Patents by Inventor Kiyoaki YAMADA

Kiyoaki YAMADA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Reaction tube structure and substrate processing apparatus
    Patent number: 11359283
    Abstract: A substrate processing apparatus includes a reaction tube defining a substrate processing chamber; a gas inlet provided at a lower portion of the reaction tube to supply a process gas; a first buffer unit for temporarily retaining the process gas, the first buffer unit at a first side of an inner surface of the reaction tube and includes a plurality of gas supply holes; and a gas outlet provided at a second side of the inner surface of the reaction tube opposite to the first side, to exhaust the process gas from the process chamber. The gas supply holes are provided from an upper end portion of the first buffer unit to a lower end portion of the first buffer unit, and the process gas is supplied through the plurality of gas supply holes into the process chamber, passes through the process chamber, and exhausted through the gas outlet.
    Type: Grant
    Filed: November 17, 2017
    Date of Patent: June 14, 2022
    Assignee: KOKUSAI ELECTRIC CORPORATION
    Inventors: Tetsuya Marubayashi, Satoru Murata, Kosuke Takagi, Atsushi Hirano, Kiyoaki Yamada, Haruo Morikawa
  • REACTION TUBE STRUCTURE AND SUBSTRATE PROCESSING APPARATUS
    Publication number: 20180142353
    Abstract: A substrate processing apparatus includes a reaction tube defining a substrate processing chamber; a gas inlet provided at a lower portion of the reaction tube to supply a process gas; a first buffer unit for temporarily retaining the process gas, the first buffer unit at a first side of an inner surface of the reaction tube and includes a plurality of gas supply holes; and a gas outlet provided at a second side of the inner surface of the reaction tube opposite to the first side, to exhaust the process gas from the process chamber. The gas supply holes are provided from an upper end portion of the first buffer unit to a lower end portion of the first buffer unit, and the process gas is supplied through the plurality of gas supply holes into the process chamber, passes through the process chamber, and exhausted through the gas outlet.
    Type: Application
    Filed: November 17, 2017
    Publication date: May 24, 2018
    Applicant: HITACHI KOKUSAI ELECTRIC INC.
    Inventors: Tetsuya MARUBAYASHI, Satoru MURATA, Kosuke TAKAGI, Atsushi HIRANO, Kiyoaki YAMADA, Haruo MORIKAWA
  • End effector for handling wafers
    Patent number: D997892
    Type: Grant
    Filed: May 26, 2020
    Date of Patent: September 5, 2023
    Assignee: KOKUSAI ELECTRIC CORPORATION
    Inventors: Satoshi Aizawa, Tetsuya Marubayashi, Kiyoaki Yamada