Patents by Inventor Kiyoshi Oabayashi

Kiyoshi Oabayashi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for directly electroplating a dielectric substrate and plated substrate so produced
    Patent number: 5071517
    Abstract: A method for the direct electroplating of a non-conducting substrate and plated substrates so produced are disclosed wherein the non-conducting substrate is first treated with a non-acidic aqueous salt solution containing a micro-fine colloidal distribution of a noble or precious metal and tin to form a strongly adsorbed, uniform, conducting layer of micro-fine colloidal metal cayatalyst upon at least a portion of the substrate surface. The conducting layer is then electroplated directly without the need for electroless plating, conversion coatings, or preferential plating solution additives.
    Type: Grant
    Filed: November 21, 1989
    Date of Patent: December 10, 1991
    Assignee: Solution Technology Systems
    Inventor: Kiyoshi Oabayashi