Abstract: An extrusion-based additive manufacturing process including the step of selectively depositing a molten thermoplastic material (P) on a film or sheet made from or containing a polymer blend obtained by melt blending a mixture made from or containing: (A) 60% to 98.8% by weight of a polyolefin; (B) 0.1% to 30% by weight of a compatibilizer; (C) 0.05% to 20% by weight of an amino resin; and (D) 0% to 5% by weight of an additive, wherein the amounts of (A), (B), (C) and (D) are based on the total weight of (A)+(B)+(C)+(D).

Abstract: A polymer blend obtained by melt blending a mixture made from or containing: (A) 60% to 98.8% by weight of a polyolefin; (B) 0.1% to 30% by weight of a compatibilizer; (C) 0.05% to 20% by weight of an amino resin; and (D) 0% to 5% by weight of an additive, wherein the amounts of (A), (B), (C), and (D) are based on the total weight of (A)+(B)+(C)+(D), the total weight being 100%.

Abstract: A liquid supply system includes a suction lance (6) configured to be inserted into a liquid container (14) and at least one level sensor (10, 12) fixed on the lance (6) and configured to detect a liquid level (22) inside a liquid container (14). A control device (4) is connected to the level sensor (10, 12) and configured to determine a rate of change of the liquid level (22) detected by the at least one level sensor (10, 12) and to detect a lance removal if the rate of change reaches or exceeds a predefined threshold. A method for detecting the removal of a suction lance (6) from a liquid container (14) is provided.

Abstract: An electric motor includes a rotor having a rotor shaft part and a first shaft part and a second shaft part. The rotor shaft is situated axially between the first and the second shaft parts. The first shaft part includes a first bearing seat and is connected to the rotor shaft part in a torsionally fixed manner, and the second shaft part includes a second bearing seat and is connected to the rotor shaft part in a torsionally fixed manner.

Abstract: A system, for transcutaneous photodynamic therapy in an organ or organ segment of an organic body, includes a plurality of light applicators (9), a supply unit (23) and a placement template (39) placeable relative to the organic body for defined orientation of the light applicators. The light applicators include a needle-shaped insertion portion (15) for transcutaneous piercing along a piercing axis (E), a light-emitting applicator tip (19) at the distal end (13) of the insertion portion, and a fixing point (43) at a proximal distance d from the applicator tip. The placement template defines a plurality of fixing point receptacles (51) for fixing the light applicators with a defined fixing point and includes a first and second template parts (71, 75) defining first and second subsets (73, 77) of fixing point receptacles. The first template part is guidingly displaceable relative to the second template part along the piercing axis.

Abstract: A monitoring method and dosing pump system monitor operation of a dosing pump including a dosing chamber (2), a displacement element (4) and an electric drive (12). A position (S) of the displacement element and a pressure (P) inside the dosing chamber are continuously recorded as a curve in a pressure-stroke diagram. The method includes monitoring at least one characteristic portion (36, 38, 40, 42, B, C) of the curve in the pressure-stroke diagram by detecting a possible shift (A) of the characteristic portion over several strokes. The method further includes one or both of: adjusting a control of the electric drive based on the detected shift; and determining a trend of the shift over several strokes of the displacement element and determining based on the trend whether and/or when the shift will reach a predefined limit. A dosing pump system with the dosing pump execute the method.

Abstract: In an embodiment a method for producing a semiconductor component comprising at least one semiconductor chip mounted on a surface, wherein the semiconductor chip is fixed on the surface by applying a solder compound to an assembling surface of the semiconductor chip, applying a metallic adhesive layer to a side of the solder compound facing away from the assembling surface, preheating the surface to a first temperature T1, bringing the metallic adhesive layer into mechanical contact in a solid state with the preheated surface, the metallic adhesive layer at least partially melting while it is brought into mechanical contact with the preheated surface, and subsequently cooling the surface to room temperature, the semiconductor chip being at least partially metallurgically bonded to the surface, and wherein the semiconductor chip is subsequently soldered to the surface to form a resulting solder connection.

Abstract: The invention relates to a soldering material comprising an alloy that in addition to Sn (tin) as the major constituent, comprises 10 wt. % or less Ag (silver), 10 wt. % or less Bi (bismuth), 10 wt. % or less Sb (antimony) and 3 wt. % or less Cu (copper). Furthermore, the invention relates to a soldering material comprising a plurality of soldering components with such alloy compositions and contents in the soldering material that on fusing the soldering components an alloy is formed that comprises Sn, Ag, Bi, Sb and Cu in the abovementioned alloy contents.

Abstract: An electric motor includes a rotor having a rotor shaft part and a first shaft part and a second shaft part. The rotor shaft is situated axially between the first and the second shaft parts. The first shaft part includes a first bearing seat and is connected to the rotor shaft part in a torsionally fixed manner, and the second shaft part includes a second bearing seat and is connected to the rotor shaft part in a torsionally fixed manner.

Abstract: The invention relates to a soldering material comprising an alloy that in addition to Sn (tin) as the major constituent, comprises 10 wt. % or less Ag (silver), 10 wt. % or less Bi (bismuth), 10 wt. % or less Sb (antimony) and 3 wt. % or less Cu (copper). Furthermore, the invention relates to a soldering material comprising a plurality of soldering components with such alloy compositions and contents in the soldering material that on fusing the soldering components an alloy is formed that comprises Sn, Ag, Bi, Sb and Cu in the abovementioned alloy contents.

Abstract: A liquid supply system includes a suction lance (6) configured to be inserted into a liquid container (14) and at least one level sensor (10, 12) fixed on the lance (6) and configured to detect a liquid level (22) inside a liquid container (14). A control device (4) is connected to the level sensor (10, 12) and configured to determine a rate of change of the liquid level (22) detected by the at least one level sensor (10, 12) and to detect a lance removal if the rate of change reaches or exceeds a predefined threshold. A method for detecting the removal of a suction lance (6) from a liquid container (14) is provided.

Abstract: An electric motor includes a rotor having a rotor shaft part and a first shaft part and a second shaft part. The rotor shaft is situated axially between the first and the second shaft parts. The first shaft part includes a first bearing seat and is connected to the rotor shaft part in a torsionally fixed manner, and the second shaft part includes a second bearing seat and is connected to the rotor shaft part in a torsionally fixed manner.

Abstract: A method of attaching a semiconductor chip to a lead frame, including A) providing a semiconductor chip, B) applying a solder metal layer sequence on the semiconductor chip, C) providing a lead frame, D) applying a metallization layer sequence on the lead frame, E) applying the semiconductor chip on the lead frame via the solder metal layer sequence and the metallization layer sequence, and F) heating the arrangement produced under E) to attach the semiconductor chip to the lead frame, wherein the solder metal layer sequence includes a first metallic layer including an indium-tin alloy, a barrier layer arranged above the first metallic layer, and a second metallic layer including gold arranged between the barrier layer and the semiconductor chip.

Abstract: In an embodiment a method for producing a semiconductor component comprising at least one semiconductor chip mounted on a surface, wherein the semiconductor chip is fixed on the surface by applying a solder compound to an assembling surface of the semiconductor chip, applying a metallic adhesive layer to a side of the solder compound facing away from the assembling surface, preheating the surface to a first temperature T1, bringing the metallic adhesive layer into mechanical contact in a solid state with the preheated surface, the metallic adhesive layer at least partially melting while it is brought into mechanical contact with the preheated surface, and subsequently cooling the surface to room temperature, the semiconductor chip being at least partially metallurgically bonded to the surface, and wherein the semiconductor chip is subsequently soldered to the surface to form a resulting solder connection.

Abstract: A catalytic converter for the aftertreatment of exhaust gases from an internal combustion engine, with a first tubular central flow section, with a deflecting device for deflecting the flow direction and with an annular flow section which has at least one catalytically active matrix. The tubular flow section is formed by an inner jacket and the annular flow section is formed by an outer jacket surrounding the inner jacket, wherein the deflecting device is formed by a flat half-shell.

Abstract: A method of attaching a semiconductor chip to a lead frame, including A) providing a semiconductor chip, B) applying a solder metal layer sequence on the semiconductor chip, C) providing a lead frame, D) applying a metallization layer sequence on the lead frame, E) applying the semiconductor chip on the lead frame via the solder metal layer sequence and the metallization layer sequence, and F) heating the arrangement produced under E) to attach the semiconductor chip to the lead frame, wherein the solder metal layer sequence includes a first metallic layer including an indium-tin alloy, a barrier layer arranged above the first metallic layer, and a second metallic layer including gold arranged between the barrier layer and the semiconductor chip.

Abstract: An electric motor includes a rotor having a rotor shaft part and a first shaft part and a second shaft part. The rotor shaft is situated axially between the first and the second shaft parts. The first shaft part includes a first bearing seat and is connected to the rotor shaft part in a torsionally fixed manner, and the second shaft part includes a second bearing seat and is connected to the rotor shaft part in a torsionally fixed manner.

Abstract: The present invention relates to a method for manufacturing a sewage pipe element comprising a plastics lining, the method comprising the following steps: providing a mould 2 for manufacturing the sewage pipe element, comprising a first sleeve 22 and a plastics element 20; introducing a concrete into the mould 2; attaching a second sleeve 28; demoulding the sewage pipe element; the first sleeve 22 being connected to the plastics element 20 and the plastics element 20 being connected to the second sleeve 28 in a fluid-tight manner in each case and forming at least part of the plastics lining.

Abstract: The invention relates to a soldering material comprising an alloy that in addition to Sn (tin) as the major constituent, comprises 10 wt. % or less Ag (silver), 10 wt. % or less Bi (bismuth), 10 wt. % or less Sb (antimony) and 3 wt. % or less Cu (copper). Furthermore, the invention relates to a soldering material comprising a plurality of soldering components with such alloy compositions and contents in the soldering material that on fusing the soldering components an alloy is formed that comprises Sn, Ag, Bi, Sb and Cu in the abovementioned alloy contents.

Abstract: A pump unit includes a drive motor (14) and a first housing (2), in which a control electronics unit (18) is arranged for operating the drive motor (14). An operating unit (20) having at least one display or operating element (26, 28, 30) can be detachably connected to the first housing in at least two different positions.