Patents by Inventor Kiyoshi SUWA

Kiyoshi SUWA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11549408
    Abstract: Provided is a valve seat insert for an internal combustion engine, which has both an excellent heat dissipation property and excellent wear resistance. The valve seat insert for an internal combustion engine is used while being press-fitted into an aluminum alloy cylinder head, is made of an iron-based sintered alloy, is formed by integrating two layers of a functional member side layer and a supporting member side layer, and has a plating film on at least an outer peripheral side. The plating film is preferably a copper plating film. The plating film is a plating film having a thickness of 1 to 100 ?m and a hardness of 50 to 300 HV, and the hardness of the plating film is adjusted so as to satisfy a range of 1.05 to 4.5 times hardness of the cylinder head in Vickers hardness HV. Pores contained in the valve seat insert are preferably sealed with a curable resin before plating treatment.
    Type: Grant
    Filed: May 14, 2019
    Date of Patent: January 10, 2023
    Assignee: NIPPON PISTON RING CO., LTD.
    Inventors: Ayato Oikawa, Kiyoshi Suwa, Katsuaki Ogawa, Hiroshi Oshige, Kenichi Sato
  • Publication number: 20210215071
    Abstract: Provided is a valve seat insert for an internal combustion engine, which has both an excellent heat dissipation property and excellent wear resistance. The valve seat insert for an internal combustion engine is used while being press-fitted into an aluminum alloy cylinder head, is made of an iron-based sintered alloy, is formed by integrating two layers of a functional member side layer and a supporting member side layer, and has a plating film on at least an outer peripheral side. The plating film is preferably a copper plating film. The plating film is a plating film having a thickness of 1 to 100 ?m and a hardness of 50 to 300 HV, and the hardness of the plating film is adjusted so as to satisfy a range of 1.05 to 4.5 times hardness of the cylinder head in Vickers hardness HV. Pores contained in the valve seat insert are preferably sealed with a curable resin before plating treatment.
    Type: Application
    Filed: May 14, 2019
    Publication date: July 15, 2021
    Applicant: Nippon Piston Ring Co., Ltd.
    Inventors: Ayato OIKAWA, Kiyoshi SUWA, Katsuaki OGAWA, Hiroshi OSHIGE, Kenichi SATO
  • Patent number: 10287933
    Abstract: In an assembly of a hollow poppet valve and a valve seat insert, the hollow poppet valve's head is integrally formed with a stem end, a hollow part is formed from the head to a stem, and coolant is filled into the hollow part along with an inert gas. The valve seat insert is formed of iron base sintered alloy and obtained by integrating two layers of a supporting material side layer and a valve contact face side layer. The hollow poppet valve is formed of a material having thermal conductivity of 5-45 (W/m·K) at 20-1000° C. The valve seat insert includes the supporting material side layer having thermal conductivity of 23-50 (W/m·K) at 20-300° C. and a valve contact face side layer having thermal conductivity of 10-22 (W/m·K) at 20-300° C. This enables a valve temperature decrease throughout an engine's entire RPM range compared with the prior art.
    Type: Grant
    Filed: December 17, 2014
    Date of Patent: May 14, 2019
    Assignees: NIPPON PISTON RING CO., LTD., NITTAN VALVE CO., LTD.
    Inventors: Satoshi Ikemi, Hiroshi Oshige, Kiyoshi Suwa, Kenichi Sato, Kouji Kunitake, Ryouichi Yoshino
  • Publication number: 20160326919
    Abstract: In an assembly of a hollow poppet valve and a valve seat insert, the hollow poppet valve's head is integrally formed with a stem end, a hollow part is formed from the head to a stem, and coolant is filled into the hollow part along with an inert gas. The valve seat insert is formed of iron base sintered alloy and obtained by integrating two layers of a supporting material side layer and a valve contact face side layer. The hollow poppet valve is formed of a material having thermal conductivity of 5-45 (W/m·K) at 20-1000° C. The valve seat insert includes the supporting material side layer having thermal conductivity of 23-50 (W/m·K) at 20-300° C. and a valve contact face side layer having thermal conductivity of 10-22 (W/m·K) at 20-300° C. This enables a valve temperature decrease throughout an engine's entire RPM range compared with the prior art.
    Type: Application
    Filed: December 17, 2014
    Publication date: November 10, 2016
    Inventors: Satoshi IKEMI, Hiroshi OSHIGE, Kiyoshi SUWA, Kenichi SATO, Kouji KUNITAKE, Ryouichi YOSHINO