Abstract: A gas supplying system includes a processing gas supply pipe for supplying a processing gas from a gas cylinder 210 into a processing apparatus and a nonreactive gas supply source 230 for supplying a nonreactive gas into the gas supply pipe. While the system is in operation, the gas supply pipe is charged with the nonreactive gas and a control unit is in a standby state. If a processing gas use start signal is received from the processing apparatus, the system exhausts the nonreactive gas from the gas supply pipe to create a vacuum therein; charges the gas supply pipe with the processing gas; and starts a supply of the processing gas from the processing gas supply source. If a processing gas use finish signal is received from the processing apparatus, the system stops the supply of the processing gas from the processing gas supply source; exhausts the processing gas from the gas supply pipe to create a vacuum therein; and charges the gas supply pipe with the nonreactive gas.

Abstract: A gas supplying system includes a processing gas supply pipe for supplying a processing gas from a gas cylinder 210 into a processing apparatus and a nonreactive gas supply source 230 for supplying a nonreactive gas into the gas supply pipe. While the system is in operation, the gas supply pipe is charged with the nonreactive gas and a control unit is in a standby state. If a processing gas use start signal is received from the processing apparatus, the system exhausts the nonreactive gas from the gas supply pipe to create a vacuum therein; charges the gas supply pipe with the processing gas; and starts a supply of the processing gas from the processing gas supply source. If a processing gas use finish signal is received from the processing apparatus, the system stops the supply of the processing gas from the processing gas supply source; exhausts the processing gas from the gas supply pipe to create a vacuum therein; and charges the gas supply pipe with the nonreactive gas.

Abstract: Process exhaust gas is sampled, and the components of the process exhaust gas are analyzed by a Fourier-transform infrared spectroscope (FT-IR) (26). The analysis result is compared with a reference analysis result obtained from an analysis of process exhaust gas generated in an operation performed under reference process conditions. If the amount of a gas component changes to an amount that is outside a predetermined range set around a reference value obtained from the reference analysis result, a signal indicating a process error is outputted. Instead of the output of the signal indicating a process error, the process conditions can be automatically adjusted.

Abstract: Power consumption of electric equipment used in a semiconductor manufacturing apparatus (100) is obtained and the total amount is displayed as calories by a display means. The semiconductor manufacturing apparatus is configured so that the equipment is set up inside a housing (10). The amount of heat discharged from the inside to the outside (a clean room) via the housing is obtained, and further, the amount of heat removed by exhaust from the interior of the housing and the amount of heat removed by cooling water that cools the equipment is also obtained, and the total amount of heat is displayed. Additionally, factors pertaining to operating costs such as power consumption are measured and their cost obtained, the amount of power consumed is multiplied by a crude oil conversion coefficient to obtain the amount of CO2 generated, and the result is displayed.

Abstract: Process exhaust gas is sampled, and the components of the process exhaust gas are analyzed by a Fourier-transform infrared spectroscope (FT-IR) (26). The analysis result is compared with a reference analysis result obtained from an analysis of process exhaust gas generated in an operation performed under reference process conditions. If the amount of a gas component changes to an amount that is outside a predetermined range set around a reference value obtained from the reference analysis result, a signal indicating a process error is outputted. Instead of the output of the signal indicating a process error, the process conditions can be automatically adjusted.

Abstract: Process exhaust gas is sampled, and the components of the process exhaust gas are analyzed by a Fourier-transform infrared spectroscope (FT-IR) (26). The analysis result is compared with a reference analysis result obtained from an analysis of process exhaust gas generated in an operation performed under reference process conditions. If the amount of a gas component changes to an amount that is outside a predetermined range set around a reference value obtained from the reference analysis result, a signal indicating a process error is outputted. Instead of the output of the signal indicating a process error, the process conditions can be automatically adjusted.

Abstract: Components of sampled gases are analyzed by a Fourier transform infrared spectrophotometer 28. It is determined whether or not the analyzed gases include at least one kind of specific gases equal to or more than a predetermined quantity. In a case where mixed gases include at least one kind of the specific gases equal to or more than the predetermined quantity, a controller 30 supplies an operation display monitor 31 with a signal indicating leakage of the kind of the specific gases. Hence, it is possible to realize detection by kind of the gases with high accuracy irrespective of the kind of leaked gas.

Abstract: Process exhaust gas is sampled, and the components of the process exhaust gas are analyzed by a Fourier-transform infrared spectroscope (FT-IR) (26). The analysis result is compared with a reference analysis result obtained from an analysis of process exhaust gas generated in an operation performed under reference process conditions. If the amount of a gas component changes to an amount that is outside a predetermined range set around a reference value obtained from the reference analysis result, a signal indicating a process error is outputted. Instead of the output of the signal indicating a process error, the process conditions can be automatically adjusted.

Abstract: Process exhaust gas is sampled, and the components of the process exhaust gas are analyzed by a Fourier-transform infrared spectroscope (FT-IR) (26). The analysis result is compared with a reference analysis result obtained from an analysis of process exhaust gas generated in an operation performed under reference process conditions. If the amount of a gas component changes to an amount that is outside a predetermined range set around a reference value obtained from the reference analysis result, a signal indicating a process error is outputted. Instead of the output of the signal indicating a process error, the process conditions can be automatically adjusted.

Abstract: A semiconductor manufacturing apparatus ventilating system can reduce energy consumption with respect to air-conditioning and a power spent for transporting air in a clean room by minimizing an amount of circulating air in a clean room. The clean room air, which is supplied to the clean room, is introduced into an air circulating system including the semiconductor manufacturing apparatus. The air circulating system is separated from an atmosphere in the clean room. The clean room air in the air circulating system is circulated within the air circulating system.

Abstract: Power consumption of electric equipment used in a semiconductor manufacturing apparatus (100) is obtained and the total amount is displayed as calories by a display means. The semiconductor manufacturing apparatus is configured so that the equipment is set up inside a housing (10). The amount of heat discharged from the inside to the outside (a clean room) via the housing is obtained, and further, the amount of heat removed by exhaust from the interior of the housing and the amount of heat removed by cooling water that cools the equipment is also obtained, and the total amount of heat is displayed. Additionally, factors pertaining to operating costs such as power consumption are measured and their cost obtained, the amount of power consumed is multiplied by a crude oil conversion coefficient to obtain the amount of CO2 generated, and the result is displayed.

Abstract: An apparatus substitute is carried and installed in a clean room prior to installation of a semiconductor manufacturing apparatus. The apparatus substitute is composed of separate assembling boxes and is provided with tentative utility connection parts having the same specifications with respect to utility connection parts of the semiconductor manufacturing apparatus. Each of the utility connection parts is temporarily connected to one of a utility line via respective joint pipes. In the utility connection works or temporary connection, an apparatus installation position can be adjusted; a position or a size of a support plate of a floor can be corrected; a route of a utility line or a position can be corrected; or an inspection with respect to each utility line can be performed.

Abstract: Components of sampled gases are analyzed by a Fourier transform infrared spectrophotometer 28. It is determined whether or not the analyzed gases include at least one kind of specific gases equal to or more than a predetermined quantity. In a case where mixed gases include at least one kind of the specific gases equal to or more than the predetermined quantity, a controller 30 supplies an operation display monitor 31 with a signal indicating leakage of the kind of the specific gases. Hence, it is possible to realize detection by kind of the gases with high accuracy irrespective of the kind of leaked gas.

Abstract: A semiconductor manufacturing apparatus ventilating system can reduce energy consumption with respect to air-conditioning and a power spent for transporting air in a clean room by minimizing an amount of circulating air in a clean room. The clean room air, which is supplied to the clean room, is introduced into an air circulating system including the semiconductor manufacturing apparatus. The air circulating system is separated from an atmosphere in the clean room. The clean room air in the air circulating system is circulated within the air circulating system.