Patents by Inventor Kiyotaka Mori

Kiyotaka Mori has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20060214163
    Abstract: A semiconductor device including: a substrate and an organic semiconductor material coupled to the substrate at an interface therebetween. The substrate has a first thermal expansion coefficient and the organic semiconductor material has a second thermal expansion coefficient that is different from the first thermal expansion coefficient. The difference between the first thermal expansion coefficient and the second thermal expansion coefficient causes a tensile stress in a plane parallel to the interface to be transferred from the substrate to the organic semiconductor material through the interface. This tensile stress in the plane parallel to the interface causes compression of the organic semiconductor material in a direction normal to the interface.
    Type: Application
    Filed: May 25, 2006
    Publication date: September 28, 2006
    Inventors: Kiyotaka Mori, Daniel Hogan
  • Publication number: 20060214570
    Abstract: A cascaded light emitting device. The cascaded light emitting device includes: a base electrode formed of a base electrode material and electrically coupled to a base voltage lead; a top electrode layer formed of a top electrode material and electrically coupled to a top voltage lead; a number of electroluminescent layers arranged between and electrically coupled to the base electrode and top electrode layer; and at least one middle electrode layer formed of a middle electrode material. Each of the middle electrodes is coupled between two juxtaposed electroluminescent layers. The electroluminescent layers include a mixed conductor that luminesces with a peak wavelength.
    Type: Application
    Filed: March 28, 2005
    Publication date: September 28, 2006
    Inventors: George Malliaras, Kiyotaka Mori, Jason Slinker, Daniel Bernards, Hector Abruna
  • Publication number: 20050211973
    Abstract: A semiconductor device including an organic semiconductor material coupled to a substrate at an interface between the two components. The substrate has a first thermal expansion coefficient. The organic semiconductor material has a second thermal expansion coefficient that is different from the first thermal expansion coefficient. A mechanical stress is transferred from the substrate to the organic semiconductor through the interface, the mechanical stress being related to the difference between the first thermal expansion coefficient and the second thermal expansion coefficient.
    Type: Application
    Filed: March 23, 2004
    Publication date: September 29, 2005
    Inventors: Kiyotaka Mori, Daniel Hogan
  • Publication number: 20050215067
    Abstract: A semiconductor structure including an insulator layer formed of a first polymer. The structure also includes an organic semiconductor layer formed of a second polymer. The polymers self-assemble into a well-ordered co-polymer structure with the semiconductor layer positioned adjacent the insulator layer. The structure may be an organic, thin-film semiconductor device including, without limitation, a transistor, a multi-gate transistor, a thyristor, and the like. Also disclosed is a process of manufacturing the semiconductor structure.
    Type: Application
    Filed: May 2, 2005
    Publication date: September 29, 2005
    Inventor: Kiyotaka Mori
  • Patent number: 6930322
    Abstract: A semiconductor structure including an insulator layer formed of a first polymer. The structure also includes an organic semiconductor layer formed of a second polymer. The polymers self-assemble into a well-ordered co-polymer structure with the semiconductor layer positioned adjacent the insulator layer. The structure may be an organic, thin-film semiconductor device including, without limitation, a transistor, a multi-gate transistor, a thyristor, and the like. Also disclosed is a process of manufacturing the semiconductor structure.
    Type: Grant
    Filed: March 26, 2004
    Date of Patent: August 16, 2005
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventor: Kiyotaka Mori
  • Patent number: 4906114
    Abstract: An electronic typewriter has a function of making a rectangular frame, which is composed of a horizontal line and a vertical line. To make a frame in the course of the sequential input of characters, an operator moves the printing position to the upper left vertex of the frame that is to be printed, and then, the operator depresses a specific key, which is called frame key, when the printing position arrives at the upper left vertex of the frame that is to be printed. After the operator puts in characters or spaces that are to be inserted in the frame, the operator moves the printing point to the lower right vertex of the frame and the operator then depresses the frame key again. By the operations of twice depressing the frame key, the printing position data for making the frame is taken in. The electronic typewriter then calculates both the starting and ending positions of the segments that compose the frame.
    Type: Grant
    Filed: September 1, 1988
    Date of Patent: March 6, 1990
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Kenji Tanaka, Kiyotaka Mori