Patents by Inventor Kiyotake Fukawa

Kiyotake Fukawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 5294519
    Abstract: A process for preparing a printed circuit board. The process involves successive steps of coating a photosensitive electrodeposition coating composition onto a printed-circuit copper-clad, laminated base plate to form a photosensitive resist film, applying a pattern mask onto the photosensitive resist film, exposing to an active light, developing and etching. Also the printed-circuit copper-clad, laminated base plate is subjected to a corrosion preventing treatment after cladding or laminating and prior to the step of coating the electrodeposition coating composition thereonto with a nitrogen-containing heterocyclic compound as a corrosion inhibitor.
    Type: Grant
    Filed: February 19, 1993
    Date of Patent: March 15, 1994
    Assignee: Kansai Paint Co., Ltd.
    Inventors: Kiici Mori, Kiyotake Fukawa, Tsutomu Maruyama
  • Patent number: 5102519
    Abstract: Disclosed is an improved process for preparing a printed-circuit board, which comprises successive steps of electrodeposition coating of a photosensitive resin on a printed-circuit base plate to form a photosensitive resist film, exposure to light through a pattern mask, development and etching, the improvement further comprising a step of dipping the photosensitive resist film formed by electrodeposition coating into an aqueous solution comprising water as a major component and applying a voltage to carry out electroendosmosis, whereby the tendency of the photosensitive resist film to stick to the pattern mask is reduced.
    Type: Grant
    Filed: May 14, 1990
    Date of Patent: April 7, 1992
    Assignee: Kansai Paint Co., Ltd.
    Inventors: Tsutomu Maruyama, Kiyotake Fukawa, Yutaka Yoshikawa, Kiichi Mori, Atsushi Akiyama
  • Patent number: 4965073
    Abstract: Disclosed is an improved process for preparing the printed circuit board, which comprises coating a photo-curable electrodeposition coating composition on the surface of the copper foil of a copper-clad, laminated plate to form a photo-sensitive resist film thereon, lapping a photographic negative or positive film onto the photo-sensitive resist film, and exposing to an active light, followed by development, the improvement comprising incorporating a colorless or substantially colorless reduction-type leico pigment into the electrodeposition coating composition to form a photo-sensitive resist film containing the leico pigment, and to develop a color in an exposed area of the photo-sensitive resist film by exposing to the active light.
    Type: Grant
    Filed: March 21, 1990
    Date of Patent: October 23, 1990
    Assignee: Kansai Paint Co., Ltd.
    Inventors: Tsutomu Maruyama, Kiyotake Fukawa, Atsushi Akiyama, Yoshihiro Kiyomura