Abstract: An electronic package assembly wherein a low profile package is soldered to an organic (e.g., epoxy resin) substrate (e.g., printed circuit board), the projecting conductive leads of the package and the solder which substantially covers these leads (and respective conductors on the substrate) having been substantially covered with encapsulant material (e.g., polymer resin) to provide reinforcement for the solder-lead connections. The encapsulant material is dispensed about the solder and lead joints following solder reflow and solidification so as to substantially surround the solder and any portions of the leads not covered with solder. The invention has particular useful with thin, small outline package (TSOP) structures which occupy a minimum of height on the substrate surface.

Abstract: A fiber optic data transmission system and method are provided comprising a laser diode, an attenuating and focusing lens, and an optical fiber. The method of operating the system attenuates laser diode radiation outputted during operation. The system operates by application of the input driving current to the laser diode in a manner which increases the laser diode extinction ratio. The increased laser diode power output associated with operation at a higher extinction ratio is attenuated by the lens to a safe operating level. Increasing the laser diode extinction ratio significantly increases the system's signal-to-noise ratio and thereby reduces the bit error rate associated with the data transmitted over the optical fiber, while the attenuation of the laser diode output radiation allows operation within prescribed safety limits.