Abstract: A disk device includes a magnetic disk, a magnetic head, a flexible printed circuit board, an electronic component, and a wall. The flexible printed circuit board is electrically connected to the magnetic head. The electronic component is mounted on the flexible printed circuit board. The wall has rigidity higher than the flexible printed circuit board and is attached to the flexible printed circuit board. The flexible printed circuit board with a first through hole includes a first surface facing the electronic component with a gap, and a second surface opposite the first surface and facing the wall, the first through hole being open to the first surface and the second surface to communicate with the gap. The wall is provided with a second through hole penetrating the wall to communicate with the first through hole.

Abstract: According to an embodiment, an electronic device includes a substrate and an electronic component. The substrate includes a first surface facing a first direction and to which a first hole and a second hole are open. The electronic component includes a base, a first protrusion in the first hole, and a second protrusion in the second hole. The first protrusion and the second protrusion protrude from the base. The first end of the first protrusion is more apart from the first surface than the second end of the second protrusion. The first protrusion and the second protrusion have a first inclined surface and a second inclined surface extending obliquely with respect to the first direction. In a third direction orthogonal to the first direction the first inclined surface is longer in length than the second inclined surface.

Abstract: A disk device includes a magnetic disk, a magnetic head, a flexible printed circuit board, an electronic component, and a wall. The flexible printed circuit board is electrically connected to the magnetic head. The electronic component is mounted on the flexible printed circuit board. The wall has rigidity higher than the flexible printed circuit board and is attached to the flexible printed circuit board. The flexible printed circuit board with a first through hole includes a first surface facing the electronic component with a gap, and a second surface opposite the first surface and facing the wall, the first through hole being open to the first surface and the second surface to communicate with the gap. The wall is provided with a second through hole penetrating the wall to communicate with the first through hole.

Abstract: According to one embodiment, a printed circuit board includes a base substrate, a first pad located on the base substrate, a second pad located on the base substrate alongside the first pad with respect to a first direction X with a gap therebetween and a solder resist covering the base substrate and including a cavity portion in a position overlapping the first pad and the second pad, the solder resist including a first protruding portion projecting in a second direction crossing the first direction and a second protruding portion projecting in the second direction on an opposite side to the first protruding portion, and the first protruding portion and the second protruding portion each overlap the gap, an end of the first pad on a gap side, and an end of the second pad on a gap side.

Abstract: According to one embodiment, an electronic device includes a housing with a through-hole, a flexible printed circuit inserted through the through hole and including a first connection portion on an inner side of the housing with first connection pads and a second connection portion on an outer side of the housing with second connection pads, a first electrical component in the housing, and a first connector connected to the first electrical component and including connection terminals contacting the first connection pads. A first pad of the first connection pads is greater than other first connection pads.

Abstract: According to one embodiment, a printed circuit board includes a base substrate, a first pad located on the base substrate, a second pad located on the base substrate alongside the first pad with respect to a first direction X with a gap therebetween and a solder resist covering the base substrate and including a cavity portion in a position overlapping the first pad and the second pad, the solder resist including a first protruding portion projecting in a second direction crossing the first direction and a second protruding portion projecting in the second direction on an opposite side to the first protruding portion, and the first protruding portion and the second protruding portion each overlap the gap, an end of the first pad on a gap side, and an end of the second pad on a gap side.

Abstract: According to one embodiment, a wiring board is disclosed. The wiring board includes a first insulating layer, a first conductive pattern, and a first conductive layer. The first conductive pattern is provided in the first insulating layer. The first conductive layer faces part of the first conductive pattern via the first insulating layer and is in an electrically floating state.

Abstract: According to one embodiment, an electronic device includes a housing with a through-hole, a flexible printed circuit inserted through the through hole and including a first connection portion on an inner side of the housing with first connection pads and a second connection portion on an outer side of the housing with second connection pads, a first electrical component in the housing, and a first connector connected to the first electrical component and including connection terminals contacting the first connection pads. A first pad of the first connection pads is greater than other first connection pads.

Abstract: An electronic device includes a housing having a first opening, an electric component in the housing, and a circuit board attached to the housing, having as outer surface, covering the first opening, and at least partially exposed to an outside of the housing. The circuit board includes first conductors exposed to the outside of the housing, and a second conductor that extends along the outer surface and is insulated from the plurality of first conductors. The electronic device further includes a connector mounted in the outer surface. The connector includes contactors electrically connected to the first conductors, and a support base having a second opening and supporting the contactors so as to be elastically deformable. The circuit board includes third conductors at positions overlapping the contactors. The third conductors are insulated from the first conductors and the second conductor, and provide gas sealing or electromagnetic shielding effects.

Abstract: An electronic device includes a housing having a first opening, an electric component in the housing, and a circuit board attached to the housing having an outer surface that covers the first opening and at least partially exposed to an outside of the housing. The circuit board includes first conductors exposed to the outside of the housing in the outer surface, and a second conductor that extends along the outer surface and is insulated from the plurality of first conductors. The electronic device further includes a first connector mounted in the outer surface. The first connector includes contactors electrically connected to the first conductors, and a support base having a second opening through the circuit board in a thickness direction and elastically deformable in the second opening. The circuit board includes third conductors at positions overlapping the contactors and insulated from the first conductors and the second conductor.

Abstract: A semiconductor device package includes a substrate having a first surface and a second surface that is opposite to the first surface, a plurality of solder joints disposed on the first surface of the substrate, a semiconductor chip disposed above the second surface of the substrate, and a support member disposed between the second surface of the substrate and the semiconductor chip. At least one of the solder joints is in contact with the first surface of the substrate opposite to a region on the second surface in which the support member is not disposed.

Abstract: According to one embodiment, an electronic apparatus includes a housing, a board in the housing, a pad on the board, and a component. The pad includes a first portion and a second portion. The second portion includes a protrusion toward the first portion. The component includes a first electrode connected to the first portion and a second electrode connected to the second portion.

Abstract: In one embodiment, there is provided a wiring substrate. The wiring substrate includes: a substrate body comprising a first surface and a second surface opposite to the first surface, wherein the substrate body has a plurality of first through holes; a plurality of first pads on the first surface of the substrate body; a plurality of second pads on the first surface of the substrate body, wherein the second pads are surrounded by the first pads. Each of the second pads has at least one second through hole, and the second pads are disposed on the first surface of the substrate body such that each of the second through holes is communicated with a corresponding one of the first through holes.

Abstract: According to one embodiment, an electronic apparatus includes a housing, a board in the housing, a pad on the board, and a component. The pad includes a first portion and a second portion. The second portion includes a protrusion toward the first portion. The component includes a first electrode connected to the first portion and a second electrode connected to the second portion.

Abstract: According to one embodiment, an electronic device includes an electronic component and a circuit board. The electronic component includes a metal material. The circuit board includes a first surface on which the electronic component is mounted and a second surface opposite the first surface. The electronic component includes a contact surface configured to be in contact with the first surface, and is configured to have the center of gravity at a location displaced from the center of the contact surface. The electronic component is temporarily fixed by a magnetic force that attracts the metal material from the second surface with the contact surface being in contact with the first surface.

Abstract: According to one embodiment, an electronic apparatus includes a housing, a printed wiring board accommodated in the housing, and a circuit component electrically connected to the printed wiring board, the circuit component including an outer peripheral surface. The printed wiring board includes an outer peripheral edge, at least a pair of edge portions extending in mutually crossing directions, the pair of edge portions being opposed to the outer peripheral surface of the circuit component and being located inside the outer peripheral edge, and a projection portion located between the pair of edge portions and projecting toward the circuit component.

Abstract: According to one embodiment, an electronic device includes a housing, a circuit board, and a component. The circuit board is provided in the housing, and includes a first pad and a second pad exposed on the surface. The component includes a first electrode and a second electrode. The first electrode is exposed on the circuit board-facing surface of the component fading the surface of the circuit board and bonded to the first pad via a bonding agent. The second electrode is exposed on the circuit board-facing surface and bonded to the second pad via a bonding agent. The second electrode is wider than the first electrode and projects more than the first electrode does.

Abstract: According to one embodiment, an electronic apparatus includes a housing, a printed wiring board accommodated in the housing, and a circuit component electrically connected to the printed wiring board, the circuit component including an outer peripheral surface. The printed wiring board includes an outer peripheral edge, at least a pair of edge portions extending in mutually crossing directions, the pair of edge portions being opposed to the outer peripheral surface of the circuit component and being located inside the outer peripheral edge, and a projection portion located between the pair of edge portions and projecting toward the circuit component.

Abstract: According to one embodiment, an electronic device includes an electronic component and a circuit board. The electronic component includes a metal material. The circuit board includes a first surface on which the electronic component is mounted and a second surface opposite the first surface. The electronic component includes a contact surface configured to be in contact with the first surface, and is configured to have the center of gravity at a location displaced from the center of the contact surface. The electronic component is temporarily fixed by a magnetic force that attracts the metal material from the second surface with the contact surface being in contact with the first surface.

Abstract: A printed wiring board includes: a component mounting region; a plurality of electrode pads arranged at a peripheral edge portion of the component mounting region; a solder resist film that coats the component mounting region; and a plurality of solder bonding faces arranged at a region surrounded by the plurality of electrode pads. The solder resist film and the plurality of solder bonding faces form an island-shaped pattern such that the plurality of solder bonding faces are isolated with each other by the solder resist film.