Abstract: A resin-coated, bonding fine wire for use in forming bonded electrical connections on a semiconductor device, wherein the bonding wire comprises an elongated fine wire of electrically conductive material, and first and second non-conductive coating layers. The first non-conductive coating layer covers the elongated fine wire and is of a material having good insulating property and heat resistance. The second non-conducting coating layer covers the first non-conductive coating layer and is of a material having good abrasion resistance. The first non-conductive coating layer includes at least one aromatic polyester resins, and the second non-conductive coating layer includes at least one resin selected from the group consisting of polyurethanes, polyester imides and polyimides. The second non-conductive coating layer is built up from a plurality of successive coats to define the second non-conductive coating layer as a non-conductive multilayer coating structure.

Abstract: A cap inserted into a wafer process tube for vertical furnaces is provided with exhaust flow normalizing means which can control or prevent variations in exhaust flow rates in the process tube, and thereby control variations in thickness of wafers subjected to film forming and annealing.In the alternative, an annular hollow ring is hermetically sealed around an outer circumferential surface of the process tube. An exhaust pipe is connected to the hollow annular ring. Gas communication holes are formed in the wall of the process tube to accommodate the flow of gas between the tube and the hollow annular ring. The spacing and cross-sectional area of the communication holes are such as to equalize flow resistance circumferentially around the cap. In-plane variations and wafer to wafer variations in thickness and quality of wafers subjected to film forming and annealing thereby are reduced and controlled.

Abstract: An apparatus for operating a hatch cover consisting of at least three pivotally interconnected cover sections foldable vertically accordionwise in a storage space adjacent to one hatch end, with the first lower section pivoted to said hatch end and the last cover section being connected to endless chain means extending along the hatch coaming and selectively engageable with drive means for pulling the hatch cover from open to closing position, said apparatus comprising telescopically extendable and retractable pivot arm means pivoted to said hatch end swingable between an upward vertical position and a downward horizontal position on a level below stud means projecting sidewise from each cover section, whereby said pivot arm means is selectively extendable for engagement with stud means of the cover section nearest to said hatch end.