Abstract: The present disclosure provides compositions, articles, and methods related to altering electromagnetic radiation. An actinic radiation curable precursor composition of a three-dimensional article includes a) a resin comprising an actinic radiation curable component, wherein the resin has a viscosity no greater than 500 cP; b) hollow glass microspheres having a density no greater than 2 g/mL and an average diameter no greater than 200 micrometers; and c) a photoinitiator. At least part of the surface of the hollow glass microspheres comprises a surface coating or modification. An article includes a photo(co)polymerization reaction product of the composition. A method of manufacturing a three-dimensional article includes the steps of a) providing an actinic radiation curable precursor composition; and b) selectively exposing a portion of the composition to a source of actinic radiation to at least partially cure the exposed portion of the composition, thereby forming a cured layer.

Abstract: An electrical enclosure including a housing having a plurality of side walls and a base, a housing cover positioned over, and secured to, the housing, a circuit board positioned between the housing and the housing cover, a plurality of connectors extending through the housing cover and the circuit board and into the housing, the plurality of connectors securing the housing cover and the circuit board to the housing, a first protrusion extending inwardly from a first side wall of the housing, and a second protrusion extending inwardly from a second side wall of the housing.

Abstract: A double-threaded connector or spacer according may be self-threading such that insertion into a mounting hole in a PCB will cause the interior of the mounting hole to become threaded to match the double-threaded connector or spacer. The double- threaded connector or spacer installed in a mounting hole of a carrier. A “half circle” portion of daughter card is held in place between the double-threaded connector or spacer and screw. The half circle portion of the daughter card is plated to make electrical contact with the double-threaded connector or spacer, for example, to allow for grounding of the daughter card via the carrier, e.g., PCB.

Abstract: A housing design and method of providing electromagnetic compatibility (EMC) by mitigating a slot antenna in a corner region of a housing, the corner profile including an electrically conductive insert that has a spring bias, such as a spring or coated plastic member, in a corner of the housing.

Abstract: Disclosed herein are apparatuses and methods for the cooling of electronic components of a COM-Express module using an adapter module to become VITA-59 compliant module. The adapter module operatively and thermally couple to a modular computing device, e.g., the COM-Express compliant module, configured with a conduction-cooled plate to provide an additional path for conducting thermal energy generated from integrated circuit components located on the modular computing device. The adapter module includes dimensions and thicknesses to form a spatial gap between an assembled system having the adapter module, the cooling plate, and the modular computing device and a cooling surface of an external heat sink to which the assembled system couples. The spatial gap relative to the cooling plate provides clearance for the adapter module to elastically deform such that the surfaces of the assembly contacts the heat sink when the assembled system is coupled thereto.

Abstract: Disclosed herein are apparatuses and methods for the cooling of electronic components of a COM-Express module using an adapter module to become VITA-59 compliant module. The adapter module operatively and thermally couple to a modular computing device, e.g., the COM-Express compliant module, configured with a conduction-cooled plate to provide an additional path for conducting thermal energy generated from integrated circuit components located on the modular computing device. The adapter module includes dimensions and thicknesses to form a spatial gap between an assembled system having the adapter module, the cooling plate, and the modular computing device and a cooling surface of an external heat sink to which the assembled system couples. The spatial gap relative to the cooling plate provides clearance for the adapter module to elastically deform such that the surfaces of the assembly contacts the heat sink when the assembled system is coupled thereto.

Abstract: The present invention relates to a cooling device improving the heat transfer between a chip (2) having a semiconducting substrate (3) and a heat sink (7). The gap between a surface (11) of the chip (2) to be cooled and a surface (12) of the heat sink (7), the width of which depends on production tolerances of the elements and soldered connections, is formed as a wedge shape by an angled lower surface (12) of the heat sink, in order to create a wedge-shaped gap. A wedge element (17) having the same wedge angle as the wedge-shaped gap is inserted into said gap exactly far enough that it makes flat contact with both the chip surface (11) to be cooled and the heat sink surface (12). Dimensional deviations are thus compensated for, the use of gap fillers is avoided, and the heat transfer from the heat source to the heat sink is improved.

Abstract: The present invention relates to a cooling device improving the heat transfer between a chip (2) having a semiconducting substrate (3) and a heat sink (7). The gap between a surface (11) of the chip (2) to be cooled and a surface (12) of the heat sink (7), the width of which depends on production tolerances of the elements and soldered connections, is formed as a wedge shape by an angled lower surface (12) of the heat sink, in order to create a wedge-shaped gap. A wedge element (17) having the same wedge angle as the wedge-shaped gap is inserted into said gap exactly far enough that it makes flat contact with both the chip surface (11) to be cooled and the heat sink surface (12). Dimensional deviations are thus compensated for, the use of gap fillers is avoided, and the heat transfer from the heat source to the heat sink is improved.

Abstract: In a process for industrial fractionation of polymers using an extraction column and a homogeneous extraction agent a homogeneous feed is supplied to a region of the extraction column which is nearer the upper end thereof when the feed has a greater density than the extraction agent and which is nearer the lower end thereof when the feed has a lower density than the extraction agent. An apparatus for carrying out this process consists advantageously, instead of a pulsed sieve plate column as hitherto, of an unpulsed filling body column which leads to a better separation because a back mixing is avoided in favourable manner.