Patents by Inventor Klaas P. Boonstra
Klaas P. Boonstra has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20210384046Abstract: The disclosure relates to a substrate processing apparatus for processing a plurality of substrates. The apparatus comprising a reactor mounted in the apparatus and configured for processing substrates and a reactor mover for moving the reactor for maintenance. The reactor mover is constructed and arranged with a lift to move the reactor to a lower height to allow for access to the reactor by a maintenance worker.Type: ApplicationFiled: June 2, 2021Publication date: December 9, 2021Inventors: Gijsbert Hendrik Ronner, Christianus G.M. de Ridder, Theodorus G.M. Oosterlaken, Klaas P. Boonstra, Jeroen de Jonge, Lucian Jdira, Chaggai Shmuel Ganani
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Publication number: 20210375644Abstract: A purge nozzle assembly comprising a purge nozzle body including an inlet opening and an outlet opening. The outlet opening opens into a purge nozzle contact surface. Additionally, the purge nozzle assembly includes a mounting body for connecting the purge nozzle assembly to an external frame member. A mechanical coupling mechanism moveably couples the purge nozzle body with the mounting body and is configured to allow tilting of the purge nozzle body relative to the mounting body as well as to allow a substantial lateral movement of the purge nozzle body relative to the mounting body, wherein the lateral movement has a movement component which is substantially parallel to the purge nozzle contact surface.Type: ApplicationFiled: May 21, 2021Publication date: December 2, 2021Inventors: Christianus G.M. de Ridder, Klaas P. Boonstra
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Publication number: 20210207270Abstract: An injector configured to be placed in a process chamber of a batch furnace assembly for injecting a gas into said process chamber. The injector has an elongated, tubular housing enclosing an injection chamber. The housing has a gas inlet opening for supplying a gas from a gas source to the injection chamber, at least one gas supply opening for supplying the gas from the injection chamber into the process chamber, and a circumferential wall extending in a longitudinal direction of the housing. The circumferential wall comprises a first lateral wall half and a second lateral wall half. Both lateral wall halves substantially span a length of the housing in the longitudinal direction. The first and second lateral wall halves are fastened to each other by means of mechanical fastening.Type: ApplicationFiled: January 6, 2021Publication date: July 8, 2021Inventors: Chris G.M. de Ridder, Klaas P. Boonstra, Theodorus G.M. Oosterlaken
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Patent number: 10605530Abstract: An assembly of a liner and a flange for a vertical furnace for processing substrates is provided. The liner being configured to extend in the interior of a process tube of the vertical furnace, and the flange is configured to at least partially close a liner opening. The liner comprising a substantially cylindrical wall delimited by the liner opening at a lower end and closed at a higher end and being substantially closed for gases above the liner opening and defining an inner space. The flange comprising: an inlet opening configured to insert and remove a boat configured to carry substrates in the inner space of the liner; a gas inlet to provide a gas to the inner space. The assembly is constructed and arranged with a gas exhaust opening to remove gas from the inner space and a space between the liner and the low pressure tube.Type: GrantFiled: July 26, 2017Date of Patent: March 31, 2020Assignee: ASM IP Holding B.V.Inventors: Lucian C. Jdira, Chris G. M. de Ridder, Theodorus G. M. Oosterlaken, Klaas P. Boonstra, Herbert Terhorst, Juul Keijser
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Patent number: 10224222Abstract: An assembly of a liner and a support flange for a vertical furnace for processing wafers, wherein the support flange is configured for supporting the liner, at least two support members that are connected to the cylindrical wall, each having a downwardly directed supporting surface, wherein each downwardly directed supporting surface is positioned radially outwardly from the inner cylindrical surface, wherein the support flange and/or the liner are configured such that, when the liner is placed on the support flange, the downwardly directed supporting surfaces are in contact with an upper surface of the support flange and support the liner, and wherein at least the part of the lower end surface of the liner that bounds the inner cylindrical surface is spaced apart from the upper surface of the support flange.Type: GrantFiled: September 9, 2014Date of Patent: March 5, 2019Assignee: ASM IP HOLDING B.V.Inventors: Chris G. M. de Ridder, Theodorus G. M. Oosterlaken, Klaas P. Boonstra
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Publication number: 20190032998Abstract: An assembly of a liner and a flange for a vertical furnace for processing substrates is provided. The liner being configured to extend in the interior of a process tube of the vertical furnace, and the flange is configured to at least partially close a liner opening. The liner comprising a substantially cylindrical wall delimited by the liner opening at a lower end and closed at a higher end and being substantially closed for gases above the liner opening and defining an inner space. The flange comprising: an inlet opening configured to insert and remove a boat configured to carry substrates in the inner space of the liner; a gas inlet to provide a gas to the inner space. The assembly is constructed and arranged with a gas exhaust opening to remove gas from the inner space and a space between the liner and the low pressure tube.Type: ApplicationFiled: July 26, 2017Publication date: January 31, 2019Inventors: Lucian C. Jdira, Chris G.M. de Ridder, Theodorus G.M. Oosterlaken, Klaas P. Boonstra, Herbert Terhorst, Juul Keijser
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Publication number: 20160071750Abstract: An assembly of a liner and a support flange for a vertical furnace for processing wafers, wherein the support flange is configured for supporting the liner, at least two support members that are connected to the cylindrical wall, each having a downwardly directed supporting surface, wherein each downwardly directed supporting surface is positioned radially outwardly from the inner cylindrical surface, wherein the support flange and/or the liner are configured such that, when the liner is placed on the support flange, the downwardly directed supporting surfaces are in contact with an upper surface of the support flange and support the liner, and wherein at least the part of the lower end surface of the liner that bounds the inner cylindrical surface is spaced apart from the upper surface of the support flange.Type: ApplicationFiled: September 9, 2014Publication date: March 10, 2016Inventors: Chris G.M. de Ridder, Theodorus G.M. Oosterlaken, Klaas P. Boonstra
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Patent number: 9153466Abstract: A wafer boat for accommodating semiconductor wafers comprises two side rods and at least one back rod, the rods being vertically oriented and extending between a top member and a bottom member. The rods comprise vertically spaced recesses formed at corresponding heights, recesses at the same height defining a wafer accommodation for receiving and supporting a wafer in a substantially horizontal orientation, the recesses having an improved shape. The upwardly facing surfaces of the recesses comprise a first flat surface in an inward region of the recess which is horizontal or inclined upward in an outward direction of the recess and a second flat surface in an outer region of the recess which is inclined downward in an outward direction of the recess. The intersection of the first and second surface forming an edge for supporting the wafer. The recesses are easy to machine and prevent damage to the wafer.Type: GrantFiled: April 26, 2013Date of Patent: October 6, 2015Assignee: ASM IP HOLDING B.V.Inventors: Lucian C. Jdira, Arjen Klaver, Klaas P. Boonstra, Chris G. M. De Ridder, Theodorus G. M. Oosterlaken
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Patent number: 9018567Abstract: A semiconductor substrate processing apparatus (1), comprising a substrate support assembly (30), including a substrate support (32) defining an outer support surface (34) for supporting a substrate or substrate carrier (24) thereon, and a heater (50) comprising a heat dissipating portion (54) that is disposed within the substrate support (32) and that extends underneath and substantially parallel to the support surface (34), said substrate support (32) being rotatably mounted around a rotation axis (L) that extends through said support surface (34), such that the support surface (34) is rotatable relative to the heat dissipating portion (54) of the heater (50).Type: GrantFiled: July 13, 2011Date of Patent: April 28, 2015Assignee: ASM International N.V.Inventors: Chris G. M. de Ridder, Klaas P. Boonstra, Theodorus G. M. Oosterlaken, Barend J. T. Ravenhorst
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Publication number: 20130284683Abstract: A wafer boat for accommodating semiconductor wafers comprises two side rods and at least one back rod, the rods being vertically oriented and extending between a top member and a bottom member. The rods comprise vertically spaced recesses formed at corresponding heights, recesses at the same height defining a wafer accommodation for receiving and supporting a wafer in a substantially horizontal orientation, the recesses having an improved shape. The upwardly facing surfaces of the recesses comprise a first flat surface in an inward region of the recess which is horizontal or inclined upward in an outward direction of the recess and a second flat surface in an outer region of the recess which is inclined downward in an outward direction of the recess. The intersection of the first and second surface forming an edge for supporting the wafer. The recesses are easy to machine and prevent damage to the wafer.Type: ApplicationFiled: April 26, 2013Publication date: October 31, 2013Applicant: ASM IP Holding B.V.Inventors: Lucian C. JDIRA, Arjen KLAVER, Klaas P. BOONSTRA, Chris G.M. DE RIDDER, Theodorus G.M. OOSTERLAKEN
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Patent number: 8455293Abstract: A method for processing solar cells comprising: providing a vertical furnace to receive an array of mutually spaced circular semiconductor wafers for integrated circuit processing; composing a process chamber loading configuration for solar cell substrates, wherein a size of the solar cell substrates that extends along a first surface to be processed is smaller than a corresponding size of the circular semiconductor wafers, such that multiple arrays of mutually spaced solar cell substrates can be accommodated in the process chamber, loading the solar cell substrates into the process chamber; subjecting the solar cell substrates to a process in the process chamber.Type: GrantFiled: November 6, 2012Date of Patent: June 4, 2013Assignee: ASM International N.V.Inventors: Chris G. M. de Ridder, Klaas P. Boonstra, Adriaan Garssen, Frank Huussen
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Publication number: 20130017503Abstract: A semiconductor substrate processing apparatus (1), comprising a substrate support assembly (30), including a substrate support (32) defining an outer support surface (34) for supporting a substrate or substrate carrier (24) thereon, and a heater (50) comprising a heat dissipating portion (54) that is disposed within the substrate support (32) and that extends underneath and substantially parallel to the support surface (34), said substrate support (32) being rotatably mounted around a rotation axis (L) that extends through said support surface (34), such that the support surface (34) is rotatable relative to the heat dissipating portion (54) of the heater (50).Type: ApplicationFiled: July 13, 2011Publication date: January 17, 2013Inventors: Chris G.M. De Ridder, Klaas P. Boonstra, Theodorus G.M. Oosterlaken, Barend J. T. Ravenhorst
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Patent number: 8338210Abstract: A method for processing solar cells comprising: providing a vertical furnace to receive an array of mutually spaced circular semiconductor wafers for integrated circuit processing; composing a process chamber loading configuration for solar cell substrates, wherein a size of the solar cell substrates that extends along a first surface to be processed is smaller than a corresponding size of the circular semiconductor wafers, such that multiple arrays of mutually spaced solar cell substrates can be accommodated in the process chamber, loading the solar cell substrates into the process chamber; subjecting the solar cell substrates to a process in the process chamber.Type: GrantFiled: June 14, 2010Date of Patent: December 25, 2012Assignee: ASM International N.V.Inventors: de Chris G. M. Ridder, Klaas P. Boonstra, Adriaan Garssen, Frank Huussen
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Publication number: 20110306159Abstract: A method for processing solar cells comprising: providing a vertical furnace to receive an array of mutually spaced circular semiconductor wafers for integrated circuit processing; composing a process chamber loading configuration for solar cell substrates, wherein a size of the solar cell substrates that extends along a first surface to be processed is smaller than a corresponding size of the circular semiconductor wafers, such that multiple arrays of mutually spaced solar cell substrates can be accommodated in the process chamber, loading the solar cell substrates into the process chamber; subjecting the solar cell substrates to a process in the process chamber.Type: ApplicationFiled: June 14, 2010Publication date: December 15, 2011Inventors: de Chris G. M. Ridder, Klaas P. Boonstra, Adriaan Garssen, Frank Huussen