Abstract: A system and method for monitoring glitch frequency and energy is disclosed. The system includes a glitch capture module that monitors the voltage of a biased component and captures any glitches that occur. The glitch capture module also extends the duration of that glitch so that the controller is guaranteed to observe this glitch. In certain embodiments, the glitch capture module captures the maximum energy of the glitch by storing the minimum voltage, in terms of magnitude, of the glitch.

Abstract: An improved system and method of measuring the temperature of a workpiece being processed is disclosed. The temperature measurement system determines a temperature of a workpiece by measuring the amount of expansion in the workpiece due to thermal expansion. The amount of expansion may be measured using a number of different techniques. In certain embodiments, a light source and a light sensor are disposed on opposite sides of the workpiece. The total intensity of the signal received by the light sensor may be indicative of the dimension of the workpiece. In another embodiment, an optical micrometer may be used. In another embodiment, a light sensor may be used in conjunction with a separate device that measures the position of the workpiece.

Abstract: A system and method for monitoring glitch frequency and energy is disclosed. The system includes a glitch capture module that monitors the voltage of a biased component and captures any glitches that occur. The glitch capture module also extends the duration of that glitch so that the controller is guaranteed to observe this glitch. In certain embodiments, the glitch capture module captures the maximum energy of the glitch by storing the minimum voltage, in terms of magnitude, of the glitch.

Abstract: An improved system and method of measuring the temperature of a workpiece being processed is disclosed. The temperature measurement system determines a temperature of a workpiece by measuring the amount of expansion in the workpiece due to thermal expansion. The amount of expansion may be measured using a number of different techniques. In certain embodiments, a light source and a light sensor are disposed on opposite sides of the workpiece. The total intensity of the signal received by the light sensor may be indicative of the dimension of the workpiece. In another embodiment, an optical micrometer may be used. In another embodiment, a light sensor may be used in conjunction with a separate device that measures the position of the workpiece.

Abstract: An improved system and method of measuring the temperature of a workpiece being processed is disclosed. The temperature measurement system determines a temperature of a workpiece by measuring the amount of expansion in the workpiece due to thermal expansion. The amount of expansion may be measured using a number of different techniques. In certain embodiments, a light source and a light sensor are disposed on opposite sides of the workpiece. The total intensity of the signal received by the light sensor may be indicative of the dimension of the workpiece. In another embodiment, an optical micrometer may be used. In another embodiment, a light sensor may be used in conjunction with a separate device that measures the position of the workpiece.

Abstract: An improved system and method of measuring the temperature of a workpiece being processed is disclosed. The temperature measurement system determines a temperature of a workpiece by measuring the amount of expansion in the workpiece due to thermal expansion. The amount of expansion may be measured using a number of different techniques. In certain embodiments, a light source and a light sensor are disposed on opposite sides of the workpiece. The total intensity of the signal received by the light sensor may be indicative of the dimension of the workpiece. In another embodiment, an optical micrometer may be used. In another embodiment, a light sensor may be used in conjunction with a separate device that measures the position of the workpiece.

Abstract: The teachings generally relate to a system for converting solar energy into electrical energy and thermal energy using a self-contained system having a plurality of channels for the heat transfer using a respective plurality of fluids.

Abstract: The solar energy converter for generating electric energy and heated fluid comprises a multi-layer assembly, a photovoltaic panel and a manifold assembly. The multi-layer assembly is a casing and comprises N layers separated by at least one separator floor, each layer has at least one channel adapted to contain a fluid stream, and each layer has a first opening and a second opening. The photovoltaic panel has a top surface and a bottom surface, the bottom surface of the photovoltaic panel contacts the multi-layer assembly. The manifold assembly comprises N passages for containing the fluid streams, the Kth passage is adapted to distribute the fluid stream to be heated into the channel of the Kth layer through the corresponding first opening and collect the heated fluid stream from the channel of the Kth layer through the corresponding second opening, wherein N is a positive integer, K is a positive integer less than or equal to N.

Abstract: The teachings generally relate to a system for converting solar energy into electrical energy and thermal energy using a self-contained system having a plurality of channels for the heat transfer using a respective plurality of fluids.

Abstract: An electrostatic chuck is formed using materials that are optically transparent to a range of frequencies, such as infrared radiation. The invention discloses several methods for achieving optical transparency. The chuck electrode can be formed having a mesh pattern designed with a specific open area percentage to provide adequate wafer clamping force while still allowing sufficient levels of infrared radiation to pass through. Alternatively, the chuck electrode can also be made from a transparent conductive film. A workpiece is disposed on one surface of the chuck, and a radiative heat source is positioned on the opposite side of the chuck. A reflector plate may be used to reflect the infrared radiation toward the chuck and the wafer. The spacing of the radiation sources and the shape of the reflector plate may be modified to focus more radiation on a particular portion of the workpiece if desired.

Abstract: Disclosed is a surge protection system for use with an ion source assembly. The system comprises a high voltage power source coupled in series with a thermionic diode and an ion source assembly. The high voltage power supply is enclosed in the pressure tank and drives the ion source assembly. The thermionic diode is comprised of an insulating tube disposed between the ion source assembly enclosure and the output of the high voltage power supply and makes use of existing ion source assembly components to limit damage to the power supply during arc failures of the ion source assembly.

Abstract: A method of forming a FinFET device. The method may include providing a substrate having a single crystalline region, heating the substrate to a substrate temperature effective for dynamically removing implant damage during ion implantation, implanting ions into the substrate while the substrate is maintained at the substrate temperature, and patterning the single crystalline region so as to form a single crystalline fin.

Abstract: An electrostatic chuck is formed using materials that are optically transparent to a range of frequencies, such as infrared radiation. The invention discloses several methods for achieving optical transparency. The chuck electrode can be formed having a mesh pattern designed with a specific open area percentage to provide adequate wafer clamping force while still allowing sufficient levels of infrared radiation to pass through. Alternatively, the chuck electrode can also be made from a transparent conductive film. A workpiece is disposed on one surface of the chuck, and a radiative heat source is positioned on the opposite side of the chuck. A reflector plate may be used to reflect the infrared radiation toward the chuck and the wafer. The spacing of the radiation sources and the shape of the reflector plate may be modified to focus more radiation on a particular portion of the workpiece if desired.

Abstract: An ion implanter includes a platen having a clamping surface configured to support a wafer for treatment with ions, the platen also having at least one pair of electrodes under the clamping surface, a clamping power supply configured to provide an AC signal to the at least one pair of electrodes and a sensed signal representative of the AC signal, and a controller. The controller is configured to receive the sensed signal from the clamping power supply when no wafer is clamped to the clamping surface. The controller is further configured to monitor the sensed signal and determine if the sensed signal is representative of deposits on the clamping surface exceeding a predetermined deposit threshold.

Abstract: A method of forming a FinFET device. The method may include providing a substrate having a single crystalline region, heating the substrate to a substrate temperature effective for dynamically removing implant damage during ion implantation, implanting ions into the substrate while the substrate is maintained at the substrate temperature, and patterning the single crystalline region so as to form a single crystalline fin.

Abstract: An electrostatic clamp, which more effectively removes built up charge from a substrate prior to and during removal, is disclosed. Currently, the lift pins and ground pins are the only mechanisms used to remove charge from the substrate after implantation. The present discloses describes a clamp having one of more additional low resistance paths to ground. These additional conduits allow built up charge to be dissipated prior to and during the removal of the substrate from the clamp. By providing sufficient charge drainage from the backside surface of the substrate 114, the problem whereby the substrate sticks to the clamp can be reduced. This results in a corresponding reduction in substrate breakage.

Abstract: The present invention discloses a method for converting solar energy, comprises the following step of: providing a photovoltaic panel comprising a plurality of photovoltaic cells for gathering solar energy and converting the incident solar energy into electric energy; providing a multi-layer assembly comprising N layers, each layer adapted to contain a fluid stream; distributing the fluid streams to be heated into the N layers; rising temperature of the fluid streams within each layer of the multi-layer assembly by the heating of the multi-layer assembly and the photovoltaic panel; and collecting the heated fluid stream from the N layers; wherein N is a positive integer.

Abstract: Disclosed is a surge protection system for use with an ion source assembly. The system comprises a high voltage power source coupled in series with a thermionic diode and an ion source assembly. The high voltage power supply is enclosed in the pressure tank and drives the ion source assembly. The thermionic diode is comprised of an insulating tube disposed between the ion source assembly enclosure and the output of the high voltage power supply and makes use of existing ion source assembly components to limit damage to the power supply during arc failures of the ion source assembly.

Abstract: The teachings generally relate to a system for converting solar energy into electrical energy and thermal energy using a self-contained system having a plurality of channels for the heat transfer using a respective plurality of fluids.

Abstract: The solar energy converter for generating electric energy and heated fluid comprises a multi-layer assembly, a photovoltaic panel and a manifold assembly. The multi-layer assembly is a casing and comprises N layers separated by at least one separator floor, each layer has at least one channel adapted to contain a fluid stream, and each layer has a first opening and a second opening. The photovoltaic panel has a top surface and a bottom surface, the bottom surface of the photovoltaic panel contacts the multi-layer assembly. The manifold assembly comprises N passages for containing the fluid streams, the Kth passage is adapted to distribute the fluid stream to be heated into the channel of the Kth layer through the corresponding first opening and collect the heated fluid stream from the channel of the Kth layer through the corresponding second opening, wherein N is a positive integer, K is a positive integer less than or equal to N.