Abstract: An injection-molded circuit carrier is provided that has an outside and an underside and an inner base region and a frame. The frame has an inside and a cover surface, so that the inner base region is enclosed in the manner of a frame, and multiple printed conductors are provided, which are spaced a distance apart. The printed conductors are guided at least partially from the inside to the underside via the cover surface and via the outside so that at least two metal surfaces are formed on the underside, which are each electrically connected to a printed conductor and are spaced a distance apart. The metal surfaces are designed to be significantly wider than the printed conductors for the purpose of forming a capacitive sensor.

Abstract: A magnetic field measuring device includes a first semiconductor body having a surface formed in a first x-y plane, the first semiconductor body having two magnetic field sensors, spaced a distance apart on the surface, and the magnetic field sensors each measuring one z component of a magnetic field. A first magnet has a planar main extension surface formed in a second x-y plane, the direction of magnetization changing from a north pole to a south pole along the main extension surface on a symmetry surface of the magnet. One of the two magnetic field sensors being disposed in the vicinity of the north pole and the other of the two magnetic field sensors being situated in the vicinity of the south pole, so that signals having opposite polarities with respect to each other are formed in a z component of the magnetic field.

Abstract: An electrical component having a first package part of a first plastic compound. The first package part has a first trench-shaped formation. A first semiconductor body with an integrated circuit is disposed in the first trench-shaped formation. At least two traces, which run on an outer side of the first package part, are provided on a surface of the first trench-shaped formation, wherein the at least two traces are connected to the integrated circuit. The first trench-shaped formation is filled at least partially with a filling material of a second plastic compound to cover the first semiconductor body.

Abstract: A measuring system, having a magnetic device for generating a magnetic field and having a magnetic field sensor with a sensor surface for detecting a flux density of the magnetic field penetrating the sensor surface at least in a first spatial direction, whereby the magnetic field sensor is fixedly positioned relative to the magnetic device. The magnetic device can have at least one permanent magnet and a flux concentrator made of a ferromagnetic material. The permanent magnet has at least two pole surfaces and an outer surface. The flux concentrator can have a smaller dimensions than the outer surface of the permanent magnet. The flux concentrator can be positioned within the outer surface of the permanent magnet and the flux concentrator and the permanent magnet can have a magnetic force closure.

Abstract: A measuring system having a magnetic device for generating a magnetic field and having a magnetic field sensor for detecting a flux density of the magnetic field at least in a first spatial direction, whereby the magnetic field sensor is fixedly positioned relative to the magnetic device. The magnetic device has at least two main poles for generating a main magnetic field and at least two secondary poles for generating a secondary magnetic field. The magnetic field in the magnetic field sensor is formed by superposition of the main magnetic field and the secondary magnetic field. The magnetic field sensor is designed to measure the flux density of the superposition in the first spatial direction, and, in the magnetic field sensor, the secondary magnetic field compensates at least partially the main magnetic field in the first spatial direction.

Abstract: An integrated magnetic field measuring device is provided that includes a semiconductor body arranged on a metal substrate and having a first surface, and a plurality of metal surfaces formed on the surface, a first magnetic field sensor, formed in the semiconductor body and having a first sensor signal, and second magnetic field sensor having a second sensor signal, and a current-carrying first conductor. A third magnetic field sensor with a third sensor signal is formed in the semiconductor body. The first magnetic field sensor, the second magnetic field sensor, and the third magnetic field sensor have a substantially identical orientation to Earth's magnetic field and a different distance to the first conductor and the magnetic field of the first conductor simultaneously penetrates the first magnetic field sensor, the second magnetic field sensor, and the third magnetic field sensor.

Abstract: An integrated circuit for controlling an electric motor, which has a primary component with a coil and a permanently magnetic secondary component cooperatively connected via an air gap to the primary component, has a semiconductor substrate in which are integrated a microcontroller and/or a pre-amplifier for controlling the coil of the electric motor. For detecting the position of the permanently magnetic secondary component, at least two magnetic field sensors with their measurement axes aligned crosswise relative to each other are integrated in the semiconductor substrate.

Abstract: A current sensor having a magnetic field sensor, and a variable current source connected to the magnetic field sensor, and a first differential amplifier, connected to the magnetic field sensor, for amplifying a first sensor voltage. A second differential amplifier is provided and the second differential amplifier is connected to the first differential amplifier and to the current source. In the case of the first sensor voltage, a first operating current is present at the magnetic field sensor and in the case of a second sensor voltage, a second operating current is present, whereby the second Hall voltage is smaller than the first sensor voltage and the second operating current is greater than the first operating current.

Abstract: In a method for generating pulse edges, assigned synchronously to the movement of a mechanical part, a magnetic field is generated. At least two measuring signals phase-shifted to one another for the magnetic field are detected. The magnetic field is changed as a function of the movement of the mechanical part in such a way that the measuring signals are modulated. A first measuring signal is compared with at least one first reference value. A second measuring signal is compared with at least one second reference value and/or the value of the first measuring signal is compared with the value of the second measuring signal. When at least one of these comparisons produces an agreement or the result of the relevant comparison changes its sign, a pulse edge is generated.

Abstract: A measuring apparatus for detecting a relative movement between at least one magnetic field sensor array integrated into a semiconductor chip and a transmitter for the sensor array is provided. The transmitter and the sensor array are exposed to the magnetic flux of a magnet. The transmitter has teeth that can be moved past the sensor array during the relative movement, or the transmitter has magnet poles that can be moved past the sensor array during the relative movement. The magnetic field sensor includes a differential magnetic field sensor which comprises a first measuring plate and a second measuring plate that are offset in relation to one another in a direction of the relative movement. The magnetic field sensor also includes a sensor element which is designed to measure the absolute magnetic field and comprises a third measuring plate that is arranged between the first measuring plate and the second measuring plate in the direction of the relative movement.

Abstract: A semiconductor component on a semiconductor chip comprises at least one sensor element for measuring a physical quantity and an evaluator. The semiconductor component can be switched between a first and a second operating mode. In the first operating mode, the sensor element is sensitive to the physical quantity to be measured and a measurement signal output of the sensor element is connected to an input connection of the evaluator. In the second operating mode, the sensor element is not sensitive to the physical quantity to be measured and/or the signal path between the measurement signal output and the input connection is interrupted. A test signal source for generating a test signal simulating the measurement signal of the sensor element is arranged on the semiconductor chip. In the second operating mode, the test signal source is connected or capable of being connected to the input connection of the evaluator.

Abstract: A semiconductor component has at least one semiconductor chip in which an electrical circuit is integrated. The semiconductor chip is surrounded by an electrically insulating encapsulating compound and has on its surface at least one termination surface for a test signal, which is covered by the encapsulating compound. The termination surface is connected in an electrically conductive manner to an analysis contact that projects above the surface of the semiconductor chip, that is located in the interior of the encapsulating compound at a distance from its exterior surface, and that can be exposed by removing a layer of the encapsulating compound located near the exterior.

Abstract: A measuring apparatus for detecting a relative movement between at least one magnetic field sensor array integrated into a semiconductor chip and a transmitter for the sensor array is provided. The transmitter and the sensor array are exposed to the magnetic flux of a magnet. The transmitter has teeth that can be moved past the sensor array during the relative movement, or the transmitter has magnet poles that can be moved past the sensor array during the relative movement. The magnetic field sensor includes a differential magnetic field sensor which comprises a first measuring plate and a second measuring plate that are offset in relation to one another in a direction of the relative movement. The magnetic field sensor also includes a sensor element which is designed to measure the absolute magnetic field and comprises a third measuring plate that is arranged between the first measuring plate and the second measuring plate in the direction of the relative movement.

Abstract: In a method for generating pulse edges, assigned synchronously to the movement of a mechanical part, a magnetic field is generated. At least two measuring signals phase-shifted to one another for the magnetic field are detected. The magnetic field is changed as a function of the movement of the mechanical part in such a way that the measuring signals are modulated. A first measuring signal is compared with at least one first reference value. A second measuring signal is compared with at least one second reference value and/or the value of the first measuring signal is compared with the value of the second measuring signal. When at least one of these comparisons produces an agreement or the result of the relevant comparison changes its sign, a pulse edge is generated.

Abstract: A digital-to-analog converter circuit layout includes a ratiometric digital-to-analog converter. The ratiometric digital-to-analog converter includes a digital data input, a converter voltage output, a voltage controlled oscillator, and a pulse width modulation module. The a digital data input, a converter voltage output, a voltage controlled oscillator, and a pulse width modulation module is configured in a controllable manner for converting digital data received at the input to a converter output voltage at the output using a reference voltage, an adjustable current as a reference current, and an adjustable impedance value. The circuit layout is characterized in that the voltage controlled oscillator includes circuit components which multiply the reference voltage by a quotient between the adjustable impedance value and the adjustable current, and which apply the multiplication results to the pulse width modulation module.

Abstract: A processing device embodied in an integrated circuit may be divided into first and second functional units. A mount for the integrated circuit may be assigned to the first functional unit, which may define the external electrical connections of the processing device. Processing may take place in a second functional unit of the processing device, whose essential connections may normally be accessible from the outside via the external connections of the first functional unit. The processor device having first and second functional units in a mount may be similar to a hybrid circuit but may serve a different purpose. The first functional unit, which may also comprise more than one monolithic integrated circuit, may define the external connections and may make available suitable matching circuits for the second functional unit.

Abstract: A digital-to-analog converter circuit layout includes a ratiometric digital-to-analog converter. The ratiometric digital-to-analog converter includes a digital data input, a converter voltage output, a voltage controlled oscillator, and a pulse width modulation module. The a digital data input, a converter voltage output, a voltage controlled oscillator, and a pulse width modulation module is configured in a controllable manner for converting digital data received at the input to a converter output voltage at the output using a reference voltage, an adjustable current as a reference current, and an adjustable impedance value. The circuit layout is characterized in that the voltage controlled oscillator includes circuit components which multiply the reference voltage by a quotient between the adjustable impedance value and the adjustable current, and which apply the multiplication results to the pulse width modulation module.

Abstract: An integrated circuit for controlling an electric motor, which has a primary component with a coil and a permanently magnetic secondary component cooperatively connected via an air gap to the primary component, has a semiconductor substrate in which are integrated a microcontroller and/or a pre-amplifier for controlling the coil of the electric motor. For detecting the position of the permanently magnetic secondary component, at least two magnetic field sensors with their measurement axes aligned crosswise relative to each other are integrated in the semiconductor substrate.

Abstract: A semiconductor component (has at least one semiconductor chip in which an electrical circuit is integrated. The semiconductor chip is surrounded by an electrically insulating encapsulating compound and has on its surface at least one termination surface for a test signal, which is covered by the encapsulating compound. The termination surface is connected in an electrically conductive manner to an analysis contact that projects above the surface of the semiconductor chip, that is located in the interior of the encapsulating compound at a distance from its exterior surface, and that can be exposed by removing a layer of the encapsulating compound located near the exterior.

Abstract: A semiconductor component on a semiconductor chip comprises at least one sensor element for measuring a physical quantity and an evaluator. The semiconductor component can be switched between a first and a second operating mode. In the first operating mode, the sensor element is sensitive to the physical quantity to be measured and a measurement signal output of the sensor element is connected to an input connection of the evaluator. In the second operating mode, the sensor element is not sensitive to the physical quantity to be measured and/or the signal path between the measurement signal output and the input connection is interrupted. A test signal source for generating a test signal simulating the measurement signal of the sensor element is arranged on the semiconductor chip. In the second operating mode, the test signal source is connected or capable of being connected to the input connection of the evaluator.