Patents by Inventor Kiyoji Imanaka

Kiyoji Imanaka has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Process of raising a semiconductor device out of a pallet using a positioning rod
    Patent number: 5565008
    Abstract: A method of manufacturing semiconductor devices includes accommodating the semiconductor devices in the form of semimanufactures in accomodating tools having uniform outer dimensions regardless of the type of the semiconductor devices; receiving the semiconductor devices in the form of semimanufactures in each of a plurality of processing devices while maintaining the semiconductor devices in the accomodating tools; and processing the semiconductor devices in the form of semimanufactures in each of a plurality of processing devices.
    Type: Grant
    Filed: April 28, 1994
    Date of Patent: October 15, 1996
    Assignee: Mitsubishi Denki Kabushiki Kaisha
    Inventors: Kunihiro Shigetomo, Jiro Takamura, Kunio Kobayashi, Kiyoji Imanaka
  • Testing apparatus for semiconductor devices
    Patent number: 4904934
    Abstract: A testing apparatus includes a turntable, a driving device for rotating the turntable by a predetermined angle, and a plurality of pallets symmetrically fixed on the turntable around a center of rotation of the turntable. Each pallet holds a plurality of semiconductor devices and has electrode patterns for connection to leads of the semiconductor devices. A tester for testing the semiconductor devices is electrically connected with the electrode patterns of one of the pallets located at a first position in the rotation of the turntable by a connecting device. An exchanging device exchanges the semiconductor devices for new ones on one of the pallets located at a second position in the rotation of the turntable. A cover covers the turntable except around the second position. A heating device heats the inside of the cover to maintain the semiconductor devices held on the pallets in the cover at a high temperature.
    Type: Grant
    Filed: October 19, 1988
    Date of Patent: February 27, 1990
    Assignee: Mitsubishi Denki Kabushiki Kaisha
    Inventors: Ryouji Nishihashi, Kiyoji Imanaka, Katsuji Kawaguchi, Hidekazu Iwasaki
  • Method of making plastic encapsulated semiconductor devices
    Patent number: 4283838
    Abstract: The present invention provides a plastic encapsulated semiconductor device which comprises a connected metal plate having a plurality of semiconductor element holding parts which are connected in series in one direction with at least two connecting arms, said connecting arms having sectional area smaller than that of said semiconductor element holding part and being disposed inside of the side surface of said semiconductor element holding parts in the connecting direction.The invention provides a method of preparing semiconductor devices having relatively large current capacity of about 5 to 50 amperes used as diodes for automobiles and having high quality in the mass production.
    Type: Grant
    Filed: February 12, 1979
    Date of Patent: August 18, 1981
    Assignee: Mitsubishi Denki Kabushiki Kaisha
    Inventors: Masahiro Yamane, Toshimi Watanabe, Keiji Itoga, Kiyoshi Ishibashi, Yutaka Morita, Isamu Yamamoto, Kiyoji Imanaka