aperture for receiving light to be transmitted by the waveguide. The entrance aperture has a numerical aperture that may vary over the aperture. The apparatus includes an optical element that conditions the light from the light source and a diffractive optical element. The diffractive optical element generates a plurality of light spots from the light source. The light from each light spot enters the entrance aperture of the waveguide at a different point on the entrance aperture. Each of the light spots has a numerical aperture that is less than the numerical aperture of the entrance aperture at the point on the entrance aperture at which the light from that light spots enters the entrance aperture.

Abstract: A method is disclosed by which precision alignment of optical fiber to wave-guide or other optical elements can be carried out with an adjustable microstructure in active alignment mode fiber attachment. A microstructure containing three elongated U-grooves can be combined effectively to produce a movable and adjustable V-groove structure, which can be used to achieve sub-micron scale alignment control with zero rotational torque. This device not only makes fiber alignment easy and fast but also maintains the fiber attachment position after alignment and epoxy bonding. Multiple fiber array alignment can be carried out with only a global alignment of two end fibers.

Abstract: A micro-optics device and a method for fabricating the micro-optics device is provided using one or more layers of an optically-transparent polymer resist having a viscosity between 2,000 and 100,000 centipoise or that is otherwise sufficient to allow stacking of one or more layers of the resist at a thickness of at least 10 microns per layer of resist. Each layer of the polymer resist is deposited onto a substrate and defined photolithographically to build a discrete relief structure upon which a final smoothing layer of polymer resist can be applied.

Abstract: An enclosure for an optical communications device having a lid portion and a base portion. Alignment members adapted to interface with an optical connector are formed on the lid portion. The lid portion is affixed to the base portion with a portion of the communications components therebetween. Multiple base portions formed in a unitary piece of material and multiple lid portions formed in another unitary piece of material can be affixed to one another, and then separated into individual devices to minimize time spent aligning each base and lid portion.

Abstract: A chip mounted enclosure (“CME”) comprises a base formed by an integrated circuit chip, a transducer element disposed on the integrated circuit chip, a side piece surrounding the transducer element that is coupled to the base, and a top piece coupled to the side piece. A method of making a CME comprises mounting a transducer element to a planar surface of an integrated circuit chip, where the planar surface forms a base of the CME. A side piece is fabricated to surround the transducer element. A top piece of the CME is placed on the side piece. Individual CMEs can be fabricated from a wafer assembly, where transducer elements, each respectively mounted to an integrated circuit wafer having corresponding integrated circuit chips, are individually surrounded by a side piece structure that is bonded to the integrated circuit wafer. Individual CMEs are formed by singulating the wafer assembly.

Abstract: An integrated packaging system that comprises an integral mechanical support, a printed circuit board and the optical communications device. The mechanical support includes a first support element and a second support element. The first support element extends at a non-zero angle from the second support element. The printed circuit board includes a first portion and a second portion in contact with the first support element and the second support element, respectively. The optical communications device is mechanically coupled to the first support element of the mechanical support and is electrically connected to the first portion of the printed circuit board. The integrated packaging system preferably provides automatic alignment between the optical communications device and one or both of an optical element and an optical fiber. In this case, the first support element includes a device alignment feature.

Abstract: An integrated packaging system that comprises an integral mechanical support, a printed circuit board and the optical communications device. The mechanical support includes a first support element and a second support element. The first support element extends at a non-zero angle from the second support element. The printed circuit board includes a first portion and a second portion in contact with the first support element and the second support element, respectively. The optical communications device is mechanically coupled to the first support element of the mechanical support and is electrically connected to the first portion of the printed circuit board. The integrated packaging system preferably provides automatic alignment between the optical communications device and one or both of an optical element and an optical fiber. In this case, the first support element includes a device alignment feature.

Abstract: An optical subassembly and a method of fabricating the same utilize a subassembly body that is formed by molding the subassembly body onto a substrate. Preferably, the subassembly body is constructed of a plastic material that can be molded into a precise shape. The subassembly body and the substrate become an integral unit when the molded plastic material is polymerized. The optical subassembly includes the subassembly body, the substrate, an optical element, an optoelectronic device, and a transmitter or receiver integrated circuit (IC) chip. The optoelectronic device and the transmitter/receiver IC chip are affixed to the substrate. Preferably, the substrate is a flexible circuit having a number of electrical traces. The flexible circuit may be composed of a polymer material. The optoelectronic device is positioned on the substrate such that the optoelectronic device is located within an opening in the subassembly body.

Abstract: An optical fiber faceplate transmits light signals between an optical fiber communications device and optical fibers secured by a fiber optic connector. The optical fiber faceplate includes a plurality of closely spaced optical fiber segments which prevent light signals from diverging as they pass through the faceplate. The diameters of the cores of the optical fiber segments within the faceplate are smaller than the diameters of the optical fibers secured by the fiber optic connector. Therefore, light from optical signals communicated by the optical fibers is received and transmitted through the faceplate via a plurality of optical fiber segments within the faceplate. Consequently, the faceplate does not need to be precisely aligned with either the optical fibers or the optical communications device.