Patents by Inventor Kiyoumi Ninomiya

Kiyoumi Ninomiya has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Structure for cooling a circuit module having a circuit board and a heat-generating IC chip mounted on the board, and portable electronic apparatus incorporating the structure
    Patent number: 5581443
    Abstract: A portable electronic apparatus comprising a housing having a bottom, a metal frame provided in the housing, a circuit board supported by the frame, and an IC chip secured to the circuit board. The circuit board has a first surface extending substantially parallel to the bottom of the housing and a second surface opposing the first surface. The IC chip is adhered to the first surface of the circuit board and generating heat while operating. The apparatus further comprises a metal cover arranged on the first surface of the circuit board and covering the IC chip, and a metal shield plate covering the first surface of the circuit board and the metal cover. The frame has a heat-receiving part which contacts the second surface of the circuit board and which is located near the IC chip. A first thermally conductive elastic sheet is interposed between the cover and the IC chip, and a second thermally conductive elastic sheet is interposed between the cover and the shield plate.
    Type: Grant
    Filed: September 5, 1995
    Date of Patent: December 3, 1996
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Hiroshi Nakamura, Kentaro Tomioka, Kiyoumi Ninomiya, Hideki Ogawa, Yuji Nakajima