Patents by Inventor Klaus Mueller

Klaus Mueller has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11211843
    Abstract: An electric motor includes a rotor having a rotor shaft part and a first shaft part and a second shaft part. The rotor shaft is situated axially between the first and the second shaft parts. The first shaft part includes a first bearing seat and is connected to the rotor shaft part in a torsionally fixed manner, and the second shaft part includes a second bearing seat and is connected to the rotor shaft part in a torsionally fixed manner.
    Type: Grant
    Filed: July 16, 2018
    Date of Patent: December 28, 2021
    Assignee: SEW-EURODRIVE GMBH & CO. KG
    Inventors: Michael Stark, Klaus Müller, Bernhard Winter
  • Publication number: 20210298636
    Abstract: A mouthpiece for a device for measuring analytes in exhaled air includes a gas path configured to convey exhaled air to the device and a film arranged so as to block the conveying of the exhaled air through the gas path. A system, in one embodiment, includes the mouthpiece and a device configured to measure analytes in the exhaled air. The mouthpiece is configured to be releasably connected to the device. The device includes a pressure sensor and, in one embodiment, a pump configured to pump air via the mouthpiece when connected to the device. The device is configured to be enabled to measure predefined analytes in the exhaled air when a pressure curve measured via the pressure sensor satisfies one or more predefined conditions.
    Type: Application
    Filed: June 1, 2018
    Publication date: September 30, 2021
    Inventors: Stefan Schneider, Markus Thuersam, Frank Barth, Tom Doehring, Klaus Mueller
  • Patent number: 11127602
    Abstract: A method of attaching a semiconductor chip to a lead frame, including A) providing a semiconductor chip, B) applying a solder metal layer sequence on the semiconductor chip, C) providing a lead frame, D) applying a metallization layer sequence on the lead frame, E) applying the semiconductor chip on the lead frame via the solder metal layer sequence and the metallization layer sequence, and F) heating the arrangement produced under E) to attach the semiconductor chip to the lead frame, wherein the solder metal layer sequence includes a first metallic layer including an indium-tin alloy, a barrier layer arranged above the first metallic layer, and a second metallic layer including gold arranged between the barrier layer and the semiconductor chip.
    Type: Grant
    Filed: February 28, 2018
    Date of Patent: September 21, 2021
    Assignee: OSRAM OLED GmbH
    Inventors: Mathias Wendt, Klaus Müller, Laurent Tomasini
  • Publication number: 20210256406
    Abstract: A system and method associated with generating an interactive visualization of causal models used in analytics of data is disclosed. The system performs various operations that include receiving time series data in the analytics of time-based phenomena associated with a data set. The system generates a visual representation to specify an effect associated with a causal relation. A causal hypothesis is determined using at least one of an effect variable and a cause variable associated with the visual representation. Causal events are identified in a new visual representation with a time shift being set. A statistical significance is determined using at least one time window within the new visual representation. An updated visual representation is generated including one or more updated causal models. A corresponding method and computer-readable medium are also disclosed.
    Type: Application
    Filed: July 8, 2019
    Publication date: August 19, 2021
    Inventors: Klaus MUELLER, Jun WANG
  • Patent number: 11094868
    Abstract: A method for producing an illumination device may include providing a plurality of optoelectronic semi-conductor components that each have a semi-conductor layer sequence for generating radiation where the semiconductor components each have at least one contact surface on one side and are held by a common carrier. The method may further include electroplating each contact surface of the semi-conductor components using a solder material, applying the semi-conductor components having the solder material to a substrate, and melting and soldering the contact surfaces onto the surfaces.
    Type: Grant
    Filed: April 10, 2018
    Date of Patent: August 17, 2021
    Assignee: OSRAM OLED GMBH
    Inventors: Klaus Mueller, Holger Klassen
  • Publication number: 20210183800
    Abstract: In an embodiment a method for producing a semiconductor component comprising at least one semiconductor chip mounted on a surface, wherein the semiconductor chip is fixed on the surface by applying a solder compound to an assembling surface of the semiconductor chip, applying a metallic adhesive layer to a side of the solder compound facing away from the assembling surface, preheating the surface to a first temperature T1, bringing the metallic adhesive layer into mechanical contact in a solid state with the preheated surface, the metallic adhesive layer at least partially melting while it is brought into mechanical contact with the preheated surface, and subsequently cooling the surface to room temperature, the semiconductor chip being at least partially metallurgically bonded to the surface, and wherein the semiconductor chip is subsequently soldered to the surface to form a resulting solder connection.
    Type: Application
    Filed: June 3, 2019
    Publication date: June 17, 2021
    Inventors: Klaus Müller, Holger Klassen, Matthias Hofmann
  • Publication number: 20210180501
    Abstract: A catalytic converter for the aftertreatment of exhaust gases from an internal combustion engine, with a first tubular central flow section, with a deflecting device for deflecting the flow direction and with an annular flow section which has at least one catalytically active matrix. The tubular flow section is formed by an inner jacket and the annular flow section is formed by an outer jacket surrounding the inner jacket, wherein the deflecting device is formed by a flat half-shell.
    Type: Application
    Filed: March 2, 2021
    Publication date: June 17, 2021
    Applicant: Vitesco Technologies Germany GMBH
    Inventors: Marat Karibayev, Klaus Müller-Haas
  • Patent number: 10978236
    Abstract: An apparatus for electrically connecting at least four electrical conductors includes a connecting element and at least four shielding pipes, which are each provided for receiving at least one conductor. In order to enable a simple and economical connection, the connecting element forms pipe connection pieces and each connection piece is integrally joined or materially bonded to a respective shielding pipe.
    Type: Grant
    Filed: November 11, 2016
    Date of Patent: April 13, 2021
    Assignee: Siemens Aktiengesellschaft
    Inventors: Jens Hoppe, Karsten Loppach, Klaus Mueller, Johann Schlager, Thomas Wende, Rene Martin Wimmer
  • Publication number: 20210035340
    Abstract: In some embodiments, a method of machine learning includes identifying, by an auto encoder network, a simulator feature based, at least in part, on a received first simulator data set and an emulator feature based, at least in part, on a received first emulator data set. The method further includes determining, by a synthesis control circuitry, a synthesized feature based, at least in part, on the simulator feature and based, at least in part, on the emulator feature; and generating, by the auto encoder network, an intermediate data set based, at least in part, on a second simulator data set and including the synthesized feature. Some embodiments of the method further include determining, by a generative artificial neural network, a synthesized data set based, at least in part, on the intermediate data set and based, at least in part, on an objective function.
    Type: Application
    Filed: February 11, 2019
    Publication date: February 4, 2021
    Applicant: RENSSELAER POLYTECHNIC INSTITUTE
    Inventors: Ge Wang, Daniel David Harrison, Xun Jia, Klaus Mueller
  • Publication number: 20200347123
    Abstract: Disclosed herein are anti-RGMa antibodies and methods of using these antibodies to treat spinal cord injury, including promoting axonal regeneration, functional recovery, or both and to treat pain, including neuropathic pain arising from spinal cord injury.
    Type: Application
    Filed: December 11, 2019
    Publication date: November 5, 2020
    Inventors: Bernhard Klaus MUELLER, Peer B. JACOBSON
  • Publication number: 20200241012
    Abstract: Provided are diagnostic assays and method s of using the diagnostic assays for detecting and quantifying RGMa fragments in a sample. The methods may be used detection of the RGMa fragments to monitoring drug treatment and effectiveness of drug treatment in neurodegenerative diseases.
    Type: Application
    Filed: September 4, 2019
    Publication date: July 30, 2020
    Inventors: Stefan Barghorn, Bernhard Klaus Mueller, Martin Schmidt, Andreas Striebinger
  • Publication number: 20200234976
    Abstract: A method of attaching a semiconductor chip to a lead frame, including A) providing a semiconductor chip, B) applying a solder metal layer sequence on the semiconductor chip, C) providing a lead frame, D) applying a metallization layer sequence on the lead frame, E) applying the semiconductor chip on the lead frame via the solder metal layer sequence and the metallization layer sequence, and F) heating the arrangement produced under E) to attach the semiconductor chip to the lead frame, wherein the solder metal layer sequence includes a first metallic layer including an indium-tin alloy, a barrier layer arranged above the first metallic layer, and a second metallic layer including gold arranged between the barrier layer and the semiconductor chip.
    Type: Application
    Filed: February 28, 2018
    Publication date: July 23, 2020
    Inventors: Mathias Wendt, Klaus Müller, Laurent Tomasini
  • Publication number: 20200211997
    Abstract: A method for fastening a semiconductor chip on a substrate and an electronic component are disclosed. In an embodiment a method includes providing a semiconductor chip, applying a solder metal layer sequence on the semiconductor chip, providing a substrate, applying a metallization layer sequence on the substrate, applying the semiconductor chip on the substrate via the solder metal layer sequence and the metallization layer sequence and heating the applied semiconductor chip on the substrate for fastening the semiconductor chip on the substrate. The solder metal layer may include a first metallic layer comprising an indium-tin alloy, a barrier layer arranged above the first metallic layer and a second metallic layer comprising gold arranged between the barrier layer and the semiconductor chip, wherein an amount of substance of the gold in the second metallic layer is greater than an amount of substance of tin in the first metallic layer.
    Type: Application
    Filed: June 6, 2018
    Publication date: July 2, 2020
    Inventors: Klaus Mueller, Andreas Ploessl, Mathias Wendt
  • Publication number: 20200195082
    Abstract: An electric motor includes a rotor having a rotor shaft part and a first shaft part and a second shaft part. The rotor shaft is situated axially between the first and the second shaft parts. The first shaft part includes a first bearing seat and is connected to the rotor shaft part in a torsionally fixed manner, and the second shaft part includes a second bearing seat and is connected to the rotor shaft part in a torsionally fixed manner.
    Type: Application
    Filed: July 16, 2018
    Publication date: June 18, 2020
    Applicant: SEW-EURODRIVE GMBH & CO. KG
    Inventors: Michael STARK, Klaus MÜLLER, Bernhard WINTER
  • Publication number: 20200127180
    Abstract: A method for producing an illumination device may include providing a plurality of optoelectronic semi-conductor components that each have a semi-conductor layer sequence for generating radiation where the semiconductor components each have at least one contact surface on one side and are held by a common carrier. The method may further include electroplating each contact surface of the semi-conductor components using a solder material, applying the semi-conductor components having the solder material to a substrate, and melting and soldering the contact surfaces onto the surfaces.
    Type: Application
    Filed: April 10, 2018
    Publication date: April 23, 2020
    Inventors: Klaus MUELLER, Holger KLASSEN
  • Patent number: 10603818
    Abstract: The present invention relates to a method for manufacturing a sewage pipe element comprising a plastics lining, the method comprising the following steps: providing a mould 2 for manufacturing the sewage pipe element, comprising a first sleeve 22 and a plastics element 20; introducing a concrete into the mould 2; attaching a second sleeve 28; demoulding the sewage pipe element; the first sleeve 22 being connected to the plastics element 20 and the plastics element 20 being connected to the second sleeve 28 in a fluid-tight manner in each case and forming at least part of the plastics lining.
    Type: Grant
    Filed: June 10, 2015
    Date of Patent: March 31, 2020
    Assignee: BFS BETONFERTIGTEILSYSTEME GMBH
    Inventor: Klaus Müller
  • Patent number: 10465691
    Abstract: A pump unit includes a drive motor (14) and a first housing (2), in which a control electronics unit (18) is arranged for operating the drive motor (14). An operating unit (20) having at least one display or operating element (26, 28, 30) can be detachably connected to the first housing in at least two different positions.
    Type: Grant
    Filed: November 8, 2017
    Date of Patent: November 5, 2019
    Assignee: Grundfos Management a/s
    Inventors: Jan Knedler, Klaus Müller, Karsten Antonius, Matthias Ulmer, Mohammad Mehdi Ayatollahzadeh
  • Patent number: 10376994
    Abstract: The invention relates to a soldering material comprising an alloy that in addition to Sn (tin) as the major constituent, comprises 10 wt. % or less Ag (silver), 10 wt. % or less Bi (bismuth), 10 wt. % or less Sb (antimony) and 3 wt. % or less Cu (copper). Furthermore, the invention relates to a soldering material comprising a plurality of soldering components with such alloy compositions and contents in the soldering material that on fusing the soldering components an alloy is formed that comprises Sn, Ag, Bi, Sb and Cu in the abovementioned alloy contents.
    Type: Grant
    Filed: April 21, 2004
    Date of Patent: August 13, 2019
    Inventors: Hans-Jürgen Albrecht, Klaus Heinrich Georg Bartl, Werner Kruppa, Klaus Müller, Mathias Nowottnick, Gunnar Petzold, Hector Andrew Hamilton Steen, Klaus Wilke, Klaus Wittke
  • Patent number: 10327669
    Abstract: A mouthpiece a device for measuring a parameter of respiratory air. The mouthpiece including an end edge of a wall of the mouthpiece, and the end edge is configured to delimit an opening for blowing respiratory air into the mouthpiece. An opening surface of the opening extends transversely with respect to a flow axis of respiratory air blown into the mouthpiece. A contour of the opening forms a D shape or a lens shape, seen in the direction of the flow axis. The opening is delimited by a first opening portion and by a second opening portion adjoining the first opening portion.
    Type: Grant
    Filed: February 1, 2016
    Date of Patent: June 25, 2019
    Assignee: Robert Bosch GmbH
    Inventors: Daniel Reisinger, Klaus Mueller, Torsten Richter
  • Patent number: 10195763
    Abstract: The present invention relates to a method for manufacturing a canal component which comprises a connection portion 104, 106 designed to come into contact with a component 100, in particular an adjacent canal component, which is to be connected to the canal component 100, the method comprising the following steps: providing a concrete base body, coating the base body with a plasticized plastics material 110 in the region of the connection portion 104, 106 and in the region of an internal wall (108) of the base body facing the canal inner space 106, and curing the plastics material (110).
    Type: Grant
    Filed: April 14, 2014
    Date of Patent: February 5, 2019
    Assignee: BFS BETONFERTIGTEILESYSTEME GMBH
    Inventor: Klaus Müller