Abstract: The invention relates to an apparatus for the electrostatic lacquering of printed circuit boards formed with continuous holes as soldering places for connecting wires. The characterizing feature of the apparatus is that the printed circuit boards, continuously conveyed in a suspended position, are lacquered on one side, then turned over, lacquered on the other side, and the two layers of lacquer are then immediately dried simultaneously.

Abstract: A process for the electrostatic lacquering of printed circuit boards formed with continuous holes as soldering places for connecting wires. The characterizing feature of the process is that the printed circuit boards, continuously conveyed in a suspended position, are lacquered on one side, then turned over, lacquered on the other side, and the two layers of lacquer are then immediately dried simultaneously. An apparatus for the electrostatic lacquering of printed circuit boards is also disclosed.

Abstract: A blanking strip, made of paper or film, for the partial blanking of objects to be electroplated, such as printed circuit boards, coated with an adhesive composition based on a plastomer, a hard resin and a plasticizer.

Abstract: A process for electroplating a printed circuit board utilizing an improved masking tape for partially covering the surfaces of the circuit board is provided. The masking tape comprises a foil-like carrier and a coating consisting of an adhesive material applied to one side of the foil-like carrier. At least one electrical conductor is arranged on the coating of the masking tape and forms a unit therewith. The electrical conductor connects the surfaces to be electroplated of the printed circuit board with one another and with a frame carried by the printed circuit board.