Patents by Inventor Kit Ho TONG

Kit Ho TONG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • METHOD FOR FORMING ORGANIC COATING ON COPPER SURFACE
    Publication number: 20170183783
    Abstract: A method for selective deposition of an organic solderability preservative coating on a copper surface of an article is disclosed. The method includes two steps of organic coatings by two solutions; the first step contains contacting the copper surface with a first solution including azole compound and the second step contains contacting the copper surface treated by the first solution with a second solution including a specific pyrazine derived compound.
    Type: Application
    Filed: December 12, 2016
    Publication date: June 29, 2017
    Inventors: Qin Tang, Kit Ho Tong, Chit Yiu Chan, Kwok Wai Yee
  • METHOD FOR FORMING ORGANIC COATING ON NICKEL SURFACE
    Publication number: 20170181292
    Abstract: A method for forming an organic coating on a surface of nickel or nickel alloy is disclosed. The method includes contacting the nickel surface with a composition comprising a specific pyrazine derived compound to prevent corrosion of nickel without forming known gold emersion film on the surface of the nickel.
    Type: Application
    Filed: December 12, 2016
    Publication date: June 22, 2017
    Inventors: Qin Tang, Kit Ho Tong, Chit Yiu Chan, Kowk-Wai Yee
  • Organic solderability preservative and method
    Patent number: 8961678
    Abstract: An organic solderability preservative solution includes pyrazine derivatives which inhibit corrosion of metal. The solution is applied to metal surfaces of components for electronic apparatus to improve solderability of electrical connections between the components in the electronic apparatus.
    Type: Grant
    Filed: December 20, 2012
    Date of Patent: February 24, 2015
    Assignee: Rohm and Haas Electronic Materials LLC
    Inventors: Qin Tang, Kit Ho Tong, Chit Yiu Chan, Martin W. Bayes
  • ORGANIC SOLDERABILITY PRESERVATIVE AND METHOD
    Publication number: 20140174322
    Abstract: An organic solderability preservative solution includes pyrazine derivatives which inhibit corrosion of metal. The solution is applied to metal surfaces of components for electronic apparatus to improve solderability of electrical connections between the components in the electronic apparatus.
    Type: Application
    Filed: December 20, 2012
    Publication date: June 26, 2014
    Applicant: ROHM AND HAAS ELECTRONIC MATERIALS LLC
    Inventors: Qin TANG, Kit Ho TONG, Chit Yiu CHAN, Martin W. BAYES