Abstract: An assistance device enabling communication with a wearable device includes: a memory; and a processor including hardware, the processor being configured to acquire line-of-sight information about a line of sight of a user wearing the wearable device, based on the line-of-sight information, generate blind region state information indicating a state of a blind region shielded by a shielding object in a visual field region of the user, and output the blind region state information to the wearable device.

Abstract: An operating apparatus is provided with: a line-of-sight detector configured to detect a line of sight of an occupant of a vehicle; a face direction detector configured to detect a face direction of the occupant; and an estimator configured to estimate an operation intention intended by the face direction on the basis of the detected face direction, on condition that a change in the detected face direction is greater than a change in the detected line of sight by an amount that is greater than or equal to a predetermined amount.

Abstract: An assistance device enabling communication with a wearable device includes: a memory; and a processor including hardware, the processor being configured to acquire line-of-sight information about a line of sight of a user wearing the wearable device, based on the line-of-sight information, generate blind region state information indicating a state of a blind region shielded by a shielding object in a visual field region of the user, and output the blind region state information to the wearable device.

Abstract: An operating apparatus is provided with: a line-of-sight detector configured to detect a line of sight of an occupant of a vehicle; a face direction detector configured to detect a face direction of the occupant; and an estimator configured to estimate an operation intention intended by the face direction on the basis of the detected face direction, on condition that a change in the detected face direction is greater than a change in the detected line of sight by an amount that is greater than or equal to a predetermined amount.

Abstract: In an upper phase module 2, a second electrode terminal 24V is located at a center C1 of the upper phase module 2, and a first electrode terminal 24U and a third electrode terminal 24W, and a first P terminal 25P and a second P terminal 26P are located so as to be symmetric with respect to the second electrode terminal 24V in an X-direction. The first electrode terminal 24U, the second electrode terminal 24V, the third electrode terminal 24W, the first P terminal 25P and the second P terminal 26P of the upper phase module 2 are located at the same positions as those of a fourth electrode terminal 34U, a fifth electrode terminal 34V, a sixth electrode terminal 34W, a first N terminal 35N and a second N terminal 36N of a lower phase module 3, respectively, in the X-direction.

Abstract: A power module includes an inverter circuit and a pair of conductors that sandwich the inverter circuit. The inverter circuit includes a positive bus bar, a negative bus bar, output bus bars, and element pairs. The element pair has such a configuration that a semiconductor element coupled to the positive bus bar and a semiconductor element coupled to the negative bus bar are coupled to each other via the output bus bar. The semiconductor elements each includes a switching element and a diode connected in antiparallel with the switching element. The positive bus bar, the element pair, and the negative bus bar define a conductive path exhibiting a loop-like shape facing the conductors inside the above-mentioned region.

Abstract: In an upper phase module 2, a second electrode terminal 24V is located at a center C1 of the upper phase module 2, and a first electrode terminal 24U and a third electrode terminal 24W, and a first P terminal 25P and a second P terminal 26P are located so as to be symmetric with respect to the second electrode terminal 24V in an X-direction. The first electrode terminal 24U, the second electrode terminal 24V, the third electrode terminal 24W, the first P terminal 25P and the second P terminal 26P of the upper phase module 2 are located at the same positions as those of a fourth electrode terminal 34U, a fifth electrode terminal 34V, a sixth electrode terminal 34W, a first N terminal 35N and a second N terminal 36N of a lower phase module 3, respectively, in the X-direction.

Abstract: Using coupons effectively is enabled. A host computer 18 that functions as a printing device has a vehicle information acquisition unit 25a that acquires vehicle information related to the vehicle a passenger boards, and a coupon production unit 25b that prints a code representing the vehicle information acquired by the vehicle information acquisition unit 25a on a coupon, and produces a coupon that is provided to the passenger.

Abstract: A semiconductor module has a structure in which a semiconductor device, an insulating sheet, and a cooler are stacked on each other. The semiconductor device includes a semiconductor element, a heat transfer plate that is connected to the semiconductor element, and a resin molding that seals the semiconductor element and the heat transfer plate. A side surface of the resin molding is inclined away from a center of the resin molding relative to a perpendicular direction to a contact surface of the resin molding that is in contact with the insulating sheet. An angle of inclination of the side surface relative to the perpendicular direction is 3 degrees or larger and 17 degrees or smaller.

Abstract: A semiconductor module has a structure in which a semiconductor device, an insulating sheet, and a cooler are stacked on each other. The semiconductor device includes a semiconductor element, a heat transfer plate that is connected to the semiconductor element, and a resin molding that seals the semiconductor element and the heat transfer plate. A side surface of the resin molding is inclined away from a center of the resin molding relative to a perpendicular direction to a contact surface of the resin molding that is in contact with the insulating sheet. An angle of inclination of the side surface relative to the perpendicular direction is 3 degrees or larger and 17 degrees or smaller.

Abstract: A semiconductor module includes a semiconductor device; a metal plate portion that includes a first surface on a side of the semiconductor device and has a fastening portion at an end thereof; a molded portion that is formed by molding a resin on the semiconductor device and the metal plate portion, a cooling plate portion that is a separate member from the metal plate portion, is provided on a side opposite to the first surface on the side of the semiconductor device, and includes fins on a side opposite to the side of the metal plate portion; wherein the fastening portion of the metal plate portion is exposed out of the molded portion, and the cooling plate portion includes a fastening portion at a position that corresponds to a position of the fastening portion of the metal plate portion.

Abstract: Using coupons effectively is enabled. A host computer 18 that functions as a printing device has a vehicle information acquisition unit 25a that acquires vehicle information related to the vehicle a passenger boards, and a coupon production unit 25b that prints a code representing the vehicle information acquired by the vehicle information acquisition unit 25a on a coupon, and produces a coupon that is provided to the passenger.

Abstract: A semiconductor module which includes a semiconductor device; a wiring member that is connected to the semiconductor device; a cooling plate that includes a first surface on a side of the semiconductor device and a second surface on a side opposite to the first surface and has a fastening portion at an end thereof in a first direction; and a molded portion that is formed by molding a resin on the semiconductor device, the wiring member and the cooling plate, wherein the fastening portion is exposed out of the molded portion, and a terminal portion of the wiring member is exposed out of the molded portion such that the terminal portion of the wiring member extends in a second direction which is substantially perpendicular to the first direction.

Abstract: A semiconductor apparatus 10 includes a radiator 30 on which plural semiconductor modules 20 that include semiconductor elements 21 are mounted, the semiconductor apparatus 10 characterized by the radiator 30 including a first main surface 30B and a second main surface 30C configured to be located on the opposite side of the first main surface 30B. Semiconductor module mount-surfaces 30B1, 30B2, 30C1, 30C2 are arranged in the first main surface 30B and the second main surface 30C in a zigzag pattern in cross-sectional view; and the semiconductor modules 20 are mounted onto some or all of the semiconductor module mount-surfaces 30B1, 30B2, 30C1, 30C2.

Abstract: A semiconductor module which includes a semiconductor device; a wiring member that is connected to the semiconductor device; a cooling plate that includes a first surface on a side of the semiconductor device and a second surface on a side opposite to the first surface and has a fastening portion at an end thereof in a first direction; and a molded portion that is formed by molding a resin on the semiconductor device, the wiring member and the cooling plate, wherein the fastening portion is exposed out of the molded portion, and a terminal portion of the wiring member is exposed out of the molded portion such that the terminal portion of the wiring member extends in a second direction which is substantially perpendicular to the first direction.

Abstract: A semiconductor module includes a semiconductor device; a metal plate portion that includes a first surface on a side of the semiconductor device and has a fastening portion at an end thereof; a molded portion that is formed by molding a resin on the semiconductor device and the metal plate portion, a cooling plate portion that is a separate member from the metal plate portion, is provided on a side opposite to the first surface on the side of the semiconductor device, and includes fins on a side opposite to the side of the metal plate portion; wherein the fastening portion of the metal plate portion is exposed out of the molded portion, and the cooling plate portion includes a fastening portion at a position that corresponds to a position of the fastening portion of the metal plate portion.

Abstract: A semiconductor apparatus 10 includes a radiator 30 on which plural semiconductor modules 20 that include semiconductor elements 21 are mounted, the semiconductor apparatus 10 characterized by the radiator 30 including a first main surface 30B and a second main surface 30C configured to be located on the opposite side of the first main surface 30B. Semiconductor module mount-surfaces 30B1, 30B2, 30C1, 30C2 are arranged in the first main surface 30B and the second main surface 30C in a zigzag pattern in cross-sectional view; and the semiconductor modules 20 are mounted onto some or all of the semiconductor module mount-surfaces 30B1, 30B2, 30C1, 30C2.