Abstract: A battery and battery thermal arrangement are provided. The battery comprises one or more battery blocks and a thermal insert configured adjacent to a first battery block or between two battery blocks, including the first battery block and a second battery block, the thermal insert comprising a channel for allowing a thermal medium flowing through the thermal insert, the thermal insert being in physical contact with at least a part of a side of the first battery block when filled with the thermal medium, the thermal insert further comprising an inlet and an outlet connectable to a circulation device for pumping the thermal medium through the thermal insert.

Abstract: A battery and battery thermal arrangement are provided. The battery comprises one or more battery blocks and a thermal insert configured adjacent to a first battery block or between two battery blocks, including the first battery block and a second battery block, the thermal insert comprising a channel for allowing a thermal medium flowing through the thermal insert, the thermal insert being in physical contact with at least a part of a side of the first battery block when filled with the thermal medium, the thermal insert further comprising an inlet and an outlet connectable to a circulation device for pumping the thermal medium through the thermal insert.

Abstract: A heat transfer arrangement for heat exchange between an inside of an electronic component housing and an ambient environment. The heat transfer arrangement comprises a refrigerant circuit with an evaporator a condenser and conduits (202). A refrigerant is arranged to self-circulate in a refrigerant flow in the refrigerant circuit. A flow control device (124) comprises a movable member (206) adapted to control the refrigerant flow. The movable member (206) affects a through flow area of one of the conduits (202). The movable member (206) is adapted to move in response to a pressure change inside the refrigerant circuit by being affected from a first side by a refrigerant pressure inside the refrigerant circuit and from a second side by a spring force such that the refrigerant flow is changed.

Abstract: The present invention relates to a method in a cabinet and a cabinet for controlling the temperature inside the cabinet. The cabinet is comprised in a radio network node. The cabinet comprises a first set of electronic equipment and a second set of electronic equipment, a first climate system and a second climate system. The first and second climate systems are arranged to transfer heat from an internal volume to an external volume of the cabinet. A first air flow is generated using a first air moving device of the first climate system, which first air flow substantially affects the first set of electronic equipment. A second air flow is generated using a second air moving device of the second climate system, which second air flow substantially affects the second set of electronic equipment. A temperature is measured within the internal volume by using a temperature sensor.

Abstract: A heat transfer arrangement (100) comprises a refrigerant circuit (102), which refrigerant circuit (102) comprises an evaporator (104) adapted to be arranged inside an electronic component housing (112), a condenser (108) adapted to be arranged outside the electronic component housing (112), a first conduit (106) and a second conduit (110). A refrigerant is present in the refrigerant circuit (102) and in use is arranged to self-circulate by evaporating in the evaporator (104), rising as a gas through the first conduit (106), condensing in the condenser (108) and flowing through the second conduit (110) to the evaporator (104). The heat transfer arrangement (100) further comprises a reservoir (124) for liquid refrigerant connected to the refrigerant circuit (102).

Abstract: The present invention relates to a method in a cabinet and a cabinet for controlling the temperature inside the cabinet. The cabinet is comprised in a radio network node. The cabinet comprises a first set of electronic equipment and a second set of electronic equipment, a first climate system and a second climate system. The first and second climate systems are arranged to transfer heat from an internal volume to an external volume of the cabinet. A first air flow is generated using a first air moving device of the first climate system, which first air flow substantially affects the first set of electronic equipment. A second air flow is generated using a second air moving device of the second climate system, which second air flow substantially affects the second set of electronic equipment. A temperature is measured within the internal volume by using a temperature sensor.

Abstract: A heat transfer arrangement for heat exchange between an inside of an electronic component housing and an ambient environment. The heat transfer arrangement comprises a refrigerant circuit with an evaporator a condenser and conduits (202). A refrigerant is arranged to self-circulate in a refrigerant flow in the refrigerant circuit. A flow control device (124) comprises a movable member (206) adapted to control the refrigerant flow. The movable member (206) affects a through flow area of one of the conduits (202). The movable member (206) is adapted to move in response to a pressure change inside the refrigerant circuit by being affected from a first side by a refrigerant pressure inside the refrigerant circuit and from a second side by a spring force such that the refrigerant flow is changed.

Abstract: A heat transfer arrangement (100) comprises a refrigerant circuit (102), which refrigerant circuit (102) comprises an evaporator (104) adapted to be arranged inside an electronic component housing (112), a condenser (108) adapted to be arranged outside the electronic component housing (112), a first conduit (106) and a second conduit (110). A refrigerant is present in the refrigerant circuit (102) and in use is arranged to self-circulate by evaporating in the evaporator (104), rising as a gas through the first conduit (106), condensing in the condenser (108) and flowing through the second conduit (110) to the evaporator (104). The heat transfer arrangement (100) further comprises a reservoir (124) for liquid refrigerant connected to the refrigerant circuit (102).

Abstract: A heat transfer arrangement comprises a refrigerant circuit (102). The refrigerant circuit (102) comprises an evaporator (104) adapted to be arranged inside an electronic component housing (202), a condenser (108) adapted to be arranged outside the electronic component housing (202), a first conduit leading (106) from the evaporator (104) to the condenser (108), and a second conduit leading from the condenser (108) to the evaporator (104). A refrigerant is present in the refrigerant circuit (102) and in use, under first temperature conditions, is arranged to self-circulate in the refrigerant circuit (102) by evaporating in the evaporator (104), rising as a gas through the first conduit, condensing in the condenser (108) and flowing through the second conduit to the evaporator (104).

Abstract: The present invention relates to an arrangement (100) and a method in a radio network node (400) for cooling electronic equipment (102) within the arrangement (100). The arrangement (100) comprises a closed space (104) for housing the electronic equipment (102) and a heat exchanger (106) for transporting heat from the closed space. A first flow regulating device (202) is arranged for circulating a cooling fluid (204) within the closed space (104) and a second flow regulating device (206) is arranged for circulating an outer cooling fluid (208) outside (112) the closed space. The arrangement (100) further comprises at least one sensor (301, 302, 303, 304, 305, 306) for measuring temperature in the arrangement and a controller (210) for controlling at least one of the first and second flow regulating devices (202, 206) based on at least one temperature measurement from a fixed member (102, 104, 106, 112, 308) within the arrangement (100).

Abstract: The present invention relates to an arrangement (100) and a method in a radio network node (200) for controlling a heater (101). The arrangement comprises a heater for warming air in the arrangement and at least a first flow generating device (102) and a second flow generating device (103) for generating a general air flow (105) within the arrangement. The heater (101) is arranged in between the first flow generating device (102) and the second flow generating device (103) whereby the air flowing through the heater (101) becomes dependent on the setting of the first and second flow generating devices.

Abstract: The present invention relates to an apparatus for supplying heat to directly cooled electronics. To ensure that directly cooled electronics are maintained at a temperature above 0° C., a circulation fan is provided in a transverse junction between an outlet duct and an inlet duct, for a recirculation flow of supplied cooling air, whereby outgoing hot air from the electronics, when necessary, may be mixed with the cold air, so as to raise the temperature of the cooling air to be supplied to the electronics.

Abstract: The present invention relates to an apparatus for supplying heat to directly cooled electronics. To ensure that directly cooled electronics are maintained at a temperature above 0° C., a circulation fan is provided in a transverse junction between an outlet duct and an inlet duct, for a recirculation flow of supplied cooling air, whereby outgoing hot air from the electronics, when necessary, may be mixed with the cold air, so as to raise the temperature of the cooling air to be supplied to the electronics.