Abstract: Capacitive sensors and capacitive sensing data integration for plasma chamber condition monitoring are described. In an example, a plasma chamber monitoring system includes a plurality of capacitive sensors, a capacitance digital converter, and an applied process server coupled to the capacitance digital converter, the applied process server including a system software. The capacitance digital converter includes an isolation interface coupled to the plurality of capacitive sensors, a power supply coupled to the isolation interface, a field-programmable gate-array firmware coupled to the isolation interface, and an application-specific integrated circuit coupled to the field-programmable gate-array firmware.

Abstract: Capacitive sensors and capacitive sensing data integration for plasma chamber condition monitoring are described. In an example, a plasma chamber monitoring system includes a plurality of capacitive sensors, a capacitance digital converter, and an applied process server coupled to the capacitance digital converter, the applied process server including a system software. The capacitance digital converter includes an isolation interface coupled to the plurality of capacitive sensors, a power supply coupled to the isolation interface, a field-programmable gate-array firmware coupled to the isolation interface, and an application-specific integrated circuit coupled to the field-programmable gate-array firmware.

Abstract: A system includes a programmable logic control (PLC) module, an input/output (IO) network bus coupled to the PLC module and provided at facets of a mainframe. A first process chamber attached to a first facet of the facets. A chamber interface IO sub-module is attached to the first facet and coupled to the IO network bus and to a process chamber IO controller of the first process chamber. The chamber interface IO sub-module is to: convert interlock relay signals, received via dry contact exchange with the process chamber IO controller, to digital signals; combine the digital signals into network packets adapted for communication using a protocol of the IO network bus; and transmit the network packets to the PLC module over the IO network bus.

Abstract: Capacitive sensors and capacitive sensing data integration for plasma chamber condition monitoring are described. In an example, a plasma chamber monitoring system includes a plurality of capacitive sensors, a capacitance digital converter, and an applied process server coupled to the capacitance digital converter, the applied process server including a system software. The capacitance digital converter includes an isolation interface coupled to the plurality of capacitive sensors, a power supply coupled to the isolation interface, a field-programmable gate-array firmware coupled to the isolation interface, and an application-specific integrated circuit coupled to the field-programmable gate-array firmware.

Abstract: A method of providing power to a plurality of heaters in multiple zones for wafer-processing equipment may include causing a voltage to be supplied to a plurality of power leads configured to supply the voltage to a plurality of different heating zones in a pedestal, causing current to be received from the plurality of different heating zones through a return lead that is shared by the plurality of power leads, and causing a polarity of the voltage provided to the plurality of power leads to switch. The switching frequency may be configured such that a DC chucking operation can be active at the same time to hold a substrate to the pedestal. Duty cycling the heating zones that share the return lead may minimize the current through the shared return lead.

Abstract: Capacitive sensors and capacitive sensing data integration for plasma chamber condition monitoring are described. In an example, a plasma chamber monitoring system includes a plurality of capacitive sensors, a capacitance digital converter, and an applied process server coupled to the capacitance digital converter, the applied process server including a system software. The capacitance digital converter includes an isolation interface coupled to the plurality of capacitive sensors, a power supply coupled to the isolation interface, a field-programmable gate-array firmware coupled to the isolation interface, and an application-specific integrated circuit coupled to the field-programmable gate-array firmware.

Abstract: A system includes a programmable logic control (PLC) module, an input/output (IO) network bus coupled to the PLC module and provided at facets of a mainframe. A first process chamber attached to a first facet of the facets. A chamber interface IO sub-module is attached to the first facet and coupled to the IO network bus and to a process chamber IO controller of the first process chamber. The chamber interface IO sub-module is to: convert interlock relay signals, received via dry contact exchange with the process chamber IO controller, to digital signals; combine the digital signals into network packets adapted for communication using a protocol of the IO network bus; and transmit the network packets to the PLC module over the IO network bus.