Patents by Inventor Kiyotaka Takada

Kiyotaka Takada has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11925180
    Abstract: In an antimicrobial substrate, a cured material of a binder containing a copper compound and a polymerization initiator is fixed onto a surface of a base material. At least a part of the copper compound is exposed on a surface of the cured material of the binder.
    Type: Grant
    Filed: November 1, 2022
    Date of Patent: March 12, 2024
    Assignee: IBIDEN CO., LTD.
    Inventors: Katsutoshi Horino, Kozo Takada, Kazuhiro Ito, Kohei Otsuka, Kiyotaka Tsukada
  • Patent number: 9314378
    Abstract: A method and an apparatus for manufacturing an adhesive patch which is easily applied to the skin. The method includes a first step of forming a pressure-sensitive adhesive agent layer on a support, a second step of fixing a pinching piece forming sheet on a release sheet, a third step of forming a weakened part in the release sheet and the pinching piece forming sheet, and a fourth step of releasably adhering the release sheet to which the pinching piece forming sheet is fixed, that has been obtained in the third step, to the pressure-sensitive adhesive agent layer on the support, that has been obtained in the first step.
    Type: Grant
    Filed: September 30, 2010
    Date of Patent: April 19, 2016
    Assignee: HISAMITSU PHARMACEUTICAL CO., INC.
    Inventor: Kiyotaka Takada
  • Patent number: 9283738
    Abstract: An object of the present invention is to provide a method for producing a pressure-sensitive adhesive tape package suitable for mass production. The production method according to the present invention aims at producing a pressure-sensitive adhesive tape package which is a pressure-sensitive adhesive tape package 10 accommodating a pressure-sensitive adhesive tape 14 having a support 18 and an adhesive agent layer 12 provided on one surface of the support 18, the pressure-sensitive adhesive tape package comprising a release sheet 16 to which the adhesive agent layer of the adhesive tape is releasably attached. In this method, the adhesive tape 14 is bonded to the release sheet base material 116, and folded in two. Subsequently, a plurality of adhesive tapes 14 is heat sealed and temporarily attached to one release sheet base material 116, and the release sheet base material 116 is cut.
    Type: Grant
    Filed: October 23, 2012
    Date of Patent: March 15, 2016
    Assignee: Hisamitsu Pharmaceutical Co., Inc.
    Inventors: Takafumi Miyachika, Kiyotaka Takada
  • Publication number: 20140246144
    Abstract: An object of the present invention is to provide a method for producing a pressure-sensitive adhesive tape package suitable for mass production. The production method according to the present invention aims at producing a pressure-sensitive adhesive tape package which is a pressure-sensitive adhesive tape package 10 accommodating a pressure-sensitive adhesive tape 14 having a support 18 and an adhesive agent layer 12 provided on one surface of the support 18, the pressure-sensitive adhesive tape package comprising a release sheet 16 to which the adhesive agent layer of the adhesive tape is releasably attached. In this method, the adhesive tape 14 is bonded to the release sheet base material 116, and folded in two. Subsequently, a plurality of adhesive tapes 14 is heat sealed and temporarily attached to one release sheet base material 116, and the release sheet base material 116 is cut.
    Type: Application
    Filed: October 23, 2012
    Publication date: September 4, 2014
    Applicant: Hisamitsu Pharmaceutical Co., Inc.
    Inventors: Takafumi Miyachika, Kiyotaka Takada
  • Publication number: 20120253255
    Abstract: An adhesive patch easily applied to the skin. An adhesive patch 10 according to the present invention includes a support 12, a pressure-sensitive adhesive agent layer 14 provided on one surface of the support, a release sheet 16 which is releasably attached to the pressure-sensitive adhesive agent layer, and a weakened part 20 which is formed in the release sheet, that is for easily dividing the release sheet, and further, a pinching piece forming sheet 18 is fixed so as to cover the weakened part 20 on the release sheet, and portions of the pinching piece forming sheet other than the fixed portions 22 function as pinching pieces 18a and 18b, and in the pinching piece forming sheet as well, a weakened part 20 for easily dividing the release sheet is formed at a position corresponding to the weakened part of the release sheet.
    Type: Application
    Filed: September 30, 2010
    Publication date: October 4, 2012
    Applicant: HISAMITSU PHARMACEUTICAL CO., INC.
    Inventors: Mitsutoshi Tsuruta, Kentaro Ishimatsu, Kiyotaka Takada
  • Publication number: 20120234484
    Abstract: A method and an apparatus for manufacturing an adhesive patch which is easily applied to the skin. The method includes a first step of forming a pressure-sensitive adhesive agent layer 14 on a support 12, a second step of fixing a pinching piece forming sheet 18 on a release sheet 16, a third step of forming a weakened part 20 in the release sheet 16 and the pinching piece forming sheet 18, and a fourth step of releasably adhering the release sheet 16 to which the pinching piece forming sheet 18 is fixed, that has been obtained in the third step, to the pressure-sensitive adhesive agent layer 14 on the support 12, that has been obtained in the first step.
    Type: Application
    Filed: September 30, 2010
    Publication date: September 20, 2012
    Applicant: HISAMITSU PHARMACEUTICAL CO., INC.
    Inventor: Kiyotaka Takada
  • Patent number: D686734
    Type: Grant
    Filed: February 23, 2010
    Date of Patent: July 23, 2013
    Assignee: Hisamitsu Pharmaceutical Co., Inc.
    Inventors: Mitsutoshi Tsuruta, Kentaro Ishimatsu, Kiyotaka Takada
  • Patent number: D686735
    Type: Grant
    Filed: November 24, 2010
    Date of Patent: July 23, 2013
    Assignee: Hisamitsu Pharmaceutical Co., Inc
    Inventors: Mitsutoshi Tsuruta, Kentaro Ishimatsu, Kiyotaka Takada, Koichi Tanigawa, Yukiko Sueyoshi
  • Patent number: D698928
    Type: Grant
    Filed: April 29, 2011
    Date of Patent: February 4, 2014
    Assignee: Hisamitsu Pharmaceutical Co., Inc.
    Inventors: Mitsutoshi Tsuruta, Kentaro Ishimatsu, Kiyotaka Takada