Patents by Inventor Kiyohiro Hine
Kiyohiro Hine has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11515281Abstract: There is provided a bonding material which forms a bonding portion between two objects, which material contains (1) first metal particles comprising a first metal and having a median particle diameter in the range of 20 nm to 1 ?m, and (2) second metal particles comprising, as a second metal, at least one alloy of Sn and at least one selected from Bi, In and Zn and having a melting point of not higher than 200° C.Type: GrantFiled: April 13, 2020Date of Patent: November 29, 2022Assignee: PANASONIC HOLDINGS CORPORATIONInventors: Akio Furusawa, Shinji Ishitani, Kiyohiro Hine
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Patent number: 11515280Abstract: A mounting structure is used, which includes: a semiconductor element including an element electrode; a metal member; and a sintered body configured to bond the semiconductor element and the metal member is used, in which the sintered body contains a first metal and a second metal solid-dissolved in the first metal, the second metal is a metal having a diffusion coefficient in the first metal larger than a self-diffusion coefficient of the first metal, and a content ratio of the second metal relative to a total mass of the first metal and the second metal in the sintered body is equal to or lower than a solid solution limit of the second metal to the first metal.Type: GrantFiled: February 13, 2020Date of Patent: November 29, 2022Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.Inventors: Kiyohiro Hine, Hidetoshi Kitaura, Akio Furusawa
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Patent number: 11476399Abstract: A jointing material includes: at least one type of element at 0.1 wt % to 30 wt %, the element being capable of forming a compound with each of tin and carbon; and tin at 70 wt % to 99.9 wt % as a main component.Type: GrantFiled: November 20, 2018Date of Patent: October 18, 2022Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.Inventors: Hidetoshi Kitaura, Akio Furusawa, Kiyohiro Hine
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Patent number: 11318534Abstract: To provide a method for efficiently producing metal microparticles having a particle diameter of 1 ?m to 10 ?m, and a device for producing the same. A metal microparticle production method is used, which includes a particle generating step of generating primary particles by irradiating a metal lump in a solvent in a first tank with an ultrasonic wave, and a particle splitting step of irradiating the primary particles with an ultrasonic wave in a solvent in a second tank and splitting the primary particles to produce secondary particles.Type: GrantFiled: October 7, 2019Date of Patent: May 3, 2022Assignee: Panasonic Intellectual Property Management Co., Ltd.Inventors: Akio Furusawa, Kiyohiro Hine, Shinji Ishitani, Misato Takahashi
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Patent number: 11135683Abstract: A solder alloy, includes: about 3 wt % to about 15 wt % of Sb; about 0.01 wt % to about 1.5 wt % of Te; and about 0.005 wt % to about 1 wt % of at least one element selected from the group consisting of Zn, Co, and Cr; and a balance of Sn.Type: GrantFiled: September 20, 2018Date of Patent: October 5, 2021Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.Inventors: Hidetoshi Kitaura, Akio Furusawa, Kiyohiro Hine
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Patent number: 10960496Abstract: There is provided a solder alloy in which 0.5 mass % or more and 1.25 mass % or less of Sb, In satisfying the following formula (I) or (II) when [Sb] is set as a Sb content percentage (mass %) and [In] is set as an In content percentage (mass %): in a case of 0.5?[Sb]?1.0, 5.5?[In]?5.50+1.06[Sb] . . . (I), in a case of 1.0<[Sb]?1.25, 5.5?[In]?6.35+0.212[Sb] . . . (II) (in the formula, [Sb] indicates a Sb content percentage (mass %) and [In] indicates an In content percentage (mass %)), 0.5 mass % or more and 1.2 mass % or less of Cu, 0.1 mass % or more and 3.0 mass % or less of Bi, 1.0 mass % or more and 4.0 mass % or less of Ag, and 0 mass % or more and 0.025 mass % or less of Co are contained, and has the remainder consisting essentially of Sn.Type: GrantFiled: April 28, 2017Date of Patent: March 30, 2021Assignee: Panasonic Intellectual Property Management Co., Ltd.Inventors: Shinnosuke Akiyama, Kiyohiro Hine, Hidetoshi Kitaura, Akio Furusawa
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Publication number: 20200335470Abstract: There is provided a bonding material which forms a bonding portion between two objects, which material contains (1) first metal particles comprising a first metal and having a median particle diameter in the range of 20 nm to 1 ?m, and (2) second metal particles comprising, as a second metal, at least one alloy of Sn and at least one selected from Bi, In and Zn and having a melting point of not higher than 200° C.Type: ApplicationFiled: April 13, 2020Publication date: October 22, 2020Applicant: Panasonic CorporationInventors: Akio FURUSAWA, Shinji ISHITANI, Kiyohiro HINE
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Publication number: 20200185347Abstract: A mounting structure is used, which includes: a semiconductor element including an element electrode; a metal member; and a sintered body configured to bond the semiconductor element and the metal member is used, in which the sintered body contains a first metal and a second metal solid-dissolved in the first metal, the second metal is a metal having a diffusion coefficient in the first metal larger than a self-diffusion coefficient of the first metal, and a content ratio of the second metal relative to a total mass of the first metal and the second metal in the sintered body is equal to or lower than a solid solution limit of the second metal to the first metal.Type: ApplicationFiled: February 13, 2020Publication date: June 11, 2020Inventors: KIYOHIRO HINE, HIDETOSHI KITAURA, AKIO FURUSAWA
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Publication number: 20200130064Abstract: To provide a method for efficiently producing metal microparticles having a particle diameter of 1 ?m to 10 ?m, and a device for producing the same. A metal microparticle production method is used, which includes a particle generating step of generating primary particles by irradiating a metal lump in a solvent in a first tank with an ultrasonic wave, and a particle splitting step of irradiating the primary particles with an ultrasonic wave in a solvent in a second tank and splitting the primary particles to produce secondary particles.Type: ApplicationFiled: October 7, 2019Publication date: April 30, 2020Inventors: AKIO FURUSAWA, KIYOHIRO HINE, SHINJI ISHITANI, MISATO TAKAHASHI
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Patent number: 10636724Abstract: A mount structure having a joining capable of withstanding development of cracks generated by thermal stress due to repeated temperature changes in a mount structure having the joining of a large area is formed by joining a ceramic substrate electrode of a ceramic substrate and a metal substrate electrode of a metal substrate by a laminate, in which the laminate is formed by stacking a first interface layer, a first solder joining portion, a second interface layer, a first buffer material electrode, a buffer material, a second buffer material electrode, a third interface layer, a second solder joining portion and a fourth interface layer in this order from the ceramic substrate electrode toward the metal substrate electrode, a thickness of the laminate is 30 ?m or more and 100 ?m or less, a difference between a thickness of the first solder joining portion and a thickness of the second solder joining portion is within 25%, and differences in elastic moduli and in linear expansion coefficients between the firsType: GrantFiled: April 10, 2018Date of Patent: April 28, 2020Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTTD.Inventors: Kiyohiro Hine, Akio Furusawa, Hidetoshi Kitaura, Kazuki Sakai
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Patent number: 10493567Abstract: A solder alloy of the disclosure includes Sb of which a content is in a range of 3 wt % to 30 wt %, Te of which a content is in a range of 0.01 wt % to 1.5 wt %, Au of which a content is in a range of 0.005 wt % to 1 wt %, at least one of Ag and Cu, wherein a content rate of at least one of Ag and Cu in the solder alloy is in a range of 0.1 wt % to 20 wt %; and a content rate of a sum of Ag and Cu in the solder alloy is in a range of 0.1 wt % to 20 wt %; and a balance of Sn.Type: GrantFiled: April 10, 2018Date of Patent: December 3, 2019Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.Inventors: Kazuki Sakai, Akio Furusawa, Hidetoshi Kitaura, Kiyohiro Hine
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Publication number: 20190165234Abstract: A jointing material includes: at least one type of element at 0.1 wt % to 30 wt %, the element being capable of forming a compound with each of tin and carbon; and tin at 70 wt % to 99.9 wt % as a main component.Type: ApplicationFiled: November 20, 2018Publication date: May 30, 2019Inventors: Hidetoshi KITAURA, Akio FURUSAWA, Kiyohiro HINE
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Publication number: 20190099840Abstract: A solder alloy, includes: about 3 wt % to about 15 wt % of Sb; about 0.01 wt % to about 1.5 wt % of Te; and about 0.005 wt % to about 1 wt % of at least one element selected from the group consisting of Zn, Co, and Cr; and a balance of Sn.Type: ApplicationFiled: September 20, 2018Publication date: April 4, 2019Inventors: HIDETOSHI KITAURA, AKIO FURUSAWA, KIYOHIRO HINE
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Patent number: 10170442Abstract: A mount structure includes two members that are bonded to each other with a bonding material layer having a first interface layer and a second interface layer at the interfaces with the two members. The bonding material layer contains a first intermetallic compound and a stress relaxation material. The first intermetallic compound has a spherical, a columnar, or an oval spherical shape, and the same crystalline structure as the first interface layer and the second interface layer, and partly closes the space between the first interface layer and the second interface layer. The stress relaxation material contains tin as a main component, and fills around the first intermetallic compound.Type: GrantFiled: October 30, 2017Date of Patent: January 1, 2019Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.Inventors: Kiyohiro Hine, Akio Furusawa, Hidetoshi Kitaura, Kazuki Sakai
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Publication number: 20180331013Abstract: A mount structure having a joining capable of withstanding development of cracks generated by thermal stress due to repeated temperature changes in a mount structure having the joining of a large area is formed by joining a ceramic substrate electrode of a ceramic substrate and a metal substrate electrode of a metal substrate by a laminate, in which the laminate is formed by stacking a first interface layer, a first solder joining portion, a second interface layer, a first buffer material electrode, a buffer material, a second buffer material electrode, a third interface layer, a second solder joining portion and a fourth interface layer in this order from the ceramic substrate electrode toward the metal substrate electrode, a thickness of the laminate is 30 ?m or more and 100 ?m or less, a difference between a thickness of the first solder joining portion and a thickness of the second solder joining portion is within 25%, and differences in elastic moduli and in linear expansion coefficients between the firsType: ApplicationFiled: April 10, 2018Publication date: November 15, 2018Inventors: KIYOHIRO HINE, AKIO FURUSAWA, HIDETOSHI KITAURA, KAZUKI SAKAI
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Publication number: 20180326542Abstract: A solder alloy of the disclosure includes Sb of which a content is in a range of 3 wt % to 30 wt %, Te of which a content is in a range of 0.01 wt % to 1.5 wt %, Au of which a content is in a range of 0.005 wt % to 1 wt %, at least one of Ag and Cu, wherein a content rate of at least one of Ag and Cu in the solder alloy is in a range of 0.1 wt % to 20 wt %; and a content rate of a sum of Ag and Cu in the solder alloy is in a range of 0.1 wt % to 20 wt %; and a balance of Sn.Type: ApplicationFiled: April 10, 2018Publication date: November 15, 2018Inventors: KAZUKI SAKAI, AKIO FURUSAWA, HIDETOSHI KITAURA, KIYOHIRO HINE
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Publication number: 20180257179Abstract: Provided is a solder alloy including an Sb content of 3 wt % or more and 15 wt % or less, a Te content of 0.01 wt % or more and 1.5 wt % or less, an Au content of 0.005 wt % or more and 1 wt % or less, and a remainder that is Sn.Type: ApplicationFiled: February 15, 2018Publication date: September 13, 2018Inventors: HIDETOSHI KITAURA, AKIO FURUSAWA, KIYOHIRO HINE, KAZUKI SAKAI
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Patent number: 10068869Abstract: A mounting structure includes a BGA including a BGA electrode, a circuit board including a circuit board electrode, and a solder joining portion which is arranged on the circuit board electrode and is connected to the BGA electrode. The solder joining portion is formed of Cu having a content ratio in a range from 0.6 mass % to 1.2 mass %, inclusive, Ag having a content ratio in a range from 3.0 mass % to 4.0 mass %, inclusive, Bi having a content ratio in a range from 0 mass % to 1.0 mass %, inclusive, In, and Sn. A range of the content ratio of In is different according to the content ratio of Cu.Type: GrantFiled: October 12, 2015Date of Patent: September 4, 2018Assignee: Panasonic Intellectual Property Management Co., Ltd.Inventors: Kiyohiro Hine, Akio Furusawa, Masato Mori, Taichi Nakamura, Hidetoshi Kitaura
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Publication number: 20180166411Abstract: A mount structure includes two members that are bonded to each other with a bonding material layer having a first interface layer and a second interface layer at the interfaces with the two members. The bonding material layer contains a first intermetallic compound and a stress relaxation material. The first intermetallic compound has a spherical, a columnar, or an oval spherical shape, and the same crystalline structure as the first interface layer and the second interface layer, and partly closes the space between the first interface layer and the second interface layer. The stress relaxation material contains tin as a main component, and fills around the first intermetallic compound.Type: ApplicationFiled: October 30, 2017Publication date: June 14, 2018Inventors: KIYOHIRO HINE, AKIO FURUSAWA, HIDETOSHI KITAURA, KAZUKI SAKAI
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Patent number: 9981348Abstract: A solder alloy is substantially Ag-free and has desirable neat-resistance fatigue characteristics in a high-temperature environment as high as 150° C., even when used for soldering of electronic components having no leads. The solder alloy contains Sb, In, Cu, and Bi, and Sn accounting for the remainder, and satisfies the following formulae: 0.5?[Sb]?1.25 0.66[Sb]+4.16?[In]?6.0 0.5?[Cu]?1.2 0.1?[Bi]?0.5, wherein [Sb], [In], [Cu], and [Bi] represent the contents of Sb, In, Cu, and Bi, respectively, in mass %.Type: GrantFiled: September 15, 2016Date of Patent: May 29, 2018Assignee: Panasonic Intellectual Property Management Co., Ltd.Inventors: Kiyohiro Hine, Akio Furusawa, Hidetoshi Kitaura