Patents by Inventor Klaus Sauter

Klaus Sauter has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Microelectronic package with an attachment layer including spacer elements
    Patent number: 6740982
    Abstract: A microelectronic package includes a microelectronic component, such as a sensor component, attached to a substrate by an attachment layer of an adhesive, in which approximately spherical spacer elements are dispersed. The nominal diameter of the spacer elements corresponds to a specified stand-off distance between the mounting surface of the electronic component and the substrate. The spacer elements are made of a plastic material having a coefficient of thermal expansion that approximates the coefficient of expansion of the adhesive (e.g. the expansion coefficient of the adhesive is no more than 10 times the expansion coefficient of the plastic material of the spacer elements). When temperature changes occur, the spacer elements do not rigidly maintain the stand-off distance and so lead to distortion, but instead absorb at least a small amount of the arising strain by elastically deforming.
    Type: Grant
    Filed: October 30, 2001
    Date of Patent: May 25, 2004
    Assignee: Conti Temic microelectronic GmbH
    Inventors: Klaus Sauter, Joerg Mahrle
  • Microelectronic package with an attachment layer including spacer elements
    Publication number: 20020063321
    Abstract: A microelectronic package includes a microelectronic component, such as a sensor component, attached to a substrate by an attachment layer of an adhesive, in which approximately spherical spacer elements are dispersed. The nominal diameter of the spacer elements corresponds to a specified stand-off distance between the mounting surface of the electronic component and the substrate. The spacer elements are made of a plastic material having a coefficient of thermal expansion that approximates the coefficient of expansion of the adhesive (e.g. the expansion coefficient of the adhesive is no more than 10 times the expansion coefficient of the plastic material of the spacer elements). When temperature changes occur, the spacer elements do not rigidly maintain the stand-off distance and so lead to distortion, but instead absorb at least a small amount of the arising strain by elastically deforming.
    Type: Application
    Filed: October 30, 2001
    Publication date: May 30, 2002
    Applicant: Conti Temic Microelectronic GmbH
    Inventors: Klaus Sauter, Joerg Mahrle