Patents by Inventor Klaus Dippon

Klaus Dippon has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Sound-absorbent foam system
    Patent number: 9279054
    Abstract: The present invention relates to a novel sound-absorbent foam system in the form of an open-cell mineral-organic material, which can even attain building material class B1 according to DIN 1402 and is used for reducing sound levels, in particular in interior spaces. The material is distinguished by containing lignosulphonate.
    Type: Grant
    Filed: February 4, 2009
    Date of Patent: March 8, 2016
    Assignee: Preform GmbH
    Inventors: Uwe Schoenfeld, Klaus Dippon
  • Sheet molding compounds (SMC), thick molding compounds (TMC), and bulk molding compounds (BMC) comprising thermosetting resins based on renewable resources
    Patent number: 8241739
    Abstract: The object of the invention is a new Sheet Molding Compound (SMC), Thick Molding Compound (TMC), or Bulk Molding Compound (BMC) comprising at thermosetting resin on the basis of renewable resources with which molded parts can be produced in a molding process at elevated temperature and pressure said process being suitable to produce molded parts in an industrial process.
    Type: Grant
    Filed: July 27, 2007
    Date of Patent: August 14, 2012
    Assignees: Polynt S.p.A., Bio-Composites and More GmbH
    Inventors: Uwe Schonfeld, Oliver Turk, Giovanni Vargiolu, Klaus Dippon, Nicole Busam, Simone Weber
  • SOUND-ABSORBENT FOAM SYSTEM
    Publication number: 20110057144
    Abstract: The present invention relates to a novel sound-absorbent foam system in the form of an open-cell mineral-organic material, which can even attain building material class B1 according to DIN 1402 and is used for reducing sound levels, in particular in interior spaces. The material is distinguished by containing lignosulphonate.
    Type: Application
    Filed: February 4, 2009
    Publication date: March 10, 2011
    Applicant: PREFORM GMBH
    Inventors: Uwe Schoenfeld, Klaus Dippon
  • SHEET MOLDING COMPOUNDS (SMC), THICK MOLDING COMPOUNDS (TMC), AND BULK MOLDING COMPOUNDS (BMC) COMPRISING THERMOSETTING RESINS BASED ON RENEWABLE RESOURCES
    Publication number: 20100041802
    Abstract: The object of the invention is a new Sheet Molding Compound (SMC), Thick Molding Compound (TMC), or Bulk Molding Compound (BMC) comprising at thermosetting resin on the basis of renewable resources with which molded parts can be produced in a molding process at elevated temperature and pressure said process being suitable to produce molded parts in an industrial process
    Type: Application
    Filed: July 27, 2007
    Publication date: February 18, 2010
    Applicants: POLYNT S.P.A., BIO-COMPOSITES AND MORE GMBH
    Inventors: Uwe Schonfeld, Oliver Turk, Giovanni Vargiolu, Klaus Dippon, Nicole Busam, Simone Weber