Patents by Inventor Kiyoto Doi

Kiyoto Doi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Isocyanate resin compositions and hot melt and pressure sensitive adhesives based thereon
    Patent number: 5633317
    Abstract: A resin composition containing graft copolymer having at least one isocyanate group and 10,000 to 20,000 number-average molecular weight or high-molecular-weight polymer having at least one isocyanate group and 10,000 to 200,000 number-average molecular weight, and low-molecular-weight polymer having or not having an isocyanate group and 500 to 8,000 number-average molecular weight. This resin composition has tackiness at ordinary temperature, and long pot life. It can be used for reactive hot melt type adhesives (which can omit hot press process), reactive hot melt type pressure-sensitive adhesives, or coating material.
    Type: Grant
    Filed: September 7, 1994
    Date of Patent: May 27, 1997
    Assignee: Mitsui Toatsu Chemicals, Inc.
    Inventors: Eiichi Kawasaki, Kiyoto Doi, Tadashi Kitamura, Kousuke Suewaka, Kazuya Shinkoda
  • Isocyanate resin compositions and hot melt and pressure sensitive adhesives based thereon
    Patent number: 5418288
    Abstract: There is disclosed a resin composition containing graft copolymer having at least one isocyanate group and 10,000 to 20,000 of number-average molecular weight or high-molecular-weight polymer having at least one isocyanate group and 10,000 to 200,000 of number-average molecular weight, and low-molecular-weight polymer having or not having an isocyanate group and 500 to 8,000 of number-average molecular weight is disclosed. This resin composition has tackiness at ordinary temperature, and long pot life. It can be used to reactive hot melt type adhesives (which can omit hot press process), reactive hot melt type pressure-sensitive adhesives, or coating material.
    Type: Grant
    Filed: January 15, 1993
    Date of Patent: May 23, 1995
    Assignee: Mitsui Toatsu Chemicals, Inc.
    Inventors: Eiichi Kawasaki, Kiyoto Doi, Tadashi Kitamura, Kousuke Suewaka, Kazuya Shinkoda
  • Oiled-face adherable, hot-melt adhesive composition and a non-slip processing method of metal scaffolding board
    Patent number: 5095059
    Abstract: The invention provides oiled-face adherable, hot-melt adhesive composition which has constitutive components consisting of thermoplastic resin such as ethylene-acrylate ester resin, tacky resin such as rosin ester derivative and waxes such as paraffin wax and/or plasticizer such as naphthene oil, and also contains modified resin components obtained by introducing into the molecular chains of these components a phosphoric acid group or, if desired, a carboxyl or its anhydride group, for example, by grafting 2-hydroxy-3-(meth)acryloxypropyl phosphate.By providing the composition, adhesion and seal of metals with difficulty adhesive plastics are improved and a non-slip processing method of face-oiled metal scaffolding boards can be accomplished.
    Type: Grant
    Filed: March 27, 1991
    Date of Patent: March 10, 1992
    Assignee: Mitsui Toatsu Chemicals, Inc.
    Inventors: Tadashi Kitamura, Kiyoto Doi, Eiichi Kawasaki, Kenichi Yashiro