Patents by Inventor Kiyoshi Katsuraoka

Kiyoshi Katsuraoka has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor device having a heat-sink attached thereto
    Patent number: 5117281
    Abstract: A heat-sink is attached to a hermetic seal package of a face-up type semiconductor device such that a concavity is formed between the cap of the package and the heat-sink. Small holes using a vent are formed in the heat-sink between the concavity and the outside face of the heat-sink so as to communicate atmosphere outside the heat-sink to the concavity.
    Type: Grant
    Filed: October 22, 1990
    Date of Patent: May 26, 1992
    Assignee: NEC Corporation
    Inventor: Kiyoshi Katsuraoka