Patents by Inventor Kiyokazu Sato
Kiyokazu Sato has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10854373Abstract: An inductor device includes a resin film, a first base conductor layer formed on one surface of the resin film and having a first pad, a second base conductor layer formed on the other surface of the resin film and having a second pad, a through-hole penetrating from the first pad to the second pad, a through conductor filled in the through-hole and provided to connect the first pad and the second pad each other, a first insulating layer formed on the one surface of the resin film and having an opening arranged on the first base conductor layer, and a first conductor part formed on the first base conductor layer in the opening of the first insulating layer. A first conductor pattern layer includes the first base conductor layer and the first conductor part. The first conductor pattern layer has a convex sectional shape.Type: GrantFiled: January 25, 2018Date of Patent: December 1, 2020Assignee: SHINKO ELECTRIC INDUSTRIES CO., LTD.Inventors: Tsukasa Nakanishi, Kiyokazu Sato, Osamu Hoshino
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Patent number: 10395810Abstract: An inductor includes a stacked body with a plurality of structural bodies that are stacked. Each of the plurality of structural bodies includes a wiring and an insulation layer formed on the wiring. The wirings of the plurality of structural bodies are connected in series to form a helical coil. The inductor further includes a through hole, which extends through the stacked body in a thickness direction of the stacked body, and a plurality of discrete insulation films, which are spaced apart from each other and cover surfaces of the wires of the plurality of structural bodies exposed from a surface of the stacked body.Type: GrantFiled: October 16, 2015Date of Patent: August 27, 2019Assignee: Shinko Electric Industries Co., Ltd.Inventors: Atsushi Nakamura, Tsukasa Nakanishi, Kiyokazu Sato, Yasuyoshi Horikawa
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Patent number: 10079924Abstract: Provided is an electronic device that can be appropriately used as a type of electronic device that vibrates a panel attached to a housing. The electronic device includes a piezoelectric element, a panel, to which the piezoelectric element is attached, that vibrates due to the piezoelectric element to generate a vibration sound transmitted by vibrating a part of a human body, a housing supporting the panel with a first face, a microphone contained within the housing and disposed on a second face, and a buffer that damps vibration transmitted from the panel to the microphone through the first face and/or the second face, thereby reducing noise picked up by the microphone.Type: GrantFiled: April 25, 2013Date of Patent: September 18, 2018Assignee: KYOCERA CorporationInventors: Toshihisa Nabata, Satoshi Mizuta, Tomoaki Miyano, Kiyokazu Sato, Akio Kihara, Shun Kazama, Yasuhiro Katayama
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Publication number: 20180218830Abstract: An inductor device includes a resin film, a first base conductor layer formed on one surface of the resin film and having a first pad, a second base conductor layer formed on the other surface of the resin film and having a second pad, a through-hole penetrating from the first pad to the second pad, a through conductor filled in the through-hole and provided to connect the first pad and the second pad each other, a first insulating layer formed on the one surface of the resin film and having an opening arranged on the first base conductor layer, and a first conductor part formed on the first base conductor layer in the opening of the first insulating layer. A first conductor pattern layer includes the first base conductor layer and the first conductor part. The first conductor pattern layer has a convex sectional shape.Type: ApplicationFiled: January 25, 2018Publication date: August 2, 2018Inventors: Tsukasa Nakanishi, Kiyokazu Sato, Osamu Hoshino
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Publication number: 20180166374Abstract: A wiring substrate includes a flexible insulation substrate, a first wiring layer formed on an upper surface of the insulation substrate, a second wiring layer formed on a lower surface of the insulation substrate, and through wiring bonded to the first wiring layer and the second wiring layer and formed in a through hole extending through the first wiring layer, the insulation substrate, and the second wiring layer. The through wiring includes a projection that extends along a lower surface of the second wiring layer located outside the through hole. An upper surface of the through wiring is flush with an upper surface of the first wiring layer.Type: ApplicationFiled: November 7, 2017Publication date: June 14, 2018Inventors: KIYOKAZU SATO, MITSUYOSHI IMAI, OSAMU HOSHINO
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Patent number: 9997448Abstract: A wiring substrate includes a flexible insulation substrate, a first wiring layer formed on an upper surface of the insulation substrate, a second wiring layer formed on a lower surface of the insulation substrate, and through wiring bonded to the first wiring layer and the second wiring layer and formed in a through hole extending through the first wiring layer, the insulation substrate, and the second wiring layer. The through wiring includes a projection that extends along a lower surface of the second wiring layer located outside the through hole. An upper surface of the through wiring is flush with an upper surface of the first wiring layer.Type: GrantFiled: November 7, 2017Date of Patent: June 12, 2018Assignee: Shinko Electric Industries Co., LtdInventors: Kiyokazu Sato, Mitsuyoshi Imai, Osamu Hoshino
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Patent number: 9966184Abstract: An inductor includes a stacked body having a first through hole, and an insulation film covering the stacked body. The stacked body includes a first wiring, a first insulation layer stacked on the first wiring and including a second through hole exposing the first wiring, a first adhesive layer stacked on the first insulation layer and including a third through hole communicating with the second through hole, a second wiring stacked on the first adhesive layer and including a fourth through hole communicating with the third through hole, a second insulation layer stacked on the second wiring and including a fifth through hole communicating with the fourth through hole, and a first through electrode with which the second to fifth through holes are filled. The first and second wirings are connected to form a helical coil. The fifth through hole has a larger planar shape than the fourth through hole.Type: GrantFiled: June 29, 2016Date of Patent: May 8, 2018Assignee: Shinko Electric Industries Co., Ltd.Inventors: Atsushi Nakamura, Tsukasa Nakanishi, Kiyokazu Sato
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Patent number: 9859086Abstract: According to one embodiment, there is provided an ion source. The ion source includes a vacuum-exhausted vacuum chamber, a target which is set in the vacuum chamber and generates a plurality of valences of ions by irradiation of a laser beam, an acceleration electrode which is applied with voltage in order to accelerate the ions generated by the target, and an intermediate electrode which is provided between the target and the acceleration electrode and is applied with reverse voltage of the voltage applied to the acceleration electrode.Type: GrantFiled: March 1, 2013Date of Patent: January 2, 2018Assignee: KABUSHIKI KAISHA TOSHIBAInventors: Akiko Kakutani, Kiyoshi Hashimoto, Kiyokazu Sato, Akihiro Osanai, Takeshi Yoshiyuki, Tsutomu Kurusu
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Patent number: 9571932Abstract: Provided is an electronic device including: a housing; a vibration body disposed in the housing; and a microphone disposed in the housing. By vibrating the vibration body, the electronic device transmits air conduction sound and vibration sound that is generated by the vibration. During the generation of the sounds, howling reduction processing is performed, so that usability of the electronic device is improved.Type: GrantFiled: May 24, 2013Date of Patent: February 14, 2017Assignee: KYOCERA CorporationInventors: Tomoaki Miyano, Tomohiro Inagaki, Kenichi Ozasa, Satoshi Mizuta, Kiyokazu Sato
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Patent number: 9510105Abstract: Provided is an electronic device including a housing and an acoustic device configured to generate vibration sound that is transmitted through vibration of a part of a human body. The acoustic device includes a panel configured to be joined to the housing; a piezoelectric element configured to be joined to the panel for vibrating the panel; and a vibration adjusting unit configured to be joined to the panel and vibrated together with the panel by the piezoelectric element. With the above configuration, a frequency characteristic is improved.Type: GrantFiled: September 10, 2015Date of Patent: November 29, 2016Assignee: KYOCERA CorporationInventors: Toshihisa Nabata, Satoshi Mizuta, Tomoaki Miyano, Kiyokazu Sato, Akio Kihara, Shun Kazama, Yasuhiro Katayama
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Publication number: 20160343499Abstract: An inductor includes a stacked body with a plurality of structural bodies that are stacked. Each of the plurality of structural bodies includes a wiring and an insulation layer formed on the wiring. The wirings of the plurality of structural bodies are connected in series to form a helical coil. The inductor further includes a through hole, which extends through the stacked body in a thickness direction of the stacked body, and a plurality of discrete insulation films, which are spaced apart from each other and cover surfaces of the wires of the plurality of structural bodies exposed from a surface of the stacked body.Type: ApplicationFiled: October 16, 2015Publication date: November 24, 2016Inventors: Atsushi Nakamura, Tsukasa Nakanishi, Kiyokazu Sato, Yasuyoshi HORIKAWA
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Publication number: 20160307691Abstract: An inductor includes a stacked body having a first through hole, and an insulation film covering the stacked body. The stacked body includes a first wiring, a first insulation layer stacked on the first wiring and including a second through hole exposing the first wiring, a first adhesive layer stacked on the first insulation layer and including a third through hole communicating with the second through hole, a second wiring stacked on the first adhesive layer and including a fourth through hole communicating with the third through hole, a second insulation layer stacked on the second wiring and including a fifth through hole communicating with the fourth through hole, and a first through electrode with which the second to fifth through holes are filled. The first and second wirings are connected to form a helical coil. The fifth through hole has a larger planar shape than the fourth through hole.Type: ApplicationFiled: June 29, 2016Publication date: October 20, 2016Inventors: Atsushi Nakamura, Tsukasa Nakanishi, Kiyokazu Sato
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Patent number: 9472332Abstract: A coil substrate includes a plurality of structural bodies, each of which comprises a first insulating layer, a wiring formed on the first insulating layer and configured to serve as a part of a spiral coil, and a second insulating layer formed on the first insulating layer and configured to cover the wiring. The plurality of structural bodies are stacked via an adhesion layer. The spiral coil is formed by series-connecting the wirings of adjacent ones of the plurality of structural bodies.Type: GrantFiled: July 28, 2014Date of Patent: October 18, 2016Assignee: SHINKO ELECTRIC INDUSTRIES CO., LTD.Inventors: Atsushi Nakamura, Kiyokazu Sato
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Patent number: 9406432Abstract: An inductor includes a stacked body having a first through hole, and an insulation film covering the stacked body. The stacked body includes a first wiring, a first insulation layer stacked on the first wiring and including a second through hole exposing the first wiring, a first adhesive layer stacked on the first insulation layer and including a third through hole communicating with the second through hole, a second wiring stacked on the first adhesive layer and including a fourth through hole communicating with the third through hole, a second insulation layer stacked on the second wiring and including a fifth through hole communicating with the fourth through hole, and a first through electrode with which the second to fifth through holes are filled. The first and second wirings are connected to form a helical coil. The fifth through hole has a larger planar shape than the fourth through hole.Type: GrantFiled: May 7, 2015Date of Patent: August 2, 2016Assignee: Shinko Electric Industries Co., Ltd.Inventors: Atsushi Nakamura, Tsukasa Nakanishi, Kiyokazu Sato
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Patent number: 9392371Abstract: The content of sound leakage from a vibrating plate that vibrates due to a piezoelectric element is made difficult to recognize. An electronic device (1) according to the present invention includes a piezoelectric element (30) and a vibrating plate (10) that vibrates due to the piezoelectric element (30), the electronic device (1) causing the vibrating plate (10) to generate air-conducted sound and vibration sound that is transmitted by vibrating a part of a human body. The electronic device (1) also includes an air-conducted sound reducing unit that makes a portion or all of the air-conducted sound difficult to hear.Type: GrantFiled: April 12, 2013Date of Patent: July 12, 2016Assignee: KYOCERA CorporationInventors: Toshihisa Nabata, Satoshi Mizuta, Tomoaki Miyano, Kiyokazu Sato, Akio Kihara, Shun Kazama, Yasuhiro Katayama
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Patent number: 9386683Abstract: One embodiment of a particle accelerator includes: a particle source from which a particle beam is extracted with a beam pulse width of not greater than 2 ?sec; a linear accelerator for accelerating the particle beam extracted from the particle source; a synchrotron for receiving the particle beam transported thereto from the linear accelerator and causing the particle beam to circulate in order to accelerate it until it gets to a predetermined energy level; a bump electromagnet for shifting the circulating path of the particle beam each time it makes a full turn; and a control unit for controlling the extent of magnetic excitation of the bump electromagnet and for controlling the timing of magnetic excitation of the bump electromagnet according to the pulse timing of the particle source.Type: GrantFiled: February 4, 2014Date of Patent: July 5, 2016Assignee: Kabushiki Kaisha ToshibaInventors: Akiko Kakutani, Kiyokazu Sato, Takeshi Yoshiyuki, Takashi Yazawa
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Patent number: 9380140Abstract: An electronic apparatus that may reduce sound leakage from a housing and the like vibrated by a vibrator and echo caused by the sound leakage is provided. An electronic apparatus includes a panel, a panel retainer for supporting the panel, and an element for vibrating the panel and thereby generating a vibration sound to be delivered via a human body, wherein a region of the panel near a disposing position of the element is thinner in a normal direction of the panel than a remaining region of the panel.Type: GrantFiled: July 26, 2013Date of Patent: June 28, 2016Assignee: KYOCERA CorporationInventors: Shun Kazama, Akio Kihara, Kiyokazu Sato
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Patent number: 9374057Abstract: An echo caused by sound leakage from a housing that vibrates due to a vibrating body is reduced. An electronic device (1) according to the present invention includes a piezoelectric element (30), a vibrating plate (10) that vibrates due to the piezoelectric element (30), microphones (42, 43), and an equalizer (44), the electronic device (1) causing the vibrating plate (10) to generate air-conducted sound and vibration sound that is transmitted by vibrating a part of a human body. The equalizer (44) makes a low-range emphasis setting, to emphasize a low frequency range more than a high frequency range of the air-conducted sound, when the volume of the air-conducted sound collected by the microphones (42, 43) exceeds a predetermined threshold.Type: GrantFiled: May 22, 2013Date of Patent: June 21, 2016Assignee: KYOCERA CorporationInventors: Toshihisa Nabata, Satoshi Mizuta, Tomoaki Miyano, Kiyokazu Sato, Akio Kihara, Shun Kazama
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Patent number: 9355809Abstract: According to one embodiments, an ion source connected with a vacuum-exhausted downstream apparatus is provided. The ion source includes a vacuum chamber which is vacuum-exhausted, a target which is set in the vacuum chamber and generates ions by irradiation of a laser beam, a transportation unit which transports the ions generated by the target to the downstream apparatus, and a vacuum sealing unit which seals the transportation unit so as to separate vacuum-conditions of the vacuum chamber side and the downstream apparatus side before exchanging the target set in the vacuum chamber.Type: GrantFiled: February 26, 2013Date of Patent: May 31, 2016Assignee: KABUSHIKI KAISHA TOSHIBAInventors: Akiko Kakutani, Kiyoshi Hashimoto, Kiyokazu Sato, Akihiro Osanai, Takeshi Yoshiyuki, Tsutomu Kurusu, Kazuo Hayashi
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Patent number: 9351080Abstract: An electronic device (1) is provided with a piezoelectric element (30), a panel (10) holding the piezoelectric element (30), and a housing (60) holding the panel (10) and transmitting vibration through the panel (10). The electronic device (1) causes the panel (10) to generate vibration sound that is transmitted by vibrating a part of a human body. The electronic device (1) includes a stiffness varying portion (62, 63) in which the stiffness of the housing (60) varies.Type: GrantFiled: April 26, 2013Date of Patent: May 24, 2016Assignee: KYOCERA CorporationInventors: Toshihisa Nabata, Satoshi Mizuta, Tomoaki Miyano, Kiyokazu Sato, Akio Kihara, Shun Kazama