Abstract: A cooling system for a power module (or some other power electronics device) is described, the cooling system having a closed flow path for circulating a cooling fluid, the flow path having a pressure that is reduced to below atmospheric pressure. The cooling fluid is circulated along the flow path to provide cooling of the power module. The flow path is delimited from the exterior environment by a space provided between the flow path and the exterior environment, said space being sealed off from the cooling flow path, and said space being sealed off towards the exterior environment. The flow path has a pressure below atmospheric pressure and the space between the flow path and the exterior environment is evacuated and typically has a pressure lower than the pressure in the flow path.

Abstract: The invention provides a fluid cooling system comprising a heat exchanger with an outer wall forming a chamber with an inlet and an outlet for circulating a heat exchange medium in the chamber. The chamber has an opening towards the component which is to be cooled, and to protect the component, the opening is closed by a flexible wall which is attached to the outer wall. To protect the cover and the component against overload, the flexible wall is attached to an inner wall inside the chamber. The cooling system could be applied to electronic systems, e.g. for cooling a DCB substrate or similar electronic components.

Abstract: The invention relates to a cooling device for a plurality of power modules (16), comprising a heat-conducting body (15) through which a coolant flows. The cooling device comprises external cooling ribs (14) on a first housing shell of the body through which a coolant flows for receiving the plurality of power modules adjacent to each other. Each individual cooling rib is aligned to come into fixed heat-conducting contact on at least one upper or lower side of one of the plurality of power modules, and the housing shell, on the inner side in the region of the respective cooling rib(s), comprises means for the fluidic communication with the volume of the coolant in the inside the body through which the coolant flows.

Abstract: A distributor (1) for distributing a flow of cooling fluid over one or more surface(s) (3) to be cooled has a housing (13) that may be manufactured in a single piece together with inlet (8) and outlet (9) manifolds and a plurality of flow cells (26, 27, 28, 29). The flow cells (26, 27, 28, 29) may be connected in parallel between the manifolds (8, 9), and may be adapted to cool multiple surfaces (3) simultaneously. The present invention is also directed to a fluid-coolable unit comprising a distributor (1) for removing heat from an electronic circuit, such as integrated circuit or CPU.

Abstract: The invention relates to a cooling device for a plurality of power modules (16), comprising a heat-conducting body (15) through which a coolant flows. Said cooling device comprises external cooling ribs (14) on a first housing shell of the body through which a coolant flows for receiving the plurality of power modules adjacent to each other. Each individual cooling rib is aligned to come into fixed heat-conducting contact on at least one upper or lower side of one of the plurality of power modules, and the housing shell, on the inner side in the region of the respective cooling rib(s), comprises means for the fluidic communication with the volume of the coolant in the inside the body through which the coolant flows.

Abstract: A flow distribution module (5) for distributing a flow of cooling fluid across a surface. Is adapted to be connected to another at least substantially identical module (5). Makes it possible to provide a cooling unit which may be customized to meet specific cooling needs without requiring special adaptation of the ‘building blocks’. Thereby provides a flexible, yet simple, system. Furthermore a stack of flow distribution modules (5). Provides a very compact cooling unit when cooling is needed for several surfaces, no need for a cooling unit having a large surface area because the modules may be stacked in stead of positioned side-by-side.

Abstract: A flow distribution module (5) for distributing a flow of cooling fluid across a surface. Is adapted to be connected to another at least substantially identical module (5). Makes it possible to provide a cooling unit which may be customized to meet specific cooling needs without requiring special adaptation of the ‘building blocks’. Thereby provides a flexible, yet simple, system. Furthermore a stack of flow distribution modules (5). Provides a very compact cooling unit when cooling is needed for several surfaces, no need for a cooling unit having a large surface area because the modules may be stacked in stead of positioned side-by-side.

Abstract: The invention relates to a power semiconductor module comprising a plurality of power semiconductors that are fixed to a first side of a printed circuit board (26), and a cooling device that acts by means of a coolant, on a second side of the printed circuit board (26), opposite the first side, the cooling device comprising a plurality of cells through which the coolant is guided. The aim of the invention is to minimise the risk of failure of one such power semiconductor module. To this end, a non-cooled region (d, e, f) is arranged between at least two cells.

Abstract: A cooling unit for cooling in particular power semiconductors contains a distributor for guiding liquid across a surface to be cooled. The distributor comprises an inlet manifold (8) and outlet manifold (9), whereby the inlet and outlet manifolds are connected through a flow cell, which has a main flow channel (50). The main channel is formed as a meandering sequence of channel segments (61,62,63,64). It has been found, that the transfer of heat by the liquid in the main flow channel can be improved by introducing a bypass flow channel (71,72,73) which allows the flow of liquid from the cell inlet to the cell outlet, wherein the bypass flow channel interconnects the channel segments of the main flow channel.

Abstract: A liquid-cooled power semiconductor unit has components to be cooled arranged on the upper side of a plate. The bottom side of the plate is cooled by liquid, which is guided along the plate by means of a distributing element, and the liquid inlet and the liquid outlet of the distributing element are preferably arranged perpendicular to the plate. The distributing element is divided into cells, where each cell has a liquid inlet and a liquid outlet perpendicular to the cooled plate, and the distributing element has multiple cells along the plate.

Abstract: A cooling device comprising a heat-conducting cooling plate on the side of the electronic power components to be cooled and a platelike cooling fluid distributing device. The distributing device has cooling fluid outlets on the side facing the cooling plate, said outlets being arranged at a distance from and pointing towards the cooling plate. The distributing device also comprises at least one drain outlet for the cooling fluid. The cooling device comprises a first plate in which outlets and a plurality of drain outlets are evenly distributed and a second plate and a third plate which are superimposed, wherein two plates define a feed channel that is connected to all outlets and a drain channel that is connected to all drain outlets.

Abstract: Process for the production of decorative glass ceramic articles, the design being sunk entirely or partially into the surface of the glass ceramic, wherein the surface, to be decorated, of the not-yet ceramed base glass is connected as the anode of the region of its glass transition temperature Tg up to Tg+100.degree. C. and a current is allowed to flow evoking an alteration of the surface of the base glass, and wherein the current is permitted to flow until the surface has been altered to a desired depth.

Abstract: Large area decorations of glazings, ceramic paint or the like on glass ceramic, glass, ceramic or similar meltable substrates, in particular on glass ceramic cooking plates, are applied by the new method by means of a laser beam which is widened linearly over the entire width of the area to be decorated, as it were in a zone melting method. The linear energy supply zone is advanced at a speed high enough for essentially only the decorating material to be melted on or burnt in but ensuring that the thermal conduction front does not move appreciably into the substrate material.

Abstract: A process is provided for output control and limitation in a heating surface made from glass ceramic or a comparable material, especially a glass ceramic cooking surface. In a heating surface, in which the individual heating zones are each heated with several heating elements, switchable and controllable independent of one another, it is provided according to the invention that all points of the areas essential for a stress case, especially local overheating, are detected by several temperature sensors, independent of one another, which are placed in the area of the heating zone, to switch and to control the individual heating elements, independent of one another so that the output distribution in the heating zone area is largely matched to the locally varying removal of heat.

Abstract: Temperature sensors or temperature sensor arrangements made from glass ceramic and bonding film resistors, suitable especially for control and limitation of output in glass ceramic cooking areas, are distinguished in that thin- and/or thick-film resistors are baked on supports of glass ceramic, for example, in the area of the cooking zone of a glass ceramic cooking surface, and one or more glass ceramic resistances are delimited and bonded there, and the film resistors form parallel and/or iterative circuits with the glass ceramic resistances. By suitable selection of the dimensions as well as the surface resistances and temperature coefficients of the bonding film resistors and the type of sensor circuit (parallel and/or iterative circuit), the temperature resistance characteristic of a sensor circuit can be varied within wide limits, e.g., the temperature area of use of a glass ceramic sensor can be considerably expanded toward low temperatures.

Abstract: A process for detecting and indicating an anomalous thermal stress condition in a heating surface made from glass ceramic or a comparable material, especially a glass ceramic cooking surface, is described, and by one or more temperature sensors, independent of one another, placed in the area of the heating zone the temperature distribution in the heating surface characteristic for a specific anomalous thermal stress condition is determined and is indicated by suitable operating condition indicators and/or optical and/or acoustic warning devices. This has the advantage that harmful operating conditions caused by carelessness can be indicated to the user early and can be specifically eliminated by the user.

Abstract: A cooking panel comprising gas-fired burner units and a continuous cooking surface consisting of glass ceramic or comparable material which is particularly suited for incorporation in kitchen appliances consists of one or two, low-height structural parts in which all main components if the burner units such as combustion chamber, gas mixing chamber, gas mixing means, exhaust gas ducts, warming zones and exhaust gas stack are integrated. These integrated structural parts can be economically manufactured with known wet molding techniques for silicate fiber material--this leading to a weight reduction--and can be built in with a minimum of assembly outlay.

Abstract: A vitreous ceramic cooker hob plate with circumferentially surrounding frame permanently elastically adhesively fitted thereto is provided. The circumferentially surrounding frame is adhesively joined to the hob plate in such a way that a narrow gap is left between the bevelled edge of the frame and the hob plate, and the frame flange overlaps the same. The gap is filled in, flush with the frontal side of the bevelled edge, by a permanently elastic adhesive which makes a sealed and mechanically firm joint between the bevelled edge and the hob plate.

Abstract: Fireproof building element with a multi-sheet glazing unit of glass or glass ceramic characterized in that at least one of the glass sheets is a fire resistant glass sheet. The building element contains one or more high heat reflective foils arranged between the sheets at a distance from the fire resistant glazing unit. The foils can be put in a rolled or folded form between the two sheets of the building element such that the visible area is not covered, and they can, in the event of a fire, be spread out completely between the sheets.

Abstract: A glowing wire type electric lighter or ignition system for a burner assembly in a gas heated stove having a vitreous ceramic cooking plate is provided. The system incorporates a direct warning indication not only that the associated burner assembly is "on" or "off", but also that the heated zone region of the cooking plate over such burner assembly remains too hot to be safely touched after such burner assembly has been switched off until such heated zone region has cooled to a predetermined harmless temperature.