Abstract: It is an object to provide an optical recording medium (disk) bonding apparatus which eliminates the warpage of a disk during bonding and has high precision in the bonding. There are provided means for bonding two substrates and then irradiating radioactive rays from both sides of the substrates when carrying out radiation curing, and a mechanism for shifting the irradiation starts of both radioactive rays to control an amount of warpage of each substrate after the curing.

Abstract: It is an object to provide an optical recording medium (disk) bonding apparatus which eliminates the warpage of a disk during bonding and has high precision in the bonding. There are provided means for bonding two substrates and then irradiating radioactive rays from both sides of the substrates when carrying out radiation curing, and a mechanism for shifting the irradiation starts of both radioactive rays to control an amount of warpage of each substrate after the curing.

Abstract: A bump forming method comprising a first step of forming a ball (5) at a distal end of a wire (4) which protrudes from a lower end of a capillary (12); a second step of opening a damper (11) which securely holds the wire (4) above the capillary (12) and bringing down the capillary (12) as well as the damper (11), in which an amount of movement of the damper (11) is smaller than that of the capillary (12) by such an amount as to be equivalent to a length of the wire (4) being protruded from the lower end of the capillary (12) in the first step; a third step of forming a bump (21) from the ball (5) by bonding; and a fourth step of separating the wire (4) from the bump (21) by closing the damper (11) and lifting up the damper (11) and the capillary (21) to an initial position of the first step as well as causing a distal end of the wire (4) to protrude from the lower end of the capillary (12) by a predetermined length, whereby a step of drawing out a leading end of the wire (4) from the capillary (12) is elimina

Abstract: An apparatus for grinding spherical surfaces of workpieces includes a grinding section having a grindstone rotating mechanism for rotating around an axis of a shaft thereof with a grindstone held at an end of the shaft, a feeding mechanism for feeding the grindstone rotating mechanism toward the workpiece in a direction along the shaft, and a fixing mechanism for holding the grindstone rotating mechanism and the feeding mechanism and determining an angle 1 inclination of the short of the grindstone rotating mechanism with respect to the workpiece. A plurality of workpiece holding mechanisms are provided for holding the workpieces at ends of shafts thereof, the workpiece held by at least one of the workpiece holding mechanisms being opposed to the grindstone. A workpiece rotating mechanism is provided for rotating the workpiece holding mechanism which holds the workpiece opposed to the grindstone.

Abstract: An apparatus for polishing spherical surfaces of workpieces includes a polishing device rotating on a shaft thereof while holding a polishing tool at an end of the shaft. A pivoting device pivots the polishing device around a polishing position of the tool. A plurality of workpiece holders each hold a workpiece at an end thereof so that one of the workpieces is opposed to the tool. Workpiece holder-holding devices hold the workpiece holders so as to be rotatably and vertically movably. A workpiece holder-pressing device presses at least one of the workpiece holders held by the workpiece holder-holding device against the tool. A rotary table rotates while holding the workpiece holders and the workpiece holder-holding devices, thus placing at least one of the workpiece holders at a workpiece replacing position when the other of the workpiece holders is placed at the polishing position of the polishing device.

Abstract: A polishing spindle is provided for use in a polishing device which includes a hollow spline shaft, and a polishing tool having a polishing member which defines a first bag-like elastic member and is attached in an airtight manner to a forward end of the hollow spline shaft. A device supplies a compressive fluid to the other end of the hollow spline shaft through a rotary joint, another device rotatably supports a nut which engages the hollow spline shaft, and a further device rotates the hollow spline shaft. A still further device is provided for displacing the hollow spline shaft in an axial direction. A second elastic member is provided along the axial direction of the hollow spline shaft so as to depress the polishing member against a workpiece under a constant pressure.

Abstract: A lens polisher intended to polish a glass lens is provided with a spindle assembly having a spindle body, a housing secured to the spindle body, a load cell for monitoring the pressure applied to the lens, and a rotary head rotatably mounted on the housing. The spindle assembly further has an electric magnet secured to the load cell, at least one plate spring resiliently carried by the rotary head, a permanent magnet secured to the plate spring so as to be opposed to and spaced from the electric magnet, and an abrasive tool secured to the plate spring to polish the lens. A control unit is electrically coupled with the electric magnet and the load cell to control the voltage applied to the electric magnet in response to a signal sent from the load cell.

Abstract: A fluid circuit for a work handling apparatus having a suction holder adapted to be selectively communicated with a vacuum source and a compressed air source, an having a first electromagnetic valve having first, second and third ports which are fluid-connected with the vacuum source, the compressed air source and the suction holder, respectively. The first electromagnetic valve is operable, when in a suction position, to communicate the first and third ports with each other and, when in a release position, to communicate said second and third ports with each other. The fluid circuit also has a first passage communicating the suction holder and the third port of the first electromagnetic valve with each other, a pressure sensor, a second electromagnetic valve operable to selectively establish and open a fluid circuit between the pressure sensor and the first passage.

Abstract: A component inserting apparatus for inserting electrical and electronic components into printed circuit boards includes a chuck element for gripping a body portion of a component having a plurality of lead wires extending outwardly therefrom in the same direction, an insertion guide member which contacts outer sides of each of the lead wires so as to regulate the lead wires to be positioned at predetermined positions, thereby to guide the lead wires into corresponding openings formed in the circuit board, a vertically movable guide shaft member for rotatably supporting the insertion guide member, and an insertion shaft member coupled with the chuck element so as to be movable in the same direction as the guide shaft member and also relatively with respect to the guide shaft member.

Abstract: This invention relates to a device for feeding or retrieving sheet boards, to be used in an apparatus for planting various electric parts or materials such as capacitors, resistors, connecting wires, terminal pins, etc. into sheet boards such as printed circuit boards. The device is designed that said sheet boards are automatically brought to a processing position for planting said parts or materials thereto, or after such processing there, such processed sheet boards are automatically retrieved from said processing position. This invention especially strives to keep said sheet boards free from damage or loss of planted parts or materials when feeding and retrieving them and to permit said device to treat different sizes of sheet boards, as well, at an evenly efficient speed.

Abstract: Detachably mounted on a sliding table are a plurality of part tape or belt feed units each of which intermittently feeds to a lead wire cutting station a part tape or belt holding a large number of parts of the same type, each of which has lead wires extended in opposite directions and coaxially of a main body of the part and attached adjacent to their ends to parallel strips of tape or belt in equidistantly spaced apart relationship with the lead wires of the adjacent parts. The sliding table moves in either direction so that the desired part tape or belt feed unit is moved to a part feed position at which the desired part tape or belt feed unit feeds the part to the cutting station. At the cutting station a cutter unit cuts off from the part tape or belt the lead wires of the part, thereby separating therefrom the part having lead wires of a predetermined length, and the lead wires are bent in the same direction.

Abstract: In apparatus for inserting the connecting leads of circuit component parts which are successively arranged along a feeder tape with the leads extending from the tape in a same direction, a mounting bracket is provided which is manually rotatable about a vertical axis and on which are mounted a tape advancing mechanism and a cutter for cutting off the connecting leads of the component part which is brought to a cutting position. An insertion head extends coaxially with the vertical axis to provide reciprocating movement in response to the feeder advancing movement. A gripper is pivotally mounted at the lower end of the insertion head and operable to rotate during the downward movement of the insertion head from a horizontal position to hold the component part whose connecting leads are being cut off to a vertical position to orient the cutoff ends of the leads toward matching holes of a printed-circuit board.