Patents by Inventor Kiyokazu Sato

Kiyokazu Sato has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10854373
    Abstract: An inductor device includes a resin film, a first base conductor layer formed on one surface of the resin film and having a first pad, a second base conductor layer formed on the other surface of the resin film and having a second pad, a through-hole penetrating from the first pad to the second pad, a through conductor filled in the through-hole and provided to connect the first pad and the second pad each other, a first insulating layer formed on the one surface of the resin film and having an opening arranged on the first base conductor layer, and a first conductor part formed on the first base conductor layer in the opening of the first insulating layer. A first conductor pattern layer includes the first base conductor layer and the first conductor part. The first conductor pattern layer has a convex sectional shape.
    Type: Grant
    Filed: January 25, 2018
    Date of Patent: December 1, 2020
    Assignee: SHINKO ELECTRIC INDUSTRIES CO., LTD.
    Inventors: Tsukasa Nakanishi, Kiyokazu Sato, Osamu Hoshino
  • Patent number: 10395810
    Abstract: An inductor includes a stacked body with a plurality of structural bodies that are stacked. Each of the plurality of structural bodies includes a wiring and an insulation layer formed on the wiring. The wirings of the plurality of structural bodies are connected in series to form a helical coil. The inductor further includes a through hole, which extends through the stacked body in a thickness direction of the stacked body, and a plurality of discrete insulation films, which are spaced apart from each other and cover surfaces of the wires of the plurality of structural bodies exposed from a surface of the stacked body.
    Type: Grant
    Filed: October 16, 2015
    Date of Patent: August 27, 2019
    Assignee: Shinko Electric Industries Co., Ltd.
    Inventors: Atsushi Nakamura, Tsukasa Nakanishi, Kiyokazu Sato, Yasuyoshi Horikawa
  • Patent number: 10079924
    Abstract: Provided is an electronic device that can be appropriately used as a type of electronic device that vibrates a panel attached to a housing. The electronic device includes a piezoelectric element, a panel, to which the piezoelectric element is attached, that vibrates due to the piezoelectric element to generate a vibration sound transmitted by vibrating a part of a human body, a housing supporting the panel with a first face, a microphone contained within the housing and disposed on a second face, and a buffer that damps vibration transmitted from the panel to the microphone through the first face and/or the second face, thereby reducing noise picked up by the microphone.
    Type: Grant
    Filed: April 25, 2013
    Date of Patent: September 18, 2018
    Assignee: KYOCERA Corporation
    Inventors: Toshihisa Nabata, Satoshi Mizuta, Tomoaki Miyano, Kiyokazu Sato, Akio Kihara, Shun Kazama, Yasuhiro Katayama
  • Publication number: 20180218830
    Abstract: An inductor device includes a resin film, a first base conductor layer formed on one surface of the resin film and having a first pad, a second base conductor layer formed on the other surface of the resin film and having a second pad, a through-hole penetrating from the first pad to the second pad, a through conductor filled in the through-hole and provided to connect the first pad and the second pad each other, a first insulating layer formed on the one surface of the resin film and having an opening arranged on the first base conductor layer, and a first conductor part formed on the first base conductor layer in the opening of the first insulating layer. A first conductor pattern layer includes the first base conductor layer and the first conductor part. The first conductor pattern layer has a convex sectional shape.
    Type: Application
    Filed: January 25, 2018
    Publication date: August 2, 2018
    Inventors: Tsukasa Nakanishi, Kiyokazu Sato, Osamu Hoshino
  • Publication number: 20180166374
    Abstract: A wiring substrate includes a flexible insulation substrate, a first wiring layer formed on an upper surface of the insulation substrate, a second wiring layer formed on a lower surface of the insulation substrate, and through wiring bonded to the first wiring layer and the second wiring layer and formed in a through hole extending through the first wiring layer, the insulation substrate, and the second wiring layer. The through wiring includes a projection that extends along a lower surface of the second wiring layer located outside the through hole. An upper surface of the through wiring is flush with an upper surface of the first wiring layer.
    Type: Application
    Filed: November 7, 2017
    Publication date: June 14, 2018
    Inventors: KIYOKAZU SATO, MITSUYOSHI IMAI, OSAMU HOSHINO
  • Patent number: 9997448
    Abstract: A wiring substrate includes a flexible insulation substrate, a first wiring layer formed on an upper surface of the insulation substrate, a second wiring layer formed on a lower surface of the insulation substrate, and through wiring bonded to the first wiring layer and the second wiring layer and formed in a through hole extending through the first wiring layer, the insulation substrate, and the second wiring layer. The through wiring includes a projection that extends along a lower surface of the second wiring layer located outside the through hole. An upper surface of the through wiring is flush with an upper surface of the first wiring layer.
    Type: Grant
    Filed: November 7, 2017
    Date of Patent: June 12, 2018
    Assignee: Shinko Electric Industries Co., Ltd
    Inventors: Kiyokazu Sato, Mitsuyoshi Imai, Osamu Hoshino
  • Patent number: 9966184
    Abstract: An inductor includes a stacked body having a first through hole, and an insulation film covering the stacked body. The stacked body includes a first wiring, a first insulation layer stacked on the first wiring and including a second through hole exposing the first wiring, a first adhesive layer stacked on the first insulation layer and including a third through hole communicating with the second through hole, a second wiring stacked on the first adhesive layer and including a fourth through hole communicating with the third through hole, a second insulation layer stacked on the second wiring and including a fifth through hole communicating with the fourth through hole, and a first through electrode with which the second to fifth through holes are filled. The first and second wirings are connected to form a helical coil. The fifth through hole has a larger planar shape than the fourth through hole.
    Type: Grant
    Filed: June 29, 2016
    Date of Patent: May 8, 2018
    Assignee: Shinko Electric Industries Co., Ltd.
    Inventors: Atsushi Nakamura, Tsukasa Nakanishi, Kiyokazu Sato
  • Patent number: 9859086
    Abstract: According to one embodiment, there is provided an ion source. The ion source includes a vacuum-exhausted vacuum chamber, a target which is set in the vacuum chamber and generates a plurality of valences of ions by irradiation of a laser beam, an acceleration electrode which is applied with voltage in order to accelerate the ions generated by the target, and an intermediate electrode which is provided between the target and the acceleration electrode and is applied with reverse voltage of the voltage applied to the acceleration electrode.
    Type: Grant
    Filed: March 1, 2013
    Date of Patent: January 2, 2018
    Assignee: KABUSHIKI KAISHA TOSHIBA
    Inventors: Akiko Kakutani, Kiyoshi Hashimoto, Kiyokazu Sato, Akihiro Osanai, Takeshi Yoshiyuki, Tsutomu Kurusu
  • Patent number: 9571932
    Abstract: Provided is an electronic device including: a housing; a vibration body disposed in the housing; and a microphone disposed in the housing. By vibrating the vibration body, the electronic device transmits air conduction sound and vibration sound that is generated by the vibration. During the generation of the sounds, howling reduction processing is performed, so that usability of the electronic device is improved.
    Type: Grant
    Filed: May 24, 2013
    Date of Patent: February 14, 2017
    Assignee: KYOCERA Corporation
    Inventors: Tomoaki Miyano, Tomohiro Inagaki, Kenichi Ozasa, Satoshi Mizuta, Kiyokazu Sato
  • Patent number: 9510105
    Abstract: Provided is an electronic device including a housing and an acoustic device configured to generate vibration sound that is transmitted through vibration of a part of a human body. The acoustic device includes a panel configured to be joined to the housing; a piezoelectric element configured to be joined to the panel for vibrating the panel; and a vibration adjusting unit configured to be joined to the panel and vibrated together with the panel by the piezoelectric element. With the above configuration, a frequency characteristic is improved.
    Type: Grant
    Filed: September 10, 2015
    Date of Patent: November 29, 2016
    Assignee: KYOCERA Corporation
    Inventors: Toshihisa Nabata, Satoshi Mizuta, Tomoaki Miyano, Kiyokazu Sato, Akio Kihara, Shun Kazama, Yasuhiro Katayama
  • Publication number: 20160343499
    Abstract: An inductor includes a stacked body with a plurality of structural bodies that are stacked. Each of the plurality of structural bodies includes a wiring and an insulation layer formed on the wiring. The wirings of the plurality of structural bodies are connected in series to form a helical coil. The inductor further includes a through hole, which extends through the stacked body in a thickness direction of the stacked body, and a plurality of discrete insulation films, which are spaced apart from each other and cover surfaces of the wires of the plurality of structural bodies exposed from a surface of the stacked body.
    Type: Application
    Filed: October 16, 2015
    Publication date: November 24, 2016
    Inventors: Atsushi Nakamura, Tsukasa Nakanishi, Kiyokazu Sato, Yasuyoshi HORIKAWA
  • Publication number: 20160307691
    Abstract: An inductor includes a stacked body having a first through hole, and an insulation film covering the stacked body. The stacked body includes a first wiring, a first insulation layer stacked on the first wiring and including a second through hole exposing the first wiring, a first adhesive layer stacked on the first insulation layer and including a third through hole communicating with the second through hole, a second wiring stacked on the first adhesive layer and including a fourth through hole communicating with the third through hole, a second insulation layer stacked on the second wiring and including a fifth through hole communicating with the fourth through hole, and a first through electrode with which the second to fifth through holes are filled. The first and second wirings are connected to form a helical coil. The fifth through hole has a larger planar shape than the fourth through hole.
    Type: Application
    Filed: June 29, 2016
    Publication date: October 20, 2016
    Inventors: Atsushi Nakamura, Tsukasa Nakanishi, Kiyokazu Sato
  • Patent number: 9472332
    Abstract: A coil substrate includes a plurality of structural bodies, each of which comprises a first insulating layer, a wiring formed on the first insulating layer and configured to serve as a part of a spiral coil, and a second insulating layer formed on the first insulating layer and configured to cover the wiring. The plurality of structural bodies are stacked via an adhesion layer. The spiral coil is formed by series-connecting the wirings of adjacent ones of the plurality of structural bodies.
    Type: Grant
    Filed: July 28, 2014
    Date of Patent: October 18, 2016
    Assignee: SHINKO ELECTRIC INDUSTRIES CO., LTD.
    Inventors: Atsushi Nakamura, Kiyokazu Sato
  • Patent number: 9406432
    Abstract: An inductor includes a stacked body having a first through hole, and an insulation film covering the stacked body. The stacked body includes a first wiring, a first insulation layer stacked on the first wiring and including a second through hole exposing the first wiring, a first adhesive layer stacked on the first insulation layer and including a third through hole communicating with the second through hole, a second wiring stacked on the first adhesive layer and including a fourth through hole communicating with the third through hole, a second insulation layer stacked on the second wiring and including a fifth through hole communicating with the fourth through hole, and a first through electrode with which the second to fifth through holes are filled. The first and second wirings are connected to form a helical coil. The fifth through hole has a larger planar shape than the fourth through hole.
    Type: Grant
    Filed: May 7, 2015
    Date of Patent: August 2, 2016
    Assignee: Shinko Electric Industries Co., Ltd.
    Inventors: Atsushi Nakamura, Tsukasa Nakanishi, Kiyokazu Sato
  • Patent number: 9392371
    Abstract: The content of sound leakage from a vibrating plate that vibrates due to a piezoelectric element is made difficult to recognize. An electronic device (1) according to the present invention includes a piezoelectric element (30) and a vibrating plate (10) that vibrates due to the piezoelectric element (30), the electronic device (1) causing the vibrating plate (10) to generate air-conducted sound and vibration sound that is transmitted by vibrating a part of a human body. The electronic device (1) also includes an air-conducted sound reducing unit that makes a portion or all of the air-conducted sound difficult to hear.
    Type: Grant
    Filed: April 12, 2013
    Date of Patent: July 12, 2016
    Assignee: KYOCERA Corporation
    Inventors: Toshihisa Nabata, Satoshi Mizuta, Tomoaki Miyano, Kiyokazu Sato, Akio Kihara, Shun Kazama, Yasuhiro Katayama
  • Patent number: 9386683
    Abstract: One embodiment of a particle accelerator includes: a particle source from which a particle beam is extracted with a beam pulse width of not greater than 2 ?sec; a linear accelerator for accelerating the particle beam extracted from the particle source; a synchrotron for receiving the particle beam transported thereto from the linear accelerator and causing the particle beam to circulate in order to accelerate it until it gets to a predetermined energy level; a bump electromagnet for shifting the circulating path of the particle beam each time it makes a full turn; and a control unit for controlling the extent of magnetic excitation of the bump electromagnet and for controlling the timing of magnetic excitation of the bump electromagnet according to the pulse timing of the particle source.
    Type: Grant
    Filed: February 4, 2014
    Date of Patent: July 5, 2016
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Akiko Kakutani, Kiyokazu Sato, Takeshi Yoshiyuki, Takashi Yazawa
  • Patent number: 9380140
    Abstract: An electronic apparatus that may reduce sound leakage from a housing and the like vibrated by a vibrator and echo caused by the sound leakage is provided. An electronic apparatus includes a panel, a panel retainer for supporting the panel, and an element for vibrating the panel and thereby generating a vibration sound to be delivered via a human body, wherein a region of the panel near a disposing position of the element is thinner in a normal direction of the panel than a remaining region of the panel.
    Type: Grant
    Filed: July 26, 2013
    Date of Patent: June 28, 2016
    Assignee: KYOCERA Corporation
    Inventors: Shun Kazama, Akio Kihara, Kiyokazu Sato
  • Patent number: 9374057
    Abstract: An echo caused by sound leakage from a housing that vibrates due to a vibrating body is reduced. An electronic device (1) according to the present invention includes a piezoelectric element (30), a vibrating plate (10) that vibrates due to the piezoelectric element (30), microphones (42, 43), and an equalizer (44), the electronic device (1) causing the vibrating plate (10) to generate air-conducted sound and vibration sound that is transmitted by vibrating a part of a human body. The equalizer (44) makes a low-range emphasis setting, to emphasize a low frequency range more than a high frequency range of the air-conducted sound, when the volume of the air-conducted sound collected by the microphones (42, 43) exceeds a predetermined threshold.
    Type: Grant
    Filed: May 22, 2013
    Date of Patent: June 21, 2016
    Assignee: KYOCERA Corporation
    Inventors: Toshihisa Nabata, Satoshi Mizuta, Tomoaki Miyano, Kiyokazu Sato, Akio Kihara, Shun Kazama
  • Patent number: 9355809
    Abstract: According to one embodiments, an ion source connected with a vacuum-exhausted downstream apparatus is provided. The ion source includes a vacuum chamber which is vacuum-exhausted, a target which is set in the vacuum chamber and generates ions by irradiation of a laser beam, a transportation unit which transports the ions generated by the target to the downstream apparatus, and a vacuum sealing unit which seals the transportation unit so as to separate vacuum-conditions of the vacuum chamber side and the downstream apparatus side before exchanging the target set in the vacuum chamber.
    Type: Grant
    Filed: February 26, 2013
    Date of Patent: May 31, 2016
    Assignee: KABUSHIKI KAISHA TOSHIBA
    Inventors: Akiko Kakutani, Kiyoshi Hashimoto, Kiyokazu Sato, Akihiro Osanai, Takeshi Yoshiyuki, Tsutomu Kurusu, Kazuo Hayashi
  • Patent number: 9351080
    Abstract: An electronic device (1) is provided with a piezoelectric element (30), a panel (10) holding the piezoelectric element (30), and a housing (60) holding the panel (10) and transmitting vibration through the panel (10). The electronic device (1) causes the panel (10) to generate vibration sound that is transmitted by vibrating a part of a human body. The electronic device (1) includes a stiffness varying portion (62, 63) in which the stiffness of the housing (60) varies.
    Type: Grant
    Filed: April 26, 2013
    Date of Patent: May 24, 2016
    Assignee: KYOCERA Corporation
    Inventors: Toshihisa Nabata, Satoshi Mizuta, Tomoaki Miyano, Kiyokazu Sato, Akio Kihara, Shun Kazama