Abstract: A module (10) for use with a smart card (50) is disclosed. The module (10) includes a substrate (14) having a first side (16) and a second side (18). The first and second sides each have deposited thereon a metallic layer (19, 21), with the substrate (14) having a thickness of about 125 microns. A die (22) is mounted adjacent the substrate first side (16), with the die (22) being coupled to the substrate first side (16) by a plurality of wire leads (24). A protective coating (26) covers the die (22), with the module having a total thickness of about 525 microns.

Abstract: A module (10) for use with a smart card (50) is disclosed. The module (10) includes a substrate (14) having a first side (16) and a second side (18). The first and second sides each have deposited thereon a metallic layer (19, 21), with the substrate (14) having a thickness of about 125 microns. A die (22) is mounted adjacent the substrate first side (16), with the die (22) being coupled to the substrate first side (16) by a plurality of wire leads (24). A protective coating (26) covers the die (22), with the module having a total thickness of about 525 microns.

Abstract: A module (10) for use with a smart card (50) is disclosed. The module (10) includes a substrate (14) having a first side (16) and a second side (18). The first and second sides each have deposited thereon a metallic layer (19, 21), with the substrate (14) having a thickness of about 125 microns. A die (22) is mounted adjacent the substrate first side (16), with the die (22) being coupled to the substrate first side (16) by a plurality of wire leads (24). A protective coating (26) covers the die (22), with the module having a total thickness of about 525 microns.

Abstract: An improved punch out pattern for a hot melt tape used in smartcard manufacture. The hot melt tape is provided with punch out channels that direct the overflow of conductive adhesive away from the surface of the hot melt tape. In a preferred embodiment, the punch out channels are dimensioned to direct the overflow away from one another and toward a module receiving cavity formed in the smartcard body. In an alternate embodiment where it may not be feasible to direct overflow toward the overmold receiving cavity without affecting the electrical or mechanical performance of the smartcard, the punch out channels are dimensioned to direct overflow away from one another and along the periphery of the hot melt tape area. In either scenario, the channels do not interfere with module adhesion and, by virtue of the channeling of overfill matter, direct the conductive adhesive away from other connections in close vicinity and thus avoid the possibility of shorting.

Abstract: A solder joint inspection system comprises a substrate (60) having at least one solder pad (56), a predetermined amount of solder (54) on the solder pad, and an image fluxing material (52) that fluoresces when an ultraviolet light source (42) is applied to the solder (54) and the fluxing material (52). When an ultraviolet light source is applied to the substrate having a predetermined amount of solder and fluxing material, a visual inspecting device (40) can verify if, in fact, the predetermined amount of solder and fluxing material is present.

Abstract: A soldering process uses a plurality of individual heating elements (204) to solder a plurality of solder locations. The process consists of the steps of substantially simultaneously picking up a plurality of solder preforms (202); placing the plurality of solder preforms substantially simultaneously on different interconnection locations (214) found on a circuit board (212); and substantially simultaneously soldering the plurality of solder preforms (202) with a heating element fixture (200) which has a plurality of individual heating elements (204) which match the different interconnection locations (214) found on the circuit board (212).